JPS61500799A - wafer processing machine - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] wafer processing machine Background of the invention The present invention is generally applicable to wafer processing machines, particularly those operating under reduced pressure such as sputter coating machines. Concerning machines of the nature of

Description of prior art Conventionally, the rL tow bar built into a special wafer carrier is moved by elevator blades. Spatter that is continuously lifted into the tower-mounted locking machine of the sputter temporary covering machine. Coating machines have been proposed. The wafer is attached to a genuine nitrogen chuck that forms part of the door by means of a blade. It is mounted on the top of the tank and attached to the loading lock part of Tatsumi Yusei. The door pivots closed and the wafer The chuck that holds the evacuated room is a lazy susan type rotating member Translate the wafer being conveyed from the wafer into the edge gripper. Equipped with lock stay The opening in the lazy susan plate facing the section is sealed by a plunger. The tower lock section is evacuated to a relatively low pressure by a rough pump. . When a suitable low pressure condition is achieved, the sealed plunger opens and communicates with the high nitrogen pump. The wafer is then exposed to the evacuated processing area. After that the pressure is relatively low 1 and flushed with argon to a sputter pressure of 10 −3 Torr. Ray As the Susan rotates, it is placed first and the wafer is transferred to the sputter gun. into the sputtering position, and the sputter gun then sputters by the sputtering action. C to completely cover the wafer previously placed on the tower. It was loaded first and covered with tueno. After that, Rain-Susan rotates the fire into the Eno-Totoro lock, and then After that, the opening inside the lazy Susan is sealed from the processing part and the loading lock part is It is pulled up to atmospheric pressure. At this point, the vacuum chuck is translated into the clip. , pick up the coated ueno. The door remains open and rotates, and the blades remain open. Ha? Pick it up from the chuck and place the covered knife back into its original position in the carrier. Back. Lazy Susan causes a series of changes in which the wafer is heated before it leaves the wafer coating. a series of different stations t so that the material can be sputter coated with -We are here.

Such a wafer coater is disclosed in U.S. Patent Specification Letter 4,311, issued January 19, 1982. , No. 427, which is incorporated herein in its entirety as #Koiyo. There is.

One of the problems with conventional sputter coating machines is that they are more complex than Vβ. The reason is that it is relatively expensive and has a low credit rating. Sea urchin...to hold on to all its strengths The spring clip configuration creates undesirable stress on the wafer and can cause undue stress on the machine. This can lead to corruption and downtime.

Therefore, we provide a complete wafer coating machine that is less complicated, less expensive, and more reliable. is desired.

Summary of the invention The main purpose of the invention is to provide an improved waste treatment machine, especially a waste reduction machine such as a sea urchin coating machine. By providing a processing machine that performs 9 operations under pressure.

One of the inventive features is that it passes through the open bottom and into the carrier. It engages with the Ueno and raises the Ueno slightly, causing the Uno and the Uno in the carrier to rise. ・To precisely determine the position of the sawtooth′$, the packing body, (therefore the standard same sea urchin carrier) Ueno can be determined accurately within the slot of n.

Another feature of the present invention is that the mounting lock part of the evacuated ueno/processing chamber is The wafer is isolated from the wafer processing or coating area where it can be evacuated by a ・The sea urchins in the chamber can be evacuated through the open throat of the gate valve. I'm going to be able to move on, and I'm going to have a good time.

Another feature of the present invention is that the wafer is used to tighten the wafer to the processing chuck. ・The knitting means are the same as Ueno and Somugi covering material sources, and as a result, the imposition is structurally Removable surfaces so that covered parts of the body can be easily removed and cleaned? Preparation This is what is happening.

Another feature of the present invention is that the sputter shield is provided between the sputter gun and the ueno. to collect blown material ejected from the gun and not collected by the workpiece. This prevents material from flying back onto the surface from undesirable areas during use. Ruru in terms of being removed.

