JPS6159273A - Probing method to double-sided element mount printed circuit board - Google Patents

Probing method to double-sided element mount printed circuit board

Info

Publication number
JPS6159273A
JPS6159273A JP59181924A JP18192484A JPS6159273A JP S6159273 A JPS6159273 A JP S6159273A JP 59181924 A JP59181924 A JP 59181924A JP 18192484 A JP18192484 A JP 18192484A JP S6159273 A JPS6159273 A JP S6159273A
Authority
JP
Japan
Prior art keywords
probing
printed circuit
probe
circuit board
elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP59181924A
Other languages
Japanese (ja)
Inventor
Masashi Takada
高田 正志
Toshiyuki Nakada
敏幸 中田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP59181924A priority Critical patent/JPS6159273A/en
Publication of JPS6159273A publication Critical patent/JPS6159273A/en
Pending legal-status Critical Current

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  • Tests Of Electronic Circuits (AREA)

Abstract

PURPOSE:To enable probing without generating the warpage of a printed circuit board, by probing two elements on both surfaces of the printed circuit board by confirming pressing force from both surfaces of the printed circuit board by a sensor. CONSTITUTION:The table 10 of an element selection and positional determination mechanism 8 is moved with respect to the element 3 on one surface of a printed circuit board 2 to perform the positional alignment of a probe 6 and the lead wire 4 of the element 3. Next, a press motor 9 is driven to temporarily contact the probe 6 with the lead wire 4 of the element 3 and this contact state is confirmed by a pressure sensor 13. The same operation is also performed in the other surface side of said board 2 to temporarily contact a probe 6' and the lead wire 4' of an element 3'. Subsequently, press motors 9, 9' are synchronously operated by the signal from a control unit 14 to simultaneously press probe heads 7, 7'. Pressing forces at this time are detected by pressure sensors 13, 13' and the signals thereof are fed back to set pressing forces necessary for probing, and the probes 6, 6' and the elements 3, 3' are certainly brought to an electrical continuity state. Therefore, the electric tests of the elements 3, 3' are enabled without warping the printed circuit board.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、両面に素子が実装されているプリント板の電
気試験のためのプロービィング方法に関し、詳しくはプ
リント板両面の素子を同時にプロービイングする方法に
関するものである。
[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a probing method for electrical testing of a printed board with elements mounted on both sides, and more specifically, a probing method for simultaneously probing elements on both sides of the printed board. It is about the method.

プリント板の電気試験を行う場合に、プリント板に実装
されている素子のリード線に針状のプローブを突き当て
て電気的に導通させ、素子の特性を種々の機器により調
べる方法がある。この場合に、一般には素子の周囲の多
数のリード線に同じ本数のプローブを同時に突き当てて
1度に試験するため、プローブの本数が多(、このプロ
ーブのそれぞれをリード線に適確に突き当てて接続不良
を生じないようにプロービイングすることが重要である
。このため、プローブをリード線に突き当てる場合は、
加圧シリンダによる空気圧やモーータの送りにより高い
加圧力を付与するようになっている。
When electrically testing a printed board, there is a method in which a needle-like probe is brought into contact with the lead wire of an element mounted on the printed board to establish electrical continuity, and the characteristics of the element are examined using various instruments. In this case, since the same number of probes are generally tested at the same time by simultaneously hitting many lead wires around the device, the number of probes is large (and it is difficult to properly hit each of these probes to the lead wires). It is important to probe so that the probe does not touch the lead wire and cause a connection failure.For this reason, when touching the probe to the lead wire,
A high pressurizing force is applied by air pressure from a pressurizing cylinder and feeding by a motor.

〔従来の技術〕[Conventional technology]

そこで、従来片面に素子が実装されたプリント板の素子
単位のプロービィングにおいては、ブロービイフグ時の
高い加圧力により基板が反るのを防ぐため、基板の反対
面に反り防止の支柱(バンクアッププレート)をたてて
いる。
Therefore, in conventional probing for each element of a printed circuit board with elements mounted on one side, in order to prevent the board from warping due to the high pressure applied during blow-by blowing, a support post (bank up plate) is installed on the opposite side of the board to prevent warping. is standing.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

