JPS6153946U - - Google Patents
Info
- Publication number
- JPS6153946U JPS6153946U JP13920984U JP13920984U JPS6153946U JP S6153946 U JPS6153946 U JP S6153946U JP 13920984 U JP13920984 U JP 13920984U JP 13920984 U JP13920984 U JP 13920984U JP S6153946 U JPS6153946 U JP S6153946U
- Authority
- JP
- Japan
- Prior art keywords
- lower mold
- mold
- upper mold
- mount
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005520 cutting process Methods 0.000 claims description 5
- 238000000465 moulding Methods 0.000 claims description 4
- 230000005540 biological transmission Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
Landscapes
- Punching Or Piercing (AREA)
- Mounting, Exchange, And Manufacturing Of Dies (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第1図はICリードフレームの平面図、第2図
は同上のICリードフレームの各切断行程を説明
するための説明図、第3図は同上ICリードフレ
ームから分離したICの平面図、第4図は同上I
Cのリードを折り曲げ形成した状態の側面図、第
5図は本考案を実施せるICリードフレーム切断
用自動プレス装置の正面図、第6図は同上の平面
図、第7図は同上の上型取付台の組付部の一部破
断した正面図、第8図は同上の昇降作動装置の一
部破断した正面図、第9図は同上の上型取付台及
び下型取付台の上型及び下型を組付けた状態の縦
断正面図、第10図は同上の縦断側面図、第11
図は同上の上型取付台の上型を組付けた状態の下
面図、第12図は同上の切断用の上型の下面図、
第13図は同上の切断用の下型の平面図、第14
図は同上の下型を組付けた状態の下型取付台の平
面図、第15図は同上成型用の上型及び下型の一
部破断した側面図、第16図は同上成型用の上型
及び下型の作用の説明図である。
図面符号の説明、A…自動プレス装置、a…機
体、b…ローダー、c…移送装置、d…排出口、
e…IC搬送シユート、f…クランプ、1…IC
リードフレーム、10…IC、10a…リード、
11…リードフレーム、11a…側枠、12…レ
ジン、13…タイバー、14…透孔、2…下型取
付台、3…上型取付台、2a・3a…嵌合溝、2
b・3b…ストツパー、2c・3c…挿込口、2
d・3d…セツト穴、4…ポスト、4a…係止鍔
部、4b…スペーサー、4c…締付ネジ、40…
昇降台、41…軸受支持部材、41a…組付座、
41b…軸受支持部、42…シヤフト、42a…
クランク部、43…往復動杆、44…連動軸、4
5…伝導プーリー、46…伝導ベルト、47…緩
衝バネ、48…ガイド筒、5・8…上型、51・
52・53…ポンチ、54…レール部、6・7…
下型、60・70・80…基台、61・62・6
3・71…ダイ、64…ガイドレール、66…凹
部、65…バネ、67…誘導路、71…ブロツク
、72・73…エアーシリンダ、81a…ロール
、90…伝導軸、91…カムホイル、92…揺動
アーム、93…往復動杆、94…係合アーム、9
4a…先端部、96・97…クランプアーム、9
7a…支点軸、M…モーター、W…昇降作動機構
。
Fig. 1 is a plan view of the IC lead frame, Fig. 2 is an explanatory diagram for explaining each cutting process of the above IC lead frame, Fig. 3 is a plan view of the IC separated from the above IC lead frame, and Fig. 4 is a plan view of the IC separated from the above IC lead frame. The figure is same as I
FIG. 5 is a front view of an automatic press device for cutting IC lead frames in which the present invention can be implemented, FIG. 6 is a plan view of the same, and FIG. 7 is an upper mold of the same. FIG. 8 is a partially cutaway front view of the mounting section of the mounting base, FIG. Fig. 10 is a longitudinal sectional front view of the lower mold assembled state, Fig. 10 is a longitudinal sectional side view of the same as above, Fig. 11 is
The figure is a bottom view of the upper die mounting base with the upper die attached, and Figure 12 is a bottom view of the upper die for cutting.
