JPS6155244B2 - - Google Patents
Info
- Publication number
- JPS6155244B2 JPS6155244B2 JP56149966A JP14996681A JPS6155244B2 JP S6155244 B2 JPS6155244 B2 JP S6155244B2 JP 56149966 A JP56149966 A JP 56149966A JP 14996681 A JP14996681 A JP 14996681A JP S6155244 B2 JPS6155244 B2 JP S6155244B2
- Authority
- JP
- Japan
- Prior art keywords
- capacitor element
- lead wire
- cathode
- solid electrolytic
- capacitor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000003990 capacitor Substances 0.000 claims description 33
- 239000007787 solid Substances 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 24
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Chemical compound O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- MIVBAHRSNUNMPP-UHFFFAOYSA-N manganese(2+);dinitrate Chemical compound [Mn+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O MIVBAHRSNUNMPP-UHFFFAOYSA-N 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Electric Double-Layer Capacitors Or The Like (AREA)
- Electrolytic Production Of Non-Metals, Compounds, Apparatuses Therefor (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
【発明の詳細な説明】
本発明は固体電解コンデンサにかかり、特にそ
の陰極端子の改良に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to solid electrolytic capacitors, and particularly to improvements in the cathode terminal thereof.
第１図は固体電解コンデンサの構成図でアルミ
ニウム、タンタル等の弁作用金属（バルブメタ
ル）はエツチング体域は焼結体の形で陽極素子１
が形成されており、かゝる素子の表面を電解酸化
処理により必要な厚さの酸化皮膜２に変えてこれ
を誘電体層とし、この上に二酸化マンガン半導体
層３を硝酸マンガン水溶液中に陽極端子１を含浸
し次にこれを熱分解する工程を繰返すことにより
形成し、この上に陰極兼導体層としてグラフアイ
ト層４と銀塗膜層５を設けこれに陰極リード線６
を半田づけしてコンデンサ素子が形成されてい
る。 Figure 1 is a block diagram of a solid electrolytic capacitor. The valve metal (valve metal) such as aluminum or tantalum is etched in the form of a sintered body and the anode element 1.
The surface of such an element is changed into an oxide film 2 of the required thickness by electrolytic oxidation treatment, which is used as a dielectric layer, and a manganese dioxide semiconductor layer 3 is placed on top of this as an anode in a manganese nitrate aqueous solution. It is formed by repeating the process of impregnating the terminal 1 and then thermally decomposing it, and on top of this, a graphite layer 4 and a silver coating layer 5 are provided as a cathode and conductor layer, and a cathode lead wire 6 is formed on this.
A capacitor element is formed by soldering.
次にコンデンサ素子はこの上に樹脂塗装などの
外装が施されて固体電解コンデンサができ上る。 Next, the capacitor element is coated with a coating such as a resin coating to complete a solid electrolytic capacitor.
かゝる構造をとるコンデンサ素子は通常、金属
バーを用い、バー単位でコンデンサ素子の製作が
行われている。 Capacitor elements having such a structure usually use metal bars, and the capacitor elements are manufactured bar by bar.
第２図は最終製作工程としてコンデンサ素子８
の幅方向と高さ方向の辺により囲まれる側面に陰
極リード線６を半田付けする製造形態を示してい
る。 Figure 2 shows the capacitor element 8 as the final manufacturing process.
A manufacturing method is shown in which the cathode lead wire 6 is soldered to the side surface surrounded by the sides in the width direction and the height direction.
すなわち本実施例においては陽極端子は定間隔
を保つてそのリード線部が金属バー９に密に熔接
されており、この状態で電解酸化、二酸化マンガ
ン処理、グラフアイト浸漬処理など一連の製作工
程が進められて第２図で示すコンデンサ素子８が
でき上つている。 That is, in this embodiment, the anode terminals are kept at regular intervals and their lead wires are tightly welded to the metal bar 9, and in this state a series of manufacturing steps such as electrolytic oxidation, manganese dioxide treatment, and graphite immersion treatment are carried out. The capacitor element 8 shown in FIG. 2 is completed.