Another feature of the invention is that the sputter shield has an opening in the center separated from the gun. with closed end walls, and the coated material is located approximately in the same space as the central opening area. Sprayed onto either the wafer to be coated or the sputter shield. It is possible to collect all the materials.

Another feature of the present invention is that the inspection port in the evacuable chamber has a T-closed cover. The coating gun is transported from the cover, and the cooling fingers are transported from the cover and extend into the room to The point is that Qi and other condensates are condensed onto it.

Another object of the present invention is that the cooling fingers are generally arcuate so that the inspection port Temporary piles transported from the cover/(・1 concentrically and arranged on the outside of the coating gun) The point is that it is placed.

Other features and advantages of the present invention are read carefully in the following specification W' together with the accompanying drawings. This will become clear.

Brief description of the drawing Figure 1 is a schematic diagram of a wafer coating machine incorporating the features of the present invention, and Figure 2 is 2-2. A cross-sectional view of the structure part in Figure M1 shown by the line, Figure 3 is along the line 3-3 in the direction of the arrow. Draw 7 is the thick diagram of the structure of the second cross, and the fourth cross is the second cross drawn along the 4-4 line in the direction of the arrow. A perspective fox-dog diagram of a part of the structure shown in Figure 5. An enlarged view of a part of the structure in Figure 2, the sixth figure is the Ueno elevator blade of the coating machine of the present invention. A side view of the composition, Figure 7 shows the tower lock and vapor deposition section of the vacuum chamber of the coating machine in Figure 1. 9 is a longitudinal cross-sectional view of a part of the vapor deposition chamber of the present invention. i, sectional view, no. The 10th port has an inspection cover with a hanging sputter gun working for inspection and maintenance of the coating. FIG. 2 is a perspective view of a portion of the coating machine of the present invention;

Description of examples Referring now to FIG. 1, a sputter coating machine 11 incorporating features according to the present invention is shown. Ru. In particular, the 'lJ cover is a circle whose one end is closed by a cover 13 with a flange. It has a cylindrical processing chamber portion 12, the cover 13; ``Supports and transports the Jft cover gun.The other end of the processing chamber 12 has an opening in the center. The section is closed by the closing wall 14. The central opening is where all the processing machines in the processing chamber are installed. It is closed by a gate valve assembly 15 for isolation from the locking part. axially A translating door 16 closes off the other end of the throat of gate valve 15. turbo molecular vacuum po A pump 17 sits on top of the processing chamber 12 and communicates with its interior via a conduit 18. .

A Ueno carriage body 19 is disposed below the door 16 and adjacent to the door 16.

The wafer 21 processed by the wafer processor 11 is a standard wafer carrier 2. 2 and inserted into a recess in the wafer carriage body 23, but the wafer The carriage body 23 is axially translated relative to the elevator blade 24 and The blades 24 pass through the bottom of the wet carrier 22, upward, and pass through the entire top of the wet carrier 22, respectively. Lift up the sea urchin and transport it from inside the tower lock door 16. position so that it is adjacent to the The wafer carriage 23 has a pair of horizontal guide rods. The motor drives the screw 26 along the guide rod 25. The wafers are continuously advanced onto the blades 24 and the wafer processing machine 1 Conquer and transport between 1.

Next, referring to Figure 2, details of wafer carriage assembly ■9 are shown. There is. The wafer carriage body 19 includes two carriage members 27. The end of the wafer processing machine 11 is fixed to the wafer processor 11 from the floor. axially translated on a pair of guide rods 25; The drive screw 26 is connected to the carriage 27. Then, the carriage 27 is driven on the guide rod 25. The drive screw 26 is a conventional Rotated by a step motor.

