JPS6151640B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a plating device that is capable of uniformly plating even surfaces with particularly complex shapes.

Regardless of whether electroplating, chemical plating, etc. are used, it is difficult to uniformly plate a plated object having a complex shape with many irregularities. In other words, when plating is attempted on such a surface, a thick plating layer develops on the protruding parts, especially on the ridges that protrude at acute angles, but it does not develop in the concave parts, grooves, or their corners and corners. A problem arises in that there is almost no plating.

In addition, in order to plate a part of the surface to be plated, it is necessary to take complicated and troublesome masking measures, making it impossible to perform partial plating efficiently.
There were also size limitations.

The present invention has been made based on the above-mentioned viewpoints, and its purpose is to perform plating while measuring the thickness of the plating layer applied to the surface to be plated, and to The object of the present invention is to provide a plating device capable of applying a plating layer of a uniform or desired thickness to the surface of the material.

Hereinafter, the details of the present invention will be specifically explained with reference to the drawings.

FIG. 1 is an explanatory diagram showing one embodiment of the plating device according to the present invention, FIG. 2 is an explanatory diagram showing another embodiment, and FIGS. 3 and 4 are diagrams showing a plating device used in the device of FIG. FIG. 5 is an explanatory diagram showing still another embodiment, and FIG. 6 is a partially enlarged sectional view of the electrode used in the device shown in FIG.

Reference numeral 1 has, for example, a three-dimensional cavity to be plated, and is an electroforming mold used for forming electrodeposited metal in electroforming processing, 2 is a plating tank, and 3 and 3 are on the wall of the plating tank 2. A bogie running in the X-axis direction is provided with rails 4, a car body 5 formed by connecting a pair of I-beams in parallel, wheels 6, 6, an axle 7, a drive motor 8, chain wheels 9 and 10, a chain 11, etc. , 12 is a vehicle body 13, wheels 14,1
4. A Y-axis traveling trolley 18, which is composed of a drive motor 15 and others, and is mounted with an electrode lifting device 16 and a measurement electrode lifting device 17 and runs in the longitudinal direction on the X-axis traveling truck 4; 19 is a measuring electrode for measuring the thickness of the plating tank applied to the electroforming mold;
9a is an insulating member covering the surface of the measurement electrode 19; 20 is a plating power supply circuit that supplies a DC voltage or voltage pulse of a predetermined polarity between the electroforming mold 1 and the electrode 18; and 21 is a measurement electrode for the measurement electrode 19. Numerical control device 22 is a plating liquid that controls drive conditions such as the position of the electrode 18 in the Z-axis direction by the lifting devices 16 and 17, the measurement sequence operation by the electrode 19, and the plating conditions of the circuit 20 based on the amount.

The electrode 18 is supported so as to be able to rise and fall freely by an electrode lifting device 16, and a motor (not shown) built in the device 16 moves the tip of the electrode 18 and the electrode according to the shape of the plating cavity of the electroforming mold 1, for example. The vertical movement is controlled so that the opposing gap with the mold 1 is always maintained at a predetermined, preferably small, predetermined gap. Furthermore, the measuring electrode 19 is similarly supported by a measuring electrode lifting device 17 so as to be able to be controlled up and down, and a motor (not shown) built into the device 17 is used to raise and lower it under sequence control according to a set measurement program, etc. .

X-axis direction and Y-axis direction traveling carts 4 and 12
The motors 8 and 15 that run the electrodes 18 and the measurement electrode 19 are controlled by a numerical control device 21, like the motors that move the electrode 18 and the measurement electrode 19 up and down, to sequentially scan and move the plating and measurement positions of the electrodes 18 and 19 on the electroforming mold 1. is now under control.

The ideal way to move the electrodes is so that the center of the electrode 18 is always aligned with the normal to the surface to be plated, and the gap between the tip and the surface to be plated is always the same as the standard inter-electrode distance. In this method, the position and posture of the electrode 18 are controlled so that the plating surface is maintained at the same level, and the tip of the electrode 18 is moved so that the residence time for each part of the surface to be plated becomes uniform. (However, the standard inter-electrode distance here is, for example, the inter-electrode distance that is considered appropriate when plating a flat surface.) If this inter-electrode distance is large, plating will be done macroscopically uniformly, but In addition to increased loss, there is a problem in that the thickness of the plating layer becomes non-uniform due to the undulations and irregularities of the surface to be plated.

