JPS6158977B2 - - Google Patents

Info

Publication number
JPS6158977B2
JPS6158977B2 JP56052801A JP5280181A JPS6158977B2 JP S6158977 B2 JPS6158977 B2 JP S6158977B2 JP 56052801 A JP56052801 A JP 56052801A JP 5280181 A JP5280181 A JP 5280181A JP S6158977 B2 JPS6158977 B2 JP S6158977B2
Authority
JP
Japan
Prior art keywords
wire
bonding
length
ultrasonic
resonance range
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56052801A
Other languages
English (en)
Japanese (ja)
Other versions
JPS57167646A (en
Inventor
Nobuhito Yamazaki
Takeshi Hasegawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP56052801A priority Critical patent/JPS57167646A/ja
Publication of JPS57167646A publication Critical patent/JPS57167646A/ja
Publication of JPS6158977B2 publication Critical patent/JPS6158977B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8512—Aligning
    • H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852—Applying energy for connecting
    • H01L2224/85201—Compression bonding
    • H01L2224/85205—Ultrasonic bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP56052801A 1981-04-08 1981-04-08 Ultrasonic wire bonding method Granted JPS57167646A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56052801A JPS57167646A (en) 1981-04-08 1981-04-08 Ultrasonic wire bonding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56052801A JPS57167646A (en) 1981-04-08 1981-04-08 Ultrasonic wire bonding method

Publications (2)

Publication Number Publication Date
JPS57167646A JPS57167646A (en) 1982-10-15
JPS6158977B2 true JPS6158977B2 (US06168776-20010102-C00028.png) 1986-12-13

Family

ID=12924940

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56052801A Granted JPS57167646A (en) 1981-04-08 1981-04-08 Ultrasonic wire bonding method

Country Status (1)

Country Link
JP (1) JPS57167646A (US06168776-20010102-C00028.png)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6182774U (US06168776-20010102-C00028.png) * 1984-10-31 1986-05-31
JPH04104276U (ja) * 1991-02-14 1992-09-08 大谷櫻井鐵工株式会社 フエルール

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6182774U (US06168776-20010102-C00028.png) * 1984-10-31 1986-05-31
JPH04104276U (ja) * 1991-02-14 1992-09-08 大谷櫻井鐵工株式会社 フエルール

Also Published As

Publication number Publication date
JPS57167646A (en) 1982-10-15

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