The carriage member 27 has a rectangular recess 28t, which is similar to that of the conventional wafer carrier 22. The wafer receptacle housing the generally rectangular lower farm portion includes a mouth portion. Typical In the example fit, the wafer carrier 22 is P A 72-5 for 5" wafers. 0 M type, commercially available from Fluorowave Co., Ltd. Use W1PA72-40MFJl for available 4" wafers. Wafer carrier The layer 22 has silicon wafers 32 arranged therein in the axial direction and spaced apart from each other in the axial direction. Another row of wafer storage slots 31 formed for locating, accommodating and holding A fully curved side wall portion 29 is provided. Typical embodiment fit; The center-to-center axial spacing between wafers is 0.187" and the wafers are 0.026" It has a thickness of

In a standard wafer carrier 22, the individual wafer holding slots 31 are approximately 0. The same range of 060″ is included in the temperature range.

The individual wafers 32 are accurately placed in their respective slots 31 to ensure fine details between the wafers and the wafers. Wanxian wafers are precisely determined and the individual wafers are 0.250 inch thick. It can be placed precisely in vertical alignment on the beta blade 24. It is desirable to be able to do so. 32 sea urchins in each slot 31 A pair of wafer indexing blades 33 are attached to the carriage member 27 in order to accurately position the wafer within the carriage member 27. The female carrier 220 extends at its bottom adjacent to the inner wall of the carrier 220. that The upper edge portion 34 of each indexing blade 32 is approximately as shown in reference numeral 35 in FIG. The serrations are cut to engage the bottom edge of each wafer 32, and the wafer carrier is Make sure to lift the wafer slightly inside the rear 22. Pitch of sawtooth inside blade 33 is designed to accurately determine the desired sum direction spacing of each Ueno 32. It will be done. Individual wafers 32 are timed by conventional roller parallel alignment means (not shown). It is pre-aligned with the large alignment flat part 36 at the 6 o'clock position.

The wafer carriage structure 27 has a thin longitudinally oriented flange shown in FIG. It has 37 minutes. The outer side image portion of the longitudinal flange 37 is designated by reference number 38. Partology of the flange transversely slotted and formed by the slots 38 A straight line of transparent parts is formed in the rice field.

The slots 38 are spaced apart or pitched within the serrated edges of the indexing blades 33. It has a pitch, or opening, equal to . The optical reading load 39 has a slot. The provided flange 37 is connected to the frame that covers the coating machine 11 from the floor. can be installed. The sea urchin carriage composition 27 is formed by an optically transparent passageway. As obtained between the optical transmission part 41 and the optical reading part 420 of the optical reader 39, When the wafer carriage 27 is translated to the desired position, the electric circuit is completed and the translation of the wafer carriage 27 is completely stopped. The output signal for the main output, each wafer is connected directly to the elevator blade 24. Move forward in a vertically aligned position.

This summer, we will provide detailed information on Figures 2, 5, 6, 2, and 7 from the wafer mounting mechanism. Please explain in detail. In particular, the wafer elevator blade 24 ( It has an upper leading line portion 43 that engages with the bottom edge of the wafer 32. Leading edge 13 has the entire chamfered portion 44, which portion is chamfered at the edge of the wafer 32. It is gripped between the surface 44 and the inner wall 45 of the extensible portion 46 of the elevator blade 24. Ru. The side edges of the elevator blade 24 are chamfered at the reference numeral 46 to improve the frame structure. The roller 48 is conveyed from the structure 51 to the center 49 via the support bracket 52. The entire edge of the blade 44 is made to fit into the groove 17. The roller 48 is the blade 24 It guides the vertical motion of. Illinois where the blades are fixedly attached to the frame 51 Obtained by Olga (0γigα), Elmhust, Canton It is manually operated by a possible ronless air cylinder 53. The blade 24 is Slotted circular cylinder sealed by stainless steel shaft 530 cups passing through the same axis It is attached to the piston of the cylinder 53 yen by the pulling member 54iC. typical In this example, the rodless cylinder 53 provides a vertical lift of 14" to the vane 24. Ru.

As the blade 24 rises, it picks up the lower edge of the sea urchin/.32 and coats the coating machine 1. 1 is fixedly attached to the tower-mounted lock end of 1 and is conveyed from the lock end. The entire wafer 32 is transferred to the upper part of the guide slot 55 provided in the guide rail 56. do.