ところで、上記方法は基板の片面にしか素子が実装され
ていないために行い得るものであり、両面実装のプリン
ト板に対してはプロービィング側と反対面にも素子が存
在することから、反り防止の支柱を効果的にたてること
が困難である。また、支えができたとしても、上記プロ
ービィング方法では片面づつしか試験できないため、プ
リント板を反転し且つプロービィングをセットし直すこ
とを要し、作業能率が悪いという問題がある。
By the way, the above method can be carried out because the elements are mounted only on one side of the board, and since there are elements on the opposite side of the probing side for double-sided printed boards, it is difficult to prevent warpage. It is difficult to erect pillars effectively. Furthermore, even if support is provided, the above-mentioned probing method can only test one side at a time, requiring the printed board to be turned over and the probing to be reset, resulting in a problem of poor work efficiency.

〔問題点を解決するための手段〕[Means for solving problems]

本発明は、上記問題点に鑑み、両面に実装された素子単
位のプロービィングを基板に損傷を与えることなく行い
、且つ試験時間を短縮させるようにした両面素子実装プ
リント板へのプロービィング方法を提供することを目的
とするもので、その手段は、プローブヘッドに素子選択
位置決め機構、プロービィングのための駆動源、素子リ
ード線にプローブを突き当てたプロービィング状態を直
接検出する圧力センサを備えた2組のプロービィングユ
ニットを有し、固定保持されたプリント板の基板の両面
の対向配置された2つの素子に、上記各組のプロービィ
ングユニソトにより同時に対向してプロービィングを行
う両面素子実装プリント板へのプロービィング方法によ
ってなされ′るつ〔作用〕 上記プロービィング方法は、基板の両面側に設けられる
2組のプロービィングユニットにより両面の2素子を同
時にプロービイングすることで、基板の反りを防ぎ、且
つこの状態で2素子の試験を行うことが可能になるので
あり、各ユニットの圧力センサによりブロービイフグ時
のリード線とプローブの接触及び必要な加圧動作を適確
に行い得るものである。
In view of the above-mentioned problems, the present invention provides a method for probing a printed board with elements mounted on both sides, which performs probing for each element mounted on both sides without damaging the board, and shortens the test time. The purpose of this is to use two sets of probe heads equipped with an element selection and positioning mechanism, a driving source for probing, and a pressure sensor that directly detects the probing state when the probe is brought into contact with the element lead wire. A double-sided element-mounted printed board that has a probing unit and probes two opposing elements on both sides of a fixedly held printed board board by simultaneously facing each other using each set of probing units. The above probing method prevents warpage of the board by simultaneously probing two elements on both sides using two probing units provided on both sides of the board. In addition, it is possible to test two elements in this state, and the pressure sensor of each unit can accurately perform the contact between the lead wire and the probe during blow-by blowing and the necessary pressurizing operation.

〔実施例〕〔Example〕

以下、図面を参照して本発明の方法の実施に適した実施
例について説明する。
Embodiments suitable for carrying out the method of the present invention will be described below with reference to the drawings.

先ず、第2図(a)、  (b)において本発明が適用
される両面素子実装プリント板について説明すると、符
号1はプリント板であり、板状の基板2の一方の面2a
に素子3がリード線4により搭載し且つ回路接続して実
装されており、他方の面2bにおいて素子3の反対側に
同様に素子3′がリード線4′により実装されている。
First, in FIGS. 2(a) and 2(b), a double-sided element-mounted printed board to which the present invention is applied will be explained. Reference numeral 1 denotes a printed board, and one surface 2a of a plate-shaped board 2
Element 3 is mounted and circuit-connected using lead wires 4, and element 3' is similarly mounted on the opposite side of element 3 on the other surface 2b using lead wires 4'.

