JPS6149492U - - Google Patents
Info
- Publication number
- JPS6149492U JPS6149492U JP13355784U JP13355784U JPS6149492U JP S6149492 U JPS6149492 U JP S6149492U JP 13355784 U JP13355784 U JP 13355784U JP 13355784 U JP13355784 U JP 13355784U JP S6149492 U JPS6149492 U JP S6149492U
- Authority
- JP
- Japan
- Prior art keywords
- heat generating
- fan
- heat
- cooling structure
- block part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 claims description 6
- 238000009423 ventilation Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13355784U JPS6149492U (zh) | 1984-09-04 | 1984-09-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13355784U JPS6149492U (zh) | 1984-09-04 | 1984-09-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6149492U true JPS6149492U (zh) | 1986-04-03 |
Family
ID=30692099
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13355784U Pending JPS6149492U (zh) | 1984-09-04 | 1984-09-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6149492U (zh) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1187964A (ja) * | 1997-09-09 | 1999-03-30 | Nippon Telegr & Teleph Corp <Ntt> | 電子回路パッケージおよびその実装体 |
| JP2005051127A (ja) * | 2003-07-30 | 2005-02-24 | Toshiba Home Technology Corp | 冷却モジュールおよび放熱体の積層構造 |
-
1984
- 1984-09-04 JP JP13355784U patent/JPS6149492U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1187964A (ja) * | 1997-09-09 | 1999-03-30 | Nippon Telegr & Teleph Corp <Ntt> | 電子回路パッケージおよびその実装体 |
| JP2005051127A (ja) * | 2003-07-30 | 2005-02-24 | Toshiba Home Technology Corp | 冷却モジュールおよび放熱体の積層構造 |