The elevator blade 24 accommodates and holds wafers such as Ueno 32 and Ueno chunk 57. Until it is positioned so that Mt is on the upper part of the human side 58, the upper movement is continued. do. The wafer receiving surface 58 of the chuck has an annular shape connected in fluid communication with a gas source. The V groove 59 is biased. The gas flowing into the V-groove as soon as the wafer 32 approaches is Creates a Bernoulli effect that inhales Ueno into Chuck 570 people and 580,000 people. Start. When the telescopic portion 46 of the blade 24 is engaged with the lower circumferential portion of the chuck 57, The telescopic part 46f! The wafer 32 is completely supported against the chuck 57 by shrinking. The large surface of the chuck allows for movement into the groove bottom body, i.e. 58, and the circumference of the wafer corresponds to the outer circumference of the chuck 57. It's almost 0.020 inch. When the blade 24 rises to its uppermost area, If the 2... is excessively positioned with respect to the chuck, there will be a problem that will lead to the gas V-shu. The flow is terminated by the excess square and the true state is drawn onto the V-groove and the wafer 32 is held against a large surface 58 of chuck 57.

Thereafter, the blade is moved to the wafer carrier's lowermost travel range as shown in the second item. Retreat to food.

When it is desired to remove the wafer 32 from the vacuum chuck 57, an elevator The motor blade 24 is raised to its uppermost stroke range shown in FIG. The pressure is applied so that the gas flows, the blade 24 retreats to T1, and the wafer 32 is moved by gravity. The nest falls into the holding position shown in Figure 5. The blade 24 is inserted into the guide slot along with the wafer 32. 55 into the respective slots 31 of the wafer carrier 22 to T1. do.

Next, if we look at Figures 7 and 8, the workings of the wafer chuck will be shown in more detail. It is. In particular, the chuck 57 is conveyed from the circular door structure 61 and 61 itself is conveyed from the drive plate 62 via the rod 63.

The wafer chuck 57 connects to the rod 64 in the axial direction through the central opening in the door 61. On the rod that translates in the axial direction that enters the air cylinder 65 for translating the engine 57. transported to. The actuating rod 64 is vacuum-sealed to the door 61 via an O-ring 66. A linear ball bearing is conveyed from a door 61 that is stopped and rests on a rod 64. The action of the assembly 67 to accurately axially translate the rod 64 relative to the door 61 is obtained. The door 61 and the hanging wafer chuck 57 are driven via the drive roller 9. axially translated by an air cylinder 68 working on moving plate 62 . The actuating plate 62 is guided on a pair of guide rods 71 and 72 and is positioned in the deposition chamber 12. It is securely attached to the tower lock end and transported from the plate 75. guide rod The outer ends of 71 and 72 are held together by a stabilizing plate 76.

An annular mounting plate 72 is sealed onto the flanged open lower portion 9 of the gate valve 15. The opening is sealed by an IJ ring 81. The mounting plate 78 is located in the reference ministry number 82 part. The core is counterbored to seal the door 61 against the mounting plate 78. 1 to provide a seat for storing the O-ring conveyed.

The wafer tightening is performed by a ring 85 (arranged concentrically with the wafer chuck 57 and inside the ring 85). In order to store the circumferential edge of the chuck concentrically and circularly, there are 3 counterbores (number 86). Be prepared in minutes. The counterbore region 86 engages the outer periphery of the wafer 32 and allows the chuck to eject. via the retaining groove 59, as is the case when working in a ventilated room. An inner lip that clamps the wafer against the chuck 57 without any additional moisture It has portions. For tightening, the ring 85 is a straight pole bearing assembly 88. It is conveyed onto a plurality of axially facing stainless steel rods 87 passing through the L/- is inserted into the bore in the door 8. Spring 89 surrounds rod 87 The screws 91 are mounted coaxially in the same manner and are screwed into the end of the rod 87. and is captured by the rod. The spring 89 holds the tightening ring 85 at the wafer chuck 57. The function is to bias the spring in the position direction. A cylindrical cap 92 is hermetically sealed onto the rod 87. The spring 89 and sliding rod 87 are sealed and transported from the mounting block L'-door 8. pay.