On the other hand, if the distance between poles is too small,
Not only does the total length of the electrode path become longer and the numerical control program becomes redundant, but also undulations occur along the electrode path, so an appropriate inter-electrode distance must be determined by oneself.

However, in order to perform such control, not only a complicated and expensive electrode control device is required, but also complicated calculations are required to create a numerical control program, so this method is not practical. do not have.

In this device, the measuring electrode lifting device 17 is driven until the measuring electrode 19 comes into contact with the plated portion of the surface of the electroforming mold 1 from a predetermined position, and the moving distance is measured. . This measured value is used as a reference value in the numerical control device 21 for the electroforming mold 1.
The moving distance of the measuring electrode 19 to the same position before the surface was plated is compared, and the moving carts 4 and 12 in the X-axis direction and the Y-axis direction are moved according to a predetermined program according to this comparison value. Motors 8 and 15 that run the motors 8 and 15, and electrodes 18
The motor that raises and lowers the measurement electrode 19 and the power supply circuit 20 that supplies a DC voltage or pulse voltage of a predetermined polarity between the electroforming mold 1 and the electrode 18 are controlled, so regardless of the shape of the electroforming mold 1, the surface The plate is plated to a substantially uniform thickness.

The peripheral wall of the measuring electrode 19 is covered with an insulating member 19a made of synthetic resin or the like to prevent the measuring electrode 19 from corroding.

Next, FIGS. 2, 3, and 4 will be explained. Figure 2 shows an example of a device that performs plating while irradiating the workpiece with heat rays, and the driving method and voltage supply method for the electrodes and measurement electrodes are the same as those shown in Figure 1. In FIG. 3, the same numbers as in FIG. 1 indicate the same components, and in the figure, 18a is a conductive pipe-shaped electrode, and 23a is attached to the tip of the pipe-shaped electrode 18a. transparent or semi-transparent convex lens, 2
3b is transparent glass, 24 is a hot ray source, and 25 is an electrode holder that is fixedly provided at the lower end of the hot ray source 24 and supports the pipe-shaped electrode 18a.

A transparent or translucent convex lens 23a is attached to the tip of the pipe-shaped electrode 18a made of a conductive material, and the pipe-shaped electrode 18a is fixed to the lower end of the heat ray source 24. It is attached to the electrode holder 25.

As the heat ray source 24, one that emits substantial heat rays, such as laser light, xenon light, or infrared rays, is used. Furthermore, the light beam from the heat ray source 24 is transmitted to the electroforming mold 1 when the measurement electrode 19 moves from a predetermined position.
When you touch the plated part of the surface and measure the distance it moves, this measured value is sent to the numerical control device 21.
The moving distance of the measurement electrode 19 to the same position before plating on the surface of the electroforming mold 1 is compared with the reference value, and the strength or weakness of the electroforming mold 1 is controlled according to a predetermined program according to this comparison value. At the same time, the light is focused by a convex lens 23a provided at the tip of the pipe-shaped electrode 18, and the part of the electroforming mold 1 to be plated is irradiated with the light. In addition, this embodiment device is similar to the embodiment device shown in FIG.
Unlike the case where plating is applied to a certain range of the electroforming mold facing the electrode, plating is applied only to the area irradiated with the light from the heat ray source 24, so the direction of movement of the measurement electrode 19 is always fixed. It has been decided. That is, the measurement electrode 19 is configured to follow and measure after irradiation from the heat ray source 24 has been performed and plating has been performed.

When processing is carried out using the apparatus of this embodiment, the plating liquid 22 is kept at room temperature or below, and the voltage of the power supply circuit 20 is set to be around or below the voltage under conventional conditions. The plating speed should be kept very slow or the plating should not proceed at all. Also, at this time, a hot ray source 24 is applied to the part of the electroforming mold 1 to be plated.
The light beam passes through the pipe-shaped electrode 18a, is focused by the convex lens 23a, and is irradiated to that area, so the temperature of the plating liquid 22 on or near the surface of the electroforming mold 1 is approximately 45 to 60℃. It is heated to the optimum temperature for plating of 0.degree. C., thereby activating the region, improving the deposition efficiency, and plating almost selectively only on the region irradiated with the light. It is also possible to perform plating in a limited area depending on the size of the beam spot by adjusting the convex lens 23a as appropriate.