第２図は従来の方法であつて、コンデンサ素子
の間隔に合わせてバー１０に陰極リード線６が熔
接してあるものをコンデンサ素子８の幅方向と高
さ方向の辺に囲まれる側面に接着後治具を用いて
固定し、これを半田浴に浸漬するか域は半田鏝を
用いて半田付けすることで陰極端子の形成は終り
次にコンデンサ外装工程へ移ることになる。 Fig. 2 shows a conventional method in which cathode lead wires 6 are welded to bars 10 in accordance with the spacing between capacitor elements, and the bars 10 are bonded to the sides surrounded by the widthwise and heightwise sides of the capacitor element 8. After fixing using a jig and immersing it in a solder bath or soldering the area using a soldering iron, the formation of the cathode terminal is completed, and the next step is to move on to the capacitor packaging process.
第１図は半田鏝により陰極端子を形成した場合
であるが、かゝる従来コンデンサの欠点はストレ
ート状の陰極リード線６を小面積である板状コン
デンサ素子８の奥行き方向と高さ方向の辺により
囲まれる側面に固定するため陰極リード線６上の
外装樹脂の被覆量が少なくなり矢印方向１１への
引張り強度が弱くなることである。 Fig. 1 shows a case where a cathode terminal is formed using a soldering iron.The drawback of such a conventional capacitor is that the straight cathode lead wire 6 is connected to a plate-shaped capacitor element 8, which has a small area, in the depth and height directions. Since the cathode lead wire 6 is fixed to the side surface surrounded by the sides, the amount of coating resin on the cathode lead wire 6 is reduced, and the tensile strength in the direction of the arrow 11 is weakened.
本発明はこのような引張り強度を強化すること
を目的とし、解決する手段として陰極端子の形状
を変えたものである。第３図ＡおよびＢはリード
線の形状および接着状態を示すものでＡは正面
図、Ｂは側面図であり、次のような特徴がある。 The present invention aims to increase such tensile strength, and as a means to solve this problem, the shape of the cathode terminal is changed. FIGS. 3A and 3B show the shape and adhesion state of the lead wires, with A being a front view and B being a side view, which have the following features.
１ 陰極リード線６は板状のコンデンサ素子８の
幅方向と高さ方向の辺に囲まれる側面の中央部
に平潰しされた先端部が傾斜して接着が行なわ
れるようフオーミングされている。こゝで陽極
素子のリード線１２と陰極リード線６とは定間
隔をとつてコンデンサ素子８の平面と平行に設
けられていることが必要であり、リード線間隔
は従来と変らない。1. The cathode lead wire 6 is formed so that its flattened tip is inclined at the center of the side surface surrounded by the widthwise and heightwise sides of the plate-shaped capacitor element 8 for bonding. Here, it is necessary that the anode element lead wire 12 and the cathode lead wire 6 be provided parallel to the plane of the capacitor element 8 with a constant distance between them, and the lead wire spacing is the same as in the conventional case.
２ 陰極リード線６の先端部１３は平潰しされて
おり、コンデンサ素子８の幅方向と高さ方向の
辺に囲まれる側面の中央部に傾斜するように接
した状態で治具により固定される。2 The tip 13 of the cathode lead wire 6 is flattened, and is fixed with a jig in a state in which it is in inclined contact with the center of the side surface surrounded by the sides in the width direction and height direction of the capacitor element 8. .
第３図Ｃは同図Ｂの陰極リード線６のみの側面
図である。さて第３図Ａ，Ｂに示すようにバー単
位で治具により固定されたコンデンサ素子群はこ
の状態で従来と同じように半田付けが行なわれ
る。このとき陰極リード線６は傾斜しているた
め、コンデンサ素子８との間に隙間を有し、この
隙間に半田が入り込むことになる。その後本実施
例の場合は樹脂塗装による外装が行なわれる。第
３図Ａ，Ｂで示す点線部１４は外装を表わしてい
るが、この場合、陰極リード線６のフオーミング
による変形部は樹脂により充分に被覆されている
ことが必要である。 FIG. 3C is a side view of only the cathode lead wire 6 shown in FIG. 3B. Now, as shown in FIGS. 3A and 3B, the capacitor element group fixed by a jig bar by bar is soldered in this state in the same manner as in the conventional method. At this time, since the cathode lead wire 6 is inclined, there is a gap between it and the capacitor element 8, and the solder enters this gap. Thereafter, in the case of this embodiment, the exterior is coated with resin coating. The dotted line portion 14 shown in FIGS. 3A and 3B represents the exterior, and in this case, the deformed portion of the cathode lead wire 6 due to forming must be sufficiently covered with resin.