When tightening, the ring 85 is fully retracted in the counterbore area 9 of the mounting plate 78. Fits inside 3.

The wafer chuck 57 is separated from the outer annular portion 95 by a cup-shaped insulating member. The outer portion 95 of the chuck has an inner annular portion 94 that connects the chamber and the door 61. It is possible to work with a potential that is different from the electric potential. Part 95 that chucks the potential of π A conductive rod 97 passes from the chuck portion 95 through an axial bore 98 to apply an electric current to the depending axially into an axially hermetically sealed cylindrical cap portion 99. Ru. The cap 99 is laterally perforated at the reference numeral 101, and the insulation cap 1 02 is sealed on the pore 101. The guiding rod 103 connects the rod body 102 to 1, and is provided with four electric brushes 104 at its inner end, and the brushes 104 is on the rod 97 and is uniquely different from the potential applied to the bore and other structures in the chamber. A bias potential is applied to the rod and thus to the outer chuck portion 95:/C.

As disclosed in U.S. Patent Specification Letter No. 4.219,397, issued August 26, 1980. The magnetron sputter gun 105, which has a conventional design, is all here. Although it is included for reference, it is The gate valve 15 is disposed in the display 12 on the opposite side of the gate valve 15 from that of the door 61.

The sputter gun 105 has an annular cathode section made of the material to be sprayed from the gun 1o5. The material 106 is provided. The cathode 106 operates at a potential of -VC relative to ground potential.

A disk-shaped anode 107 is placed in the center of the annular cathode 106 and is connected to the earth potential. Work at a potential of +Vα. Zetsuitai 108 and lO9 are respectively Yang'Gi 107 and the shade 1106 is removed from the glass bulb. Approximately cup-shaped spat made of stainless steel The metal shield turtle Ti11O is placed above the sputter gun 105, and Work with electrical potential. The spatter shield has an outwardly curved lip portion 111, and The conventional cup-shaped shielding electrode 112 is conveyed from the front surface thereof. A typical example of laughter The spatter shield 11'O is a cup-shaped shielding member made of stainless steel. A medium heat opening 113 is formed in the bottom wall of 110. There are multiple sputter shields 110. from the gun shield 112 via screws 114.

Gate valve 115 is made of Louis Vuitton bonnet seal material 10046-PE40ss It is of a conventional design, such as a type, and is powered by a 24 volt solenoid. The gate valve is from Boulder, Colorado. It is commercially available from HF2 Company. The gate valve 115 is connected to the tower-mounted lock portion 11 of the chamber. 7 and the wafer processing section 118 of the exhaust chamber 12 ((a throat section for gas retardation) The movable gate valve member 119 is attached to the valve body 11115. from the wafer processing section 118 to the tower locking section. Minute 117 is cut off.

