JPS6152674U - - Google Patents

Info

Publication number
JPS6152674U
JPS6152674U JP13825884U JP13825884U JPS6152674U JP S6152674 U JPS6152674 U JP S6152674U JP 13825884 U JP13825884 U JP 13825884U JP 13825884 U JP13825884 U JP 13825884U JP S6152674 U JPS6152674 U JP S6152674U
Authority
JP
Japan
Prior art keywords
container
reel
cap
opened
moisture absorbent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13825884U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP13825884U priority Critical patent/JPS6152674U/ja
Publication of JPS6152674U publication Critical patent/JPS6152674U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus

Landscapes

  • Storage Of Web-Like Or Filamentary Materials (AREA)
  • Wire Bonding (AREA)
JP13825884U 1984-09-12 1984-09-12 Pending JPS6152674U (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13825884U JPS6152674U (ko) 1984-09-12 1984-09-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13825884U JPS6152674U (ko) 1984-09-12 1984-09-12

Publications (1)

Publication Number Publication Date
JPS6152674U true JPS6152674U (ko) 1986-04-09

Family

ID=30696652

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13825884U Pending JPS6152674U (ko) 1984-09-12 1984-09-12

Country Status (1)

Country Link
JP (1) JPS6152674U (ko)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07206270A (ja) * 1994-01-13 1995-08-08 Riken Densen Kk 線材ボビンの収納容器
WO2012090886A1 (ja) * 2010-12-28 2012-07-05 株式会社徳力本店 硫化防止リール
JP5035491B2 (ja) * 2010-12-27 2012-09-26 日立化成工業株式会社 乾燥剤収容器及び接着テープ用リール

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5144151U (ko) * 1974-09-28 1976-04-01

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5144151U (ko) * 1974-09-28 1976-04-01

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07206270A (ja) * 1994-01-13 1995-08-08 Riken Densen Kk 線材ボビンの収納容器
JP5035491B2 (ja) * 2010-12-27 2012-09-26 日立化成工業株式会社 乾燥剤収容器及び接着テープ用リール
WO2012090886A1 (ja) * 2010-12-28 2012-07-05 株式会社徳力本店 硫化防止リール
CN103237747A (zh) * 2010-12-28 2013-08-07 株式会社德力本店 防硫化卷盘
JPWO2012090886A1 (ja) * 2010-12-28 2014-06-05 株式会社徳力本店 硫化防止リール

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