本発明は従来の陰極リード線形成がコンデンサ
素子の奥行き方向と高さ方向の辺に囲まれる側面
部で行なわれていたゝめに横方向の引張り強度が
弱い点を改良するためになされたもので、リード
線先端部を平潰して、傾斜するように板状のコン
デンサ素子の幅方向と高さ方向の辺に囲まれる側
面の中央部で接着が行われているため、コンデン
サ素子とリード線との隙間に半田が入り込むと共
に接着場所が広面積であるためリード線上の外装
樹脂の被覆量が増え、傾斜しているため上方向に
対する抵抗が大きくなり接着強度は大幅に改善さ
れ、上下方向、左右方向共に充分な引張り強度が
得られる。 The present invention was made in order to improve the problem that the tensile strength in the lateral direction was weak because the conventional cathode lead wire formation was performed on the side surface surrounded by the depth and height sides of the capacitor element. The tip of the lead wire is flattened and bonded at the center of the side surface surrounded by the width and height sides of the plate-shaped capacitor element so that the capacitor element and the lead wire are slanted. As the solder enters the gap between the lead wire and the bonding area is wide, the amount of exterior resin coating on the lead wire increases, and because the lead wire is slanted, the resistance in the upward direction increases, greatly improving the bonding strength. Sufficient tensile strength can be obtained in both left and right directions.
第１図は固体電解コンデンサの構成図、第２図
は従来の固体電解コンデンサの陰極リード線を示
す説明図、第３図は本発明のコンデンサに係る陰
極リード線の説明図でＡは正面図、Ｂは側面図ま
たＣは陰極リード線のみの側面図である。
図において１は陽極素子、６は陰極リード線、
７はハンダ、８はコンデンサ素子、９，１０は金
属バー、１２は陽極リード線、１３は先端部。
Fig. 1 is a configuration diagram of a solid electrolytic capacitor, Fig. 2 is an explanatory diagram showing the cathode lead wire of a conventional solid electrolytic capacitor, Fig. 3 is an explanatory diagram of the cathode lead wire according to the capacitor of the present invention, and A is a front view. , B is a side view, and C is a side view of only the cathode lead wire. In the figure, 1 is an anode element, 6 is a cathode lead wire,
7 is solder, 8 is a capacitor element, 9 and 10 are metal bars, 12 is an anode lead wire, and 13 is a tip.
Claims (1)
および陰極端子が接続される陰極層を被着形成し
て幅方向を長辺、奥行き方向を短辺とし、且つ幅
方向と奥行き方向の辺を周囲に持つ面を上下面と
した板状のコンデンサ素子が構成されており、該
コンデンサ素子外周に樹脂外装が形成されている
固体電解コンデンサにおいて、前記陽極端子は前
記板状のコンデンサ素子の上面より上方に導出
し、前記陰極端子は一方の端部が前記陽極端子と
平行で他方の先端部が平潰しされ前記板状のコン
デンサ素子の幅方向と高さ方向の辺を周囲に持つ
側面の中央付近に傾斜して接するよう形成されて
おり、該先端部が傾斜した状態で半田付けされ、
その上に樹脂外装が積層されていることを特徴と
した固体電解コンデンサ。1 A dielectric layer and a cathode layer to which the cathode terminal is connected are deposited on the anode surface to which the anode terminal is connected, and the width direction is the long side, the depth direction is the short side, and the width direction and the depth direction are the sides. In a solid electrolytic capacitor, the anode terminal is connected to the upper surface of the plate-shaped capacitor element, and the solid electrolytic capacitor is configured with a plate-shaped capacitor element whose upper and lower surfaces are surfaces having surrounding surfaces, and a resin exterior is formed around the outer periphery of the capacitor element. The cathode terminal has one end parallel to the anode terminal and the other end flattened, and has a side surface surrounding the width and height sides of the plate-shaped capacitor element. It is formed so as to be inclined and touch near the center, and the tip is soldered in an inclined state,
