JPS6149447A - Package for integrated circuit device - Google Patents

Abstract

PURPOSE:To insert and mount a large number of leads easily by making the length of internal leads longer than that of external leads in the arrangement of the leads. CONSTITUTION:A large number of leads lead out of both side surfaces of a package proper 1 are vertically bent downward where close by the main body 1 and where separate from it, thus each forming internal lead rows 2 and external lead rows 3. The length of vertical sections in several lead in the rows 2 is made longer than that of vertical sections in respective lead in the rows 3. The constitution is applied to three rows or more of lead rows. According to such constitution, the internal leads are inserted into correct positions first while being corrected when a package is mounted to a socket or a printed board, and the external leads can be inserted into accurate positions while being corrected. Consequently, a large number of the leads can be inserted and mounted easily without being broken and bent.

Description

DETAILED DESCRIPTION OF THE INVENTION A. Field of Industrial Application The present invention relates to a dual-in-line (DIP) type lead structure in which a large number of external leads are pulled out from both sides of the package body and then bent downward almost vertically. Array, however,
The present invention relates to a package for an integrated circuit device having three or more lead rows.

BACKGROUND OF THE INVENTION Currently, electronic components have greatly developed and are used in many fields, and depending on the field of use, it is necessary to make the electronic devices more compact. For example, the space allowed for mounting electronic devices for portable use, or electronic components such as wristwatches and cameras, is extremely small. Therefore, semiconductor integrated circuit devices are becoming thicker and more rigid as electronic circuit components.

Semiconductor integrated circuit devices themselves are becoming more highly integrated and their contents are becoming more complex year by year, and naturally the number of leads on lead frames attached to semiconductor integrated circuit device packages is also increasing. Integrated circuit packages come in single-in-line (SIP) and pool-in-line (1) IP) types depending on the number of rows in the lead array, but as the number of leads on lead frames increases, the lead array Things with two or more rows have begun to appear, and it is clear that there will be more drops in the future.

The problem here is that as the number of lead arrangements increases to 3 or 4 rows, it becomes difficult for manufacturers and users to insert the leads into sockets or printed circuit boards during evaluation tests, measurements, and mounting, leading to broken leads. This means that bending and the like are more likely to occur.

FIG. 2 is a front view of a conventional example of a package with four rows of leads that has already appeared. In the figure, the lengths in the height direction of the leads that are pulled out from both sides of the package body 1 and arranged in four rows including the inner lead row 12 and the outer lead row 13 are all the same. It is.

Problems to be Solved by the Invention In order to accurately insert the leads arranged in four rows into a socket or printed board as described above, it is necessary to correct the misalignment (unevenness) of the leads within one row. The problem is that the lead rows must be inserted at the same time, and it is particularly difficult to correct the leads in the inner lead row 12, making the insertion process very cumbersome.

Technical Means for Solving 20 Problems with TW To solve the above problems, in the present invention, while the lead length of the conventional package was the same on the inside and outside, the lead length of the inside (!11) The lead is longer than the outer lead.

By doing this, when inserting into a socket or printed board, you can first correct the inner lead and push it into the correct position, then correct the outer lead and push it into the correct position. .

To, Example Next, the present invention will be explained by examples.

FIG. 1 is a perspective view of an embodiment of the present invention. In the figure, a large number of leads pulled out from both sides of the package body 1 are bent vertically downward at positions close to and away from the package body 1 every other lead.
A lead row 2 and an outer lead row 3 are formed. The length of the vertical portion of each lead in the inner lead row 2 is longer than the length of the vertical portion of each lead in the outer lead row 3.

Note that this example describes four lead rows, but three
The present invention is similarly applied to lead rows having more than one lead row.

Effects of the Invention As mentioned above, the inner leads are longer than the outer leads, so when mounting on a socket or printed board, first insert the tips of the inner and sub leads into the lead insertion holes of the socket or printed board. By securing the correct insertion position and then inserting the outer lead while guiding it into the insertion hole, it is possible to easily insert a large number of leads without bending or bending the leads.

[Brief explanation of the drawing]

Figure 1 is the fruit of this invention! FIG. 2 is a front view of a conventional integrated circuit device package. ]...Package body, 2.12...
Inner lead row, 3,1.3...Outer lead row. Figure l $2Tf! J

Claims (1)

[Claims] In an integrated circuit device package having three or more rows of lead arrays in the same arrangement as the two lead arrays of a dual-in-line package, the length of the leads of the inner lead array among the lead arrays is set to the outer side. A package for an integrated circuit device characterized by having longer leads than a certain lead arrangement.