During work, when the gate valve 15 closes, the door retreats to the open position, and the air cylinder closes the door. The retracted hanging chuck 57 retracts to a completely retracted position. Processing As mentioned above, the wafer 32 is moved to the top of the chuck 57 by the elevator blade 24. The ring is mounted on a large surface 58 that receives the wafer! 59 Makoto drawn above It is held there through the sky. Thereafter, the door 61 is opened by the action of the air cylinder 68. When closed, the opening plate 83 is sealed with the recessed seat portion 82 of the mounting plate 78. Once the door is sealed, the chuck will seal the chamber door. The wafer 3 is slightly advanced into the locking part 117 of the wafer 3, and the ring 85 is tightened. 2 to hold the wafer on the chuck 57. Chuck 57 is tightened When attached, the ring 85 and the tightening are brought into relationship in the radial direction ((the spring tower mounted facing The ball bearing 151 is located at the outer peripheral edge of the chuck 57, and is tightened by the ring 85. 122 to make electrical contact with the inner periphery of the holder. By this The clamping ring, chuck and wafer are applied via plan 104. The effect of working at the same potential as the ground potential is guaranteed. Ring 85 is with clasp. An insulating serpentine ring placed around the end of each guide rod 87. The wafer 32 is electrically insulated from the chamber wall and the guide rod 87 via 123. With the invasive roughing pump tightened to the chuck 57, the invasive roughing pump is The tower lock chamber 117 is evacuated to reduced pressure. Room 117 tower lock Once a suitable vacuum is achieved within the section, the gate valve 115 is actuated and the gate valve member 11 is activated. 9 withdraws from the throat section 116 and connects the turbomolecular port which communicates with the chamber via the exhaust pipe 18. The wafer processing section 1 of the chamber had previously been evacuated to a substantially high vacuum condition via the pump 17. Open the throat so that it communicates with 18. Communication with wafer processing chamber 118 within a few seconds The tower lock section 117 is evacuated to a relatively low pressure of 5X10-' Torr.

Turbomolecular pump 117 is backed up by a mechanical vacuum pump. after that , the treatment chamber 118 is filled with approximately 10-3) liters of gas using a suitable spackle gun, such as argon. Filled to sputtering pressure. The gate valve member 119 is inside the gate valve 15 (withdrawn). After that, the wafer chuck 57 is shielded from spatter by the air cylinder 65 and rod 64. The central part of the cover 110 is advanced to a position where it is in close contact with the bottom wall 125 which is open. Noriyoshi In the exemplary embodiment, the axial groove from the quay 32 to the end wall 125 is approximately zero. ．． It is 100 inches. Furthermore, the area of wafer 32 is located within sputter shield 110. Since it is located in almost the same space as the cross-sectional area of the central opening 113, the sputtering gun If all the material is on the wafer, on the exposed part of the clamping ring 85 or on the spatter shield The fruit will be harvested on the same inner surface of 110. In the spatuta force method, ion The plasma discharge is ignited in an evacuated room. The potential of plasma discharge is relative to the ground. (Positive, the parts of the structure exposed to the plasma when working at earth potential are This is so that you can experience the action. The configuration includes a sputter shield 110 and The wafer is positioned within the shield 110 to substantially close the central opening 113. , the action of throwing the material back onto the wafer is substantially controlled, i.e. within the shield 110. Material that has been blown off again from the section can be blown onto the wafer 32. For this reason , to the material blown away again from other parts of the chamber, including the valve body 15 and other parts. The risk of contamination of the wafer with blown material is thus avoided.

After the wafer 32 has been sputter coated to the desired thickness, the plasma is extinguished and the wafer 32 is sputter coated to the desired thickness. Ha and the chuck are installed in the tower lock area 1 of the chamber via the air cylinder 65 and the gift 64. Retreat to within 17. The gate valve 15 then closes the urethane/processing section 118 of the chamber. The chuck 5 is closed to maintain a high vacuum state through the groove 59. 7 will be pulled in. The tower lock chamber relaxes to atmospheric pressure, and the door 61 opens. As mentioned in step 5, lower the Ueno onto the Ueno elevator vane 24. typical work In order, the wafer was loaded into the chamber, sputtered and removed, and after 2 minutes, the wafer was transferred to the wafer carrier. It is possible to return to 29.