The transparent or semi-transparent convex lens 23a attached to the tip of the pipe-shaped electrode 18a can be changed to a transparent glass 23b or the like if the shape of the irradiated part is not very complicated and adjustment of the beam spot is not required. It is.

In addition, the optical elements such as the lens 23a can prevent the plating liquid from entering into the pipe-shaped electrode 18a by using a transparent glass at the tip or a gas supply pressure inside the tube, or if the liquid level of the plating liquid 22 is shallow, When the insertion length of the electrode tip into the liquid is short, the above-mentioned optical element may be provided at an appropriate position in the electrode axis direction to set and control the concentration and diffusion of the heat rays, the size of the beam spot, etc. Alternatively, a part or all of the inside of the pipe-shaped electrode may be constructed to serve as a light guide path by inserting one or more optical fiber glasses.

Next, FIGS. 5 and 6 will be explained.
Figure 5 shows an example in which compressed air is used to prevent the plating liquid from entering a conductive pipe-shaped electrode with an open tip, and shows how to drive the electrode and measurement electrode. method, voltage supply method,
The method of controlling the heat ray source is the same as that shown in Fig. 2, and the same numbers in Fig. 5 as in Fig. 2 indicate the same components, and 18b in the figure indicates both ends. 26 is a constrictor, 27 is a pressure regulating valve, 28 is a compressor, 18c is an insoluble pipe made of synthetic resin, and 29 is a metal attached to the peripheral wall at the tip of pipe 18c. It is a sexual electrode member.

Thus, the pipe-shaped electrode 18b is attached to the electrode holder 2.
5, and the light beam from the heat ray source 24 passes through the pipe-shaped electrode 18b and is irradiated onto the portion of the electroforming mold 1 to be plated. However, in the embodiment shown in FIG. 5, the tip of the pipe-shaped electrode 18b is open, so that the plating liquid 22 does not enter into the pipe-shaped electrode 18b. There is. That is,
A small hole is provided in the side wall of the pipe-shaped electrode 18b for feeding compressed air from the compressor 28 into the pipe-shaped electrode 18b. Then,
When the measurement electrode 19 moves from a predetermined position and comes into contact with the plated part of the surface of the electroforming mold 1 and measures the distance of movement, this measured value becomes the reference value in the numerical control device 21. The distance traveled by the measurement electrode 19 to the same position before the surface plating is compared, and according to this comparison value, the hydraulic pressure at the tip of the pipe-shaped electrode 18b is adjusted according to a predetermined program. The pressure regulating valve 27 is controlled so that the compressed air becomes a little higher, and the compressed air is sent into the pipe-shaped electrode 18b. Therefore, the plating liquid 22 does not enter into the pipe-shaped electrode 18b, so that the light beam from the light source 24 can be directly projected onto the electroforming mold 1.

Further, the pipe-shaped electrode is not limited to the conductive pipe-shaped electrode 18b, and a metallic electrode member 29 is attached to the tip peripheral wall of an insoluble pipe 18c made of synthetic resin or the like as shown in FIG. It is also possible to use the

Since the present invention is constructed as described above, when using the apparatus of the present invention, processing is performed while successively measuring the thickness of the plating layer applied to the surface of the electroforming mold, so that electroforming molds with complex shapes can be uniformly coated. This makes it possible to form a plating layer with a certain thickness.

