JPS6147644A - Method for controlling warpage of blade for slicer - Google Patents

Abstract

PURPOSE:To reduce cutting allowance and improve cutting speed by holding a blade from both side and controlling warpage thereof. CONSTITUTION:A blade 1 for slicer has the structure of internal circumference blade type and is rotated by a motor at a high speed through a belt 3. Meanwhile, a silicon single crystal 4 to be cut is placed on a support table 5 which can be moved horizontally pitch by pitch and also moved vertically and is then sent to the internal circumferential opening of blade 1. A blade displacement sensor 6 which detects displacement (or warpage) of blade 1 is provided adjacently to the blade 1. A control means 7 which is provided to the one point, or several points or entire part of circumference of both side surfaces of blade 1 generates air flow or magnetic field toward both side surfaces of blade 1 in order to realize forced control of displacement or warpage on the non-contact basis. Thereby, displacement or warpage of blade 1 can be controlled in optimum. Accordingly, the cutting allowance can be reduced and cutting speed can also be improved.

Description

[Detailed description of the invention] 〔Technical field〕 The present invention is a warpage control technology for slicer blades.

In particular, the present invention relates to a technique that is effective when applied to slice a semiconductor wafer from a silicon (St 2 ) single crystal material.

[Background technology]

It is conceivable that a blade for cutting a Si single crystal with a slicer to form a semiconductor wafer has a cutting edge on its inner periphery. This inner edge type slicer blade cuts the Si single crystal with its inner edge, but if the plane is warped, it may not be possible to cut the Si single crystal smoothly or there may be problems such as waste of material. cause

Therefore, a blade displacement sensor detects the amount of displacement of the blade or the curvature of the cut end face of the Si single crystal, and if the detected value is greater than the standard value, a dressing such as an alumina (A40g) grindstone can be applied to the cutting edge of the blade. It is possible to control the balance of sharpness of the blade edge and the asymmetry of the shape of the blade edge.

However, in such a warpage control method using dressing, since the dressing grindstone is brought into contact with the cutting edge of the blade, it is not possible to control the warpage of the blade while cutting the Si single crystal. Therefore, in this case, since dressing is performed each time a wafer is cut, warpage can only be controlled within a certain width.

Therefore, cutting is performed while the blade remains curved, making it impossible to increase the cutting speed. In addition, the inventor has found that in this case, there are problems such as chipping occurring at the edge of the wafer, large variations in the thickness of the wafer, and shortening of the life of the blade.

[Purpose of the invention]

An object of the present invention is to provide a blade warpage control technique that can reduce the occurrence of warpage due to blade displacement, reduce cutting allowance, and improve cutting speed.

The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.

[Summary of the invention]

A brief overview of typical inventions disclosed in this application is as follows.

That is, by holding the blade from both sides and controlling the warpage of the blade, the warpage of the blade can be reduced and reduced.
The above objective can be achieved.

[Embodiment 1] Fig. 1 is a partial perspective view of an apparatus for implementing Embodiment 1 of the present invention, Fig. 2(a) is a front view of the blade, and Fig. 2(a) is a front view of the blade.
b) is an enlarged sectional view taken along the line A-A.

In the first embodiment, a slicer blade 1 has a so-called internal blade type structure having a blade on a donut-shaped circumferential surface, and is rotated at high speed by a motor 2 via a belt 3.

On the other hand, the silicon (St) single crystal 4 that is the object to be cut is fed into the inner peripheral opening of the blade 1 while being held on a support table 5 that can be pitch-feeded in the horizontal direction and moved up and down. .

A blade displacement sensor 6 for detecting displacement (or warp) of the blade 1 is provided at one or more locations near the cut portion on the side surface of the blade 1 in close proximity to the blade 1.

In addition, one or several locations on both sides of the blade 1 (first
Control means 7 for forcibly suppressing the displacement (or warping) of the blade 1 in the plane direction is provided around the entire circumference (only one location is shown in the figure) or around the entire circumference. In order to forcibly suppress the displacement of the blade 1, the control means 7 generates an air flow or a magnetic field toward both sides of the blade 10, as shown by reference numeral 8 in FIG. It forcibly suppresses its displacement or warping without contact.

Therefore, the blade displacement sensor 6 is connected to the control means 7 via the control section 9, and the displacement information of the blade 1 detected by the blade displacement sensor 6 is fed back to the control means 7 via the control section 9. Forced displacement (or warpage) restraining forces such as air pressure or magnetic force from the blade 7 can be controlled, thereby allowing optimal control of the displacement or warpage of the blade 1 in-process at all times.

Note that the reference numeral 10 in FIG. 1 is a water supply nozzle for supplying water for cooling the blade of the blade 1.

[Embodiment 2] FIG. 3 is a partial sectional view showing a method for controlling warp of a slicer blade according to another embodiment of the present invention.

In this embodiment, a wear-resistant guide 7A is used as a control means to forcibly suppress the displacement or warping of the blade 1 through contact with the blade 1.

The wear-resistant guide 7A is made of metal coated with a wear-resistant material such as fluororesin, or made of metal that has been subjected to nitriding or induction hardening to improve its wear resistance.

In this embodiment, the displacement or warping of the blade 1 is forcibly suppressed by the wear-resistant guide 7A that is in direct contact with the side surface of the blade 1, making it possible to reduce the cutting allowance and improve the cutting speed.

〔effect〕

(1) By applying forced restraining force from both sides of the blade and controlling it to eliminate blade displacement or warpage,
It is possible to make the blade thinner.

(2) According to the above (1), the cutting allowance by the blade can be reduced and the waste of the material to be cut can be eliminated.

(3) Due to the above (1), the cutting resistance of the blade is reduced and the cutting speed is improved.

(4) Due to the above (1), variations in thickness are reduced.

There is no need to classify before wrapping.

(5) According to (1) above, the cutting resistance of the grindstone at the end of cutting becomes symmetrical, and chipping at the end of the object to be cut can be prevented.

(6) According to (1) above, forced contact between the blade and the object to be cut is eliminated, and the frequency of dressing is reduced, so that the life of the blade can be extended.

Although the invention made by the present inventor has been specifically described above based on Examples, it goes without saying that the present invention is not limited to the above-mentioned Examples, and can be modified in various ways without departing from the gist thereof. For example, as the wear-resistant material for the guide, various materials other than those mentioned above can be used.

Further, by using a rotating roller that rolls in contact with the blade as a guide, it is also possible to control the warping of the blade.

[Application field]

In the above description, the invention made by the present inventor was mainly applied to a blade for cutting St single crystals, which is the background field of application, but the invention is not limited thereto.

For example, it can be widely applied to blades for cutting brittle materials such as glass, ferrite, ceramics, and compound semiconductors.

[Brief explanation of drawings]

FIG. 1 is a schematic partial perspective view of an apparatus for carrying out a method for controlling warpage of a slicer blade according to an embodiment of the present invention, and FIGS. 2(a) and (b) are a front view of the blade and its Figure 3 is an enlarged partial cross-sectional view