JPH0173969U - - Google Patents
Info
- Publication number
- JPH0173969U JPH0173969U JP1987168563U JP16856387U JPH0173969U JP H0173969 U JPH0173969 U JP H0173969U JP 1987168563 U JP1987168563 U JP 1987168563U JP 16856387 U JP16856387 U JP 16856387U JP H0173969 U JPH0173969 U JP H0173969U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- adhesive
- copper foil
- small electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 7
- 230000001070 adhesive effect Effects 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 239000011889 copper foil Substances 0.000 claims description 4
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987168563U JPH0173969U (en18) | 1987-11-05 | 1987-11-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987168563U JPH0173969U (en18) | 1987-11-05 | 1987-11-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0173969U true JPH0173969U (en18) | 1989-05-18 |
Family
ID=31457849
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987168563U Pending JPH0173969U (en18) | 1987-11-05 | 1987-11-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0173969U (en18) |
-
1987
- 1987-11-05 JP JP1987168563U patent/JPH0173969U/ja active Pending