JPS6158536B2 - - Google Patents
Info
- Publication number
- JPS6158536B2 JPS6158536B2 JP58043073A JP4307383A JPS6158536B2 JP S6158536 B2 JPS6158536 B2 JP S6158536B2 JP 58043073 A JP58043073 A JP 58043073A JP 4307383 A JP4307383 A JP 4307383A JP S6158536 B2 JPS6158536 B2 JP S6158536B2
- Authority
- JP
- Japan
- Prior art keywords
- weight
- less
- alloy
- content
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000010949 copper Substances 0.000 claims description 11
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 7
- 239000012535 impurity Substances 0.000 claims description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 4
- 229910052760 oxygen Inorganic materials 0.000 claims description 4
- 239000001301 oxygen Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 description 15
- 229910045601 alloy Inorganic materials 0.000 description 12
- 239000000956 alloy Substances 0.000 description 12
- 229910052802 copper Inorganic materials 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 229910000906 Bronze Inorganic materials 0.000 description 6
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 6
- 239000010974 bronze Substances 0.000 description 6
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 6
- 238000007747 plating Methods 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 229910000990 Ni alloy Inorganic materials 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000005097 cold rolling Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005098 hot rolling Methods 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Landscapes
- Conductive Materials (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4307383A JPS59170231A (ja) | 1983-03-17 | 1983-03-17 | 高力導電銅合金 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4307383A JPS59170231A (ja) | 1983-03-17 | 1983-03-17 | 高力導電銅合金 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59170231A JPS59170231A (ja) | 1984-09-26 |
JPS6158536B2 true JPS6158536B2 (US20090163788A1-20090625-C00002.png) | 1986-12-12 |
Family
ID=12653670
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4307383A Granted JPS59170231A (ja) | 1983-03-17 | 1983-03-17 | 高力導電銅合金 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59170231A (US20090163788A1-20090625-C00002.png) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0346726U (US20090163788A1-20090625-C00002.png) * | 1989-09-05 | 1991-04-30 | ||
JPH0523933Y2 (US20090163788A1-20090625-C00002.png) * | 1988-03-15 | 1993-06-18 | ||
WO2014143614A1 (en) | 2013-03-11 | 2014-09-18 | Jan Remmereit | Lipid compositions containing bioactive fatty acids |
US10993925B2 (en) | 2015-09-18 | 2021-05-04 | Sciadonics, Inc. | Lipid formulations containing bioactive fatty acids |
US11058656B2 (en) | 2015-11-25 | 2021-07-13 | Sciadonics, Inc. | Lipid formulations containing bioactive fatty acids |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60174841A (ja) * | 1984-02-21 | 1985-09-09 | Furukawa Electric Co Ltd:The | 電子電気機器用リン青銅 |
JP2516623B2 (ja) * | 1986-04-10 | 1996-07-24 | 古河電気工業株式会社 | 電子電気機器用銅合金とその製造法 |
USRE35624E (en) * | 1990-01-05 | 1997-10-07 | Kiilunen; David D. | Wires made of copper-based alloy compositions |
US5100617A (en) * | 1990-01-05 | 1992-03-31 | Midwest Thermal Spray Inc. | Wires made of copper-based alloy compositions |
US5236662A (en) * | 1990-01-05 | 1993-08-17 | Kiilunen David D | Wires made of copper-based alloy compositions |
CN103555991B (zh) * | 2013-11-20 | 2016-01-20 | 苏州天兼金属新材料有限公司 | 一种无铅环保铜基合金管及其制造方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59153853A (ja) * | 1983-02-21 | 1984-09-01 | Hitachi Metals Ltd | リ−ドフレ−ム材 |
-
1983
- 1983-03-17 JP JP4307383A patent/JPS59170231A/ja active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59153853A (ja) * | 1983-02-21 | 1984-09-01 | Hitachi Metals Ltd | リ−ドフレ−ム材 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0523933Y2 (US20090163788A1-20090625-C00002.png) * | 1988-03-15 | 1993-06-18 | ||
JPH0346726U (US20090163788A1-20090625-C00002.png) * | 1989-09-05 | 1991-04-30 | ||
WO2014143614A1 (en) | 2013-03-11 | 2014-09-18 | Jan Remmereit | Lipid compositions containing bioactive fatty acids |
US10993925B2 (en) | 2015-09-18 | 2021-05-04 | Sciadonics, Inc. | Lipid formulations containing bioactive fatty acids |
US11058656B2 (en) | 2015-11-25 | 2021-07-13 | Sciadonics, Inc. | Lipid formulations containing bioactive fatty acids |
Also Published As
Publication number | Publication date |
---|---|
JPS59170231A (ja) | 1984-09-26 |