第1図において、全体の構成について説明すると、垂直
に固定保持されたプリント板1の基板2を挟んでその両
側に2組のプロービィングユニット5.5’が配置され
ている。このユニット5は複数本の針状プローブ6を有
するプローブヘッド7に素子選択位置決め機構8と、プ
ロービィングのための駆動源として加圧用モータ9を具
備している。機構8は上下のY方向及び前後のZ方向に
移動するテーブル10を有し、このテーブル10上にプ
ローブヘッド7を備えたスライダ11が左右のX方向に
移動可能に載置されて成る。そして、加圧用モータ9は
テーブル10に取付けられ、加圧用モータ9からのボー
ルネジ12がスライダ11に螺合してその送りにより加
圧力を付与するようになっている。また、スライダ11
とプローブヘッド7のプローブ6と反対側の間には圧力
センサ13が設けてあり、プローブ6を素子リード%’
i 4に突き当てたプロービィング状態を直接検出して
いる。
In FIG. 1, the overall configuration will be described. Two sets of probing units 5.5' are arranged on both sides of a substrate 2 of a printed board 1 which is fixed and held vertically. This unit 5 includes a probe head 7 having a plurality of needle probes 6, an element selection and positioning mechanism 8, and a pressurizing motor 9 as a driving source for probing. The mechanism 8 has a table 10 that moves in the vertical Y direction and the front and back Z direction, and a slider 11 equipped with a probe head 7 is placed on the table 10 so as to be movable in the left and right X directions. The pressurizing motor 9 is attached to the table 10, and a ball screw 12 from the pressurizing motor 9 is screwed onto the slider 11 so that pressurizing force is applied by feeding the slider 11. Also, slider 11
A pressure sensor 13 is provided between the probe 6 and the opposite side of the probe head 7, and the probe 6 is connected to the element lead %'.
The probing state that hits i4 is directly detected.

他のユニット5′も全く同様に構成されているので説明
は省略するが、ユニット5と対応する部分を図中におい
て同一符号にダッシュを付す。
Since the other units 5' are constructed in exactly the same way, their explanations will be omitted, but portions corresponding to those of the unit 5 are denoted by the same reference numerals with dashes in the drawings.

そして、各圧力センサ13.13’は制御ユニ・ノド1
4を介して加圧用モータ9.9′に回路構成されている
Each pressure sensor 13, 13' is connected to the control unit node 1.
The circuit is connected to a pressurizing motor 9.9' via 4.

次いで、上記構成の作用について説明すると、固定保持
されている基板2の一方の面2aの所望の素子3に対し
、ユニット5における素子選択位置決め機構8のテーブ
ル10を移動してプローブヘッド7のプローブ6と素子
3のリード綿4との位置合わせを行う。次に、加圧用モ
ータ9を駆動してプローブヘッド7と共にスライダ11
を移動しプローブ6の先端を素子リード線4に軽く突き
当てて仮接触させ、これを圧力センサ13により確認す
る。一方、他のユニット5′においても基板2の他方の
面2bにおける素子3と反対側の素子3′に対し、同様
の動作を同期又は各別に行う。
Next, to explain the operation of the above configuration, the table 10 of the element selection and positioning mechanism 8 in the unit 5 is moved to a desired element 3 on one surface 2a of the substrate 2 that is fixedly held, and the probe of the probe head 7 is moved. 6 and the lead cotton 4 of the element 3 are aligned. Next, the pressure motor 9 is driven to move the slider 11 along with the probe head 7.
is moved, and the tip of the probe 6 is lightly butted against the element lead wire 4 to make temporary contact, and this is confirmed by the pressure sensor 13. On the other hand, in other units 5', similar operations are performed simultaneously or separately for the elements 3' on the other side 2b of the substrate 2 on the side opposite to the element 3.

こうして、2組のプロービィングユニット5,5′の各
プローブ6.6′が共に素子リード線4゜4′に仮接触
した後に、制御ユニット14からの信号により左右の加
圧用モーフ9.9′を同期運転してプローブヘッド7.
7′を同時に対向して加圧動作する。そして、このとき
の加圧力を圧力センサ9,9′で検出してその信号をフ
ィードバックすることにより、プロービィングに必要な
加圧力に設定して電気的に確実に導通させ、この状態で
2つの素子3,3′の電気試験を一緒に行うのである。
In this way, after each probe 6.6' of the two sets of probing units 5, 5' temporarily contacts the element lead wire 4°4', the left and right pressurizing morphs 9.9 are activated by a signal from the control unit 14. ′ in synchronized operation and probe head 7.
7' are simultaneously pressed against each other. Then, by detecting the pressurizing force at this time with the pressure sensors 9 and 9' and feeding back the signal, the pressurizing force necessary for probing is set to ensure electrical continuity, and in this state, the two elements Electrical tests 3 and 3' are conducted together.