Now referring to FIG. 9, the wafer processing section 118 of the vacuum chamber 12 is shown. Ru. In particular, the cylindrical chamber 12 is bent outwardly at the reference numeral 13@min and the inspection port 12 6, through which the sputter gun 105 is axially inserted into the chamber 12. Ru. The inspection port 126 is located on an inspection cover with a recessed center portion that supports the O-ring 128. It is more closed and sealed, giving the flange 13 empty can properties. Sputter gun 1 05 is conveyed from the inner end of the concave cover plate 127. Hollow annular cooling fan The finger 128 is arranged indoors so as to surround the recessed corner portion of the inspection cover 127. , a cooling finger 1280-shaped circular portion and a cooling liquid source (not shown) such as liquid nitrogen. a cover 127 flanged outwardly through a fluid conduit providing fluid communication therebetween; It is transported from the Conduit 129 extends through axial bore 18 in cover plate 127. 1 and is hermetically sealed to the cover 127 via an annular sealing wire 132. . ) O-ring seals 133 and 134 connect wire 132 to conduit 129 and A work provided for sealing each washer 132 to the cover 127 Inside, cooling finger 128 is filled with liquid nitrogen and outside of finger 128.

Bring the temperature of the wall to near liquid nitrogen temperature, allowing water vapor and other condensate to rise above it. condensate and remove them from the atmosphere within the wafer processing portion 118 of the processing chamber. do.

Next, referring to Figure 10, the inspection cover 127) The underside cooling finger 1 28 and spack gun 105 (c1 right angle bracket 136 (diameter) and sliding block 135 is transported. The leg portion 137 of the bracket 136 is a sliding block 135 is pivotably pinned to and rotates around the vertical @138 passing through the bin 139. Turn around. The sliding and moving blocks 135 are arranged on a horizontal plane, each of which has a cylindrical chamber 12 and A pair of stainless steel guide rods parallel to the axis of rotation of the annular flange 13. The rod 141 slides on the rod 141 and is guided by the rod 141. Pair of guide rods 141 The inner end is secured to the frame by a support block 142.

Wafer covered; 7! Maintenance and cleaning of VAXL requires keeping the wafer processing room at atmospheric pressure. and slide the inspection cover plate 127 out of the cylindrical chamber 12 on the guide rod 141. It becomes easier by leaving it behind. Then the cover plate is attached to the hanging gun (with the shaft). Since it can be rotated around the sputter gun 105, it can be rotated around the Various parts, especially: τ sputter shielding material 110 and Cleaning the cooling fingers 128 becomes easier. In the same way, this time for Figure 8. In other words, when the inspection cover 127 is opened, the tightener easily approaches the ring 85. be able to.

The tightening is done by a ring, especially the part facing the direction of the sputter gaff 105, where the spattered material is removed. The covered part of the ring 85 must be removed for cleaning. It is desirable that This means that the tightening is done by the stainless steel part 1 inside the ring 85. 43 from the remainder of the ring 85. screw 144 Once removed, the ring 143 can be removed for cleaning and removal (C).

The advantage of the sputtering plate 11 according to the present invention is 1. The operating time of the machine wax is considerably improved. This makes maintenance easier, 2. Machinery has become considerably simpler, and as a result, machines are less likely to break down than before. Thus, the operating time is improved and manufacturing costs are concomitantly reduced. Ru.

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Claims (12)

