JPS6149469U - - Google Patents
Info
- Publication number
- JPS6149469U JPS6149469U JP13355884U JP13355884U JPS6149469U JP S6149469 U JPS6149469 U JP S6149469U JP 13355884 U JP13355884 U JP 13355884U JP 13355884 U JP13355884 U JP 13355884U JP S6149469 U JPS6149469 U JP S6149469U
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- check mark
- mark portion
- pattern
- peeled
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 239000011889 copper foil Substances 0.000 claims 2
- 230000002950 deficient Effects 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Landscapes
- Structure Of Printed Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13355884U JPS6149469U (en18) | 1984-09-04 | 1984-09-04 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13355884U JPS6149469U (en18) | 1984-09-04 | 1984-09-04 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6149469U true JPS6149469U (en18) | 1986-04-03 |
Family
ID=30692100
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13355884U Pending JPS6149469U (en18) | 1984-09-04 | 1984-09-04 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6149469U (en18) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007006149A (ja) * | 2005-06-23 | 2007-01-11 | Hosiden Corp | 電子部品 |
-
1984
- 1984-09-04 JP JP13355884U patent/JPS6149469U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007006149A (ja) * | 2005-06-23 | 2007-01-11 | Hosiden Corp | 電子部品 |