以上、基板両面の一組の素子に対する作用について述べ
たが、同様の作用を他の組の素子にも繰返えして行うこ
とにより、すべての素子のプロービィングテストを行い
得る。
The above has described the action on one set of elements on both sides of the substrate, but by repeating the same action on other sets of elements, a probing test can be performed on all the elements.

プロービイングする際の基板2は上記実施例のように垂
直にのみ固定保持させる必要はないが、水平にした場合
は自重等を考慮して加圧力を均一化させることが要求さ
れる。
The substrate 2 during probing does not need to be fixed and held only vertically as in the above embodiment, but if it is held horizontally, it is required to equalize the pressing force by taking into account its own weight and the like.

〔発明の効果〕〔Effect of the invention〕

以上の説明から明らかなように、本発明によれば、両面
素子実装プリント板へのプロービィングにおいて、両面
の対向配置された2素子を選択してそこに同時にプロー
ビイングするので、基板を反らせることなく適確なプロ
ービィングを行い得る。支柱等の反り防止が全く不要に
なって実施が容易である。2素子間時に試験を行い得る
ので、試験時間が短縮する。更に、圧力センサによりブ
ロービイフグ時のプローブと素子リード線の突き当てを
直接検出し、且つ加圧動作中の加圧力を検出してフィー
ドバック制御するので、加圧を最適に行い得る。
As is clear from the above description, according to the present invention, when probing a double-sided element-mounted printed board, two elements placed opposite each other on both sides are selected and probed there simultaneously, without warping the board. Accurate probing can be performed. It is easy to implement as there is no need to prevent warpage of the support columns or the like. Since the test can be performed between two elements, the test time is shortened. Further, since the pressure sensor directly detects the contact between the probe and the element lead wire during blowing, and also detects the pressing force during the pressurizing operation and performs feedback control, pressurizing can be performed optimally.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の方法に適した一実施例を示す側面図、
第2図(a)、  (b)は本発明が適用される両面素
子実装プリント板の一例を示す側面図と斜視図である。 図中、1はプリント板、 2は基板、 3゜3′は素子
、  4,4′はリード線、  5,5′はプロービィ
ングユニット、 6.6’はプローブ、 7.7′はプ
ローブヘッド、 8.8′は素子選択位置決め機構、 
9.9′は加圧用モータ、  13.13’は圧力セン
サ、 をそれぞれ示す。
FIG. 1 is a side view showing an embodiment suitable for the method of the present invention;
FIGS. 2(a) and 2(b) are a side view and a perspective view showing an example of a double-sided element-mounted printed board to which the present invention is applied. In the figure, 1 is a printed board, 2 is a substrate, 3°3' is an element, 4 and 4' are lead wires, 5 and 5' are probing units, 6.6' is a probe, and 7.7' is a probe. Head, 8.8' is element selection positioning mechanism,
9.9' is a pressurizing motor, and 13.13' is a pressure sensor.

Claims (1)

【特許請求の範囲】[Claims] プローブヘッドに素子選択位置決め機構、プロービィン
グのための駆動源、素子リード線にプローブを突き当て
たプロービィング状態を直接検出する圧力センサを備え
た2組のプロービィングユニットを有し、固定保持され
たプリント板の基板の両面の対向配置された2つの素子
に、上記各組のプロービィングユニットにより同時に対
向してプロービィングを行うことを特徴とする両面素子
実装プリント板へのプロービィング方法。
The probe head has two probing units equipped with an element selection and positioning mechanism, a driving source for probing, and a pressure sensor that directly detects the probing state when the probe is pressed against the element lead wire, and is held fixed. A method for probing a double-sided element-mounted printed board, characterized in that two opposing elements on both sides of a printed board are simultaneously probed by each set of probing units.
JP59181924A 1984-08-31 1984-08-31 Probing method to double-sided element mount printed circuit board Pending JPS6159273A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59181924A JPS6159273A (en) 1984-08-31 1984-08-31 Probing method to double-sided element mount printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59181924A JPS6159273A (en) 1984-08-31 1984-08-31 Probing method to double-sided element mount printed circuit board

Publications (1)

Publication Number Publication Date
JPS6159273A true JPS6159273A (en) 1986-03-26

Family

ID=16109282

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59181924A Pending JPS6159273A (en) 1984-08-31 1984-08-31 Probing method to double-sided element mount printed circuit board

Country Status (1)

Country Link
JP (1) JPS6159273A (en)

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