[Claims] 1. for axially aligning and axially spacing rows of wafers. A side wall with a slot and a wafer pick-up vane passing through the bottom and top of the wafer. and a type of wafer with openings for moving wafers into and out of the wafer carrier. a wafer carrier cassette, each transfer stage of the wafer carrier cassette; In a method for accurately positioning wafers within a lot, the wafer carrier indexing by inserting the means at a precisely determined pitch through the open bottom of the Pick up the bottom edge of the wafer into each one of the slots in the wafer carrier. and position the wafer by the blades to facilitate movement of the wafer during use. A wafer positioning method characterized by: 2. Wafers with slots on the sidewalls to hold the wafer open at the top and bottom Wafers in carriers are shuttled between wafer carriers to wafer processing stations In a wafer processing machine that is transported, Passes laterally through the wafer carrier from the bottom and engages the wafer into the wafer processing station. a wafer picking means for transporting the wafer relative to the wafer carrier; and a bottom wall of the wafer carrier. and engages the bottom edge of the wafer to slightly lift the wafer and separate the wafer from each other. Accurately determine their axial position within the holding slot while using the wafer pick-up vanes. and an indexing means which facilitates movement by the roots during use. Wafer processing machine. 3. The indexing means includes an indexing member having a serrated structure disposed along an upper edge thereof. and the pitch of the sawtooth is locked by the sawtooth structure in the axial direction of the lifted wafer. According to claim 2, the method is such that the spacing is accurately determined. Wafer processing machine included. 4. The wafer is processed in an evacuated wafer processing chamber under reduced pressure; In a wafer processing machine where the chamber has a wafer inspection port in its wall, the wafer processing door means for closing and sealing a wafer inspection port in a laboratory; inside the wafer processing chamber to move with the wafer and hold the wafer in place for processing. a wafer chuck means working in the wafer chuck means and moving the gate member across the throat thereof; The mounting lock part of the wafer processing chamber is shielded from the processing part of the wafer processing chamber by and the throat portion is located between the tower lock portion and the processing portion of the wafer processing chamber. gate valve means within the evacuable chamber and translating the gate member from the throat portion; means for opening said gate valve means, said chuck means and operational means; associated with said chuck means and wafer from said tower lock portion of said chamber to said gate valve means; and chuck translation means for translation into the open throat. Wafer processing machine. 5. The chuck translation means moves the chuck and wafer through the open throat of the gate valve means. claim 4, wherein the wafer is translated into the processing portion of the wafer processing chamber through the The wafer processing machine described in section. 6. a wafer processing chamber for blowing material from the chuck onto the transported wafer; Claim 4 further comprising sputter gun means within said processing portion of the apparatus. The wafer processing machine described in . 7. The wafer is processed in an evacuated wafer processing chamber under reduced pressure; In a type of wafer processing machine where the chamber has a wafer inspection port in its wall, A door means for closing and sealing the wafer inspection port in the wafer processing chamber and the wafer under vacuum. Equipped with an anode and a cathode to create an ionizing plasma discharge inside the processing chamber, a sputter gun means for spraying material from said cathode thereof into a wafer processing chamber; C. Positioning the workpiece within the processing chamber and coating the material blown from the sputter gun means. chuck means for receiving the sputter gun and the chuck means separated from the wafer processing chamber wall; The spatter is surrounded by a plasma between the workpiece and the workpiece positioned by the yoke means. for collecting blown material that protrudes from the gun means and is not collected by the workpiece; A wafer processing machine comprising a spatter shielding means. 8. The spatter shielding means prevents protrusions of material blown from the sputtering gun means. an inwardly facing centrally open end wall surrounding and at the distal end of the sputtering gun means; a sidewall portion comprising a portion, the chuck means communicating with the central opening in the shielding means; Position the workpieces so that they are approximately in the same space, thereby A predominant portion of the material blown away by the spatter shielding means and the workpiece 8. The wafer processing machine according to claim 7, wherein the wafer processing machine is collected. 9. comprising means for transporting said shielding means from said sputtering gun means; A wafer processing machine according to claim 8. 10. The spatter shielding means is connected to the potential of the anode and cathode of the sputter gun means. Claims characterized in that the claim comprises electrical insulation means for electrically insulating the The wafer processing machine according to item 8. 11. A type of wafer in which the wafer is coated in an evacuated wafer processing chamber under reduced pressure. In a wafer processing machine, the wafer processing chamber has an inspection port in its wall, and the inspection port a cover means for closing and sealing the wafer processing chamber; gun means for extending and projecting material onto the workpiece to be coated within the wafer processing chamber; It is conveyed from the cover means and extends into the processing chamber, and is operated under reduced pressure to remove water vapor and the like inside the chamber. a cooling finger means for condensing other condensate and communicating with the cover means for cooling; a fluid conduit for supplying liquid to the cooling finger means within the processing chamber. Wafer processing machine. 12. The cooling finger means is substantially arc-shaped and substantially concentric with the gun means and The wafer processing device according to claim 11, wherein the wafer processing device is arranged outside the means. Science machine.