Note that the configuration of the present invention is not limited to the above-mentioned embodiments. That is, for example, in this example, the electroforming mold was fixed and the electrode was moved in three axes to perform processing, but the electrode was fixed and the entire plating tank was moved in three axes using a cross slide table. A plating layer may be formed on the electroforming mold by moving the electroforming mold in the direction shown in FIG. Furthermore, a pipe-shaped electrode may be provided with a plurality of optical fibers bundled together to project light from a light source in different directions, and the present invention is free to do so within the scope of its purpose. The design can be changed, and the present invention encompasses all of them. For example, to measure the plating thickness by raising and lowering the measuring electrode, it is necessary to detect by electrical means or the like that the tip of the electrode 19 directly contacts the plating surface of the electroforming mold 1 facing the electrode. When a predetermined relatively small gap is formed at the tip, the electrode is lowered by detecting the resistance, capacitance, voltage, current, transmission and reception of light or ultrasonic waves in the gap, etc. It is possible to make changes such as stopping it, or lowering it by a predetermined amount according to a predetermined program, and measuring the gap formed at that time using a detector provided at the tip.

[Brief explanation of the drawing]

FIG. 1 is an explanatory diagram showing one embodiment of the plating device according to the present invention, FIG. 2 is an explanatory diagram showing another embodiment, and FIGS. 3 and 4 are diagrams showing a plating device used in the device of FIG. FIG. 5 is an explanatory diagram showing still another embodiment, and FIG. 6 is a partially enlarged sectional view of the electrode used in the device shown in FIG. 1...Electroforming mold, 2...Plating tank, 3...Rail, 4...X-axis direction traveling trolley, 5, 13...Car body, 6, 14...Wheel, 7...Axle, 8, 15...
... Drive pulse motor, 12 ... Y-axis direction traveling trolley, 18 ... Rod-shaped electrodes, 18a, 18b ... Conductive pipe-shaped electrodes, 19 ... Measurement electrode, 20
...Power supply circuit, 21...Numerical control circuit, 22...
Plating liquid, 23a... Convex lens, 23b... Transparent glass, 24... Heat ray source, 25... Electrode holder, 26... Aperture, 27... Pressure regulating valve, 28... Compressor, 29... Metallic electrode member .

Claims (1)

[Scope of Claims] 1. Supplying a plating liquid between the object to be plated and the electrode for plating, moving the electrode for plating to a desired position on the surface of the object to be plated, and moving the electrode for plating and the electrode for plating to a desired position on the surface of the object to be plated. In a plating device for plating a body to be plated by applying a predetermined current between the body to be plated and the plating electrode while maintaining a constant gap between the body surface and the body surface, the following item (a) is provided. A plating device characterized by being equipped with a plating thickness adjustment device consisting of the components listed in items (c) to (c) above. (a) A measurement electrode that moves from a predetermined position onto a plating surface applied to the surface of the object to be plated, approaches or contacts the plating surface, and measures the amount of movement. (b) Move the measurement electrode to a desired position on the surface of the object to be plated, and direct the measurement electrode from a predetermined reference position toward the object to be plated. A measuring electrode moving device that moves the measuring electrode until it comes into a predetermined proximity or contact state. (c) Calculate the plating thickness by comparing the moving distance of the measuring electrode from the reference position to the point where it comes close to or in contact with the object to be plated and the distance from the reference position stored in advance to the object to be plated. and a control circuit that controls plating processing based on the calculated value. 2. Supplying plating liquid between the body to be plated and the electrode for plating, moving the electrode for plating to a desired position on the surface of the body to be plated, and removing the gap between the electrode for plating and the surface of the body to be plated. A predetermined current is applied between the body to be plated and the plating electrode while keeping the gap constant, and a heat ray is irradiated to the part of the body to be plated to plate the body to be plated. A plating device characterized by being equipped with a plating thickness adjusting device consisting of the following components (a) to (c). (a) A measurement electrode that moves from a predetermined position onto a plating surface applied to the surface of the object to be plated, approaches or contacts the plating surface, and measures the amount of movement. (b) Move the measurement electrode to a desired position on the surface of the object to be plated, and direct the measurement electrode from a predetermined reference position toward the object to be plated. A measuring electrode moving device that moves the measuring electrode until it comes into a predetermined proximity or contact state. (c) Calculate the plating thickness by comparing the moving distance of the measuring electrode from the reference position to the point where it comes close to or in contact with the object to be plated and the distance from the reference position stored in advance to the object to be plated. and a control circuit that controls plating processing based on the calculated value.