Fig. 13 is a plan view of the lower die for cutting same as above;
The figure is a plan view of the lower die mounting base with the lower die attached to the above, Figure 15 is a partially cutaway side view of the upper and lower molds for the same molding, and Figure 16 is the upper die for the same molding. It is an explanatory view of the action of a mold and a lower mold. Explanation of drawing symbols, A... Automatic press device, a... Machine body, b... Loader, c... Transfer device, d... Discharge port,
e...IC transport chute, f...clamp, 1...IC
Lead frame, 10...IC, 10a...lead,
11...Lead frame, 11a...Side frame, 12...Resin, 13...Tie bar, 14...Through hole, 2...Lower die mounting base, 3...Upper die mounting base, 2a/3a...Fitting groove, 2
b・3b...stopper, 2c・3c...insertion port, 2
d・3d...Set hole, 4...Post, 4a...Latching flange, 4b...Spacer, 4c...Tightening screw, 40...
Lifting platform, 41...bearing support member, 41a...assembly seat,
41b...bearing support part, 42...shaft, 42a...
Crank part, 43... Reciprocating rod, 44... Interlocking shaft, 4
5...Conduction pulley, 46...Conduction belt, 47...Buffer spring, 48...Guide tube, 5.8...Upper mold, 51.
52, 53...punch, 54...rail section, 6, 7...
Lower mold, 60/70/80...Base, 61/62/6
3, 71...Die, 64...Guide rail, 66...Recess, 65...Spring, 67...Guidance path, 71...Block, 72, 73...Air cylinder, 81a...Roll, 90...Transmission shaft, 91...Cam foil, 92... Swing arm, 93... Reciprocating rod, 94... Engagement arm, 9
4a...Tip part, 96/97...Clamp arm, 9
7a...Fully shaft, M...Motor, W...Elevating operation mechanism.
Claims (1)
、それの上方に配位して昇降自在に機体aに支架
せしめた上型取付台3とに、ICリードフレーム
1からIC10を切り落す上型5と下型6とを夫
々組付けるとともに、該下型取付台2と上型取付
台3とには、前記上型5及び下型6に近接せしめ
た位置に、ICリードフレームから切り落したI
C10のリード10a…を成型する下型7と上型
8とを夫々組付け、かつ、前記下型取付台2には
、前述の上型5と下型6とで切り落されたIC1
0を前記成型用の下型7に向けてエアーにより搬
送する誘導路67を装設し、前記上型取付台3に
昇降作動装置Wを連繋せしめたことを特徴とする
ICリードフレーム切断用自動プレス装置におけ
る切断・成形装置。 The IC 10 is cut from the IC lead frame 1 onto a lower mold mount 2 which is fixedly mounted on the machine body a, and an upper mold mount 3 which is arranged above it and supported on the machine body a so as to be able to rise and fall freely. The upper mold 5 and the lower mold 6 to be dropped are respectively assembled, and the lower mold mount 2 and the upper mold mount 3 are provided with an IC lead frame at a position close to the upper mold 5 and the lower mold 6. I cut off
A lower mold 7 and an upper mold 8 for molding the leads 10a of C10 are respectively assembled, and the IC 1 cut off by the upper mold 5 and the lower mold 6 is mounted on the lower mold mounting base 2.
0 toward the lower mold 7 for molding by air, and a lifting actuator W is connected to the upper mold mount 3. Cutting and forming equipment in press equipment.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13920984U JPH0119401Y2 (en) | 1984-09-12 | 1984-09-12 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13920984U JPH0119401Y2 (en) | 1984-09-12 | 1984-09-12 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6153946U true JPS6153946U (en) | 1986-04-11 |
JPH0119401Y2 JPH0119401Y2 (en) | 1989-06-05 |
Family
ID=30697589
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13920984U Expired JPH0119401Y2 (en) | 1984-09-12 | 1984-09-12 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0119401Y2 (en) |
-
1984
- 1984-09-12 JP JP13920984U patent/JPH0119401Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPH0119401Y2 (en) | 1989-06-05 |
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