A solid electrolytic capacitor characterized by having a resin exterior layered on top of it.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14996681A JPS5851505A (en) | 1981-09-22 | 1981-09-22 | Method of forming cathode terminal of solid electrolytic condenser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14996681A JPS5851505A (en) | 1981-09-22 | 1981-09-22 | Method of forming cathode terminal of solid electrolytic condenser |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5851505A JPS5851505A (en) | 1983-03-26 |
| JPS6155244B2 true JPS6155244B2 (en) | 1986-11-27 |
Family
ID=15486498
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14996681A Granted JPS5851505A (en) | 1981-09-22 | 1981-09-22 | Method of forming cathode terminal of solid electrolytic condenser |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5851505A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5532040B2 (en) * | 1973-08-09 | 1980-08-22 | ||
| JPS5616928B2 (en) * | 1973-11-28 | 1981-04-20 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5386552U (en) * | 1976-12-20 | 1978-07-17 | ||
| JPS53101245U (en) * | 1977-01-20 | 1978-08-16 | ||
| JPS53146047U (en) * | 1977-04-22 | 1978-11-17 | ||
| JPS5532040U (en) * | 1978-08-21 | 1980-03-01 | ||
| JPS5616928U (en) * | 1979-07-18 | 1981-02-14 |
-
1981
- 1981-09-22 JP JP14996681A patent/JPS5851505A/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5532040B2 (en) * | 1973-08-09 | 1980-08-22 | ||
| JPS5616928B2 (en) * | 1973-11-28 | 1981-04-20 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5851505A (en) | 1983-03-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4010447B2 (en) | Solid electrolytic capacitor and manufacturing method thereof | |
| KR100747920B1 (en) | Solid electrolytic capacitor with face-down terminals, manufacturing method of the same, and lead frame for use therein | |
| JP3801660B2 (en) | Method for manufacturing capacitor element for tantalum solid electrolytic capacitor | |
| JP3463692B2 (en) | Manufacturing method of chip-shaped solid electrolytic capacitor | |
| JPS6155244B2 (en) | ||
| JPS5821415B2 (en) | Kotaidenkaicondensano Seizouhouhou | |
| KR930000872B1 (en) | Solid electrolytic capacitor | |
| JPH05175085A (en) | Chip-shaped solid electrolytic capacitor | |
| JP3378285B2 (en) | Structure of solid electrolytic capacitor and method of manufacturing solid electrolytic capacitor | |
| JP2875452B2 (en) | Manufacturing method of surface mount type solid electrolytic capacitor | |
| JPH05326341A (en) | Manufacture of solid electrolytic capacitor | |
| JP3294361B2 (en) | Structure of solid electrolytic capacitor and method of manufacturing solid electrolytic capacitor | |
| JP2827623B2 (en) | Manufacturing method of molded electronic component and lead frame | |
| JPS61278124A (en) | Manufacture of solid electrolytic capacitor | |
| JP3546451B2 (en) | Method for manufacturing solid electrolytic capacitor | |
| JPH09102442A (en) | Manufacture of nonpolar solid-state electrolytic capacitor | |
| JPS62569B2 (en) | ||
| JP3894316B2 (en) | Manufacturing method of chip-shaped solid electrolytic capacitor | |
| JP2549702B2 (en) | Solid electrolytic capacitor | |
| JPH06252010A (en) | Structure of solid electrolytic capacitor and manufacture thereof | |
| JP3241807B2 (en) | Solid electrolytic capacitor and method of manufacturing the same | |
| JPH02288321A (en) | Chip-shaped solid electrolytic capacitor | |
| JPH04192405A (en) | Solid electrolytic capacitor | |
| JP4119167B2 (en) | Manufacturing method of capacitor element used for solid electrolytic capacitor | |
| JP2004349725A (en) | Chip-like solid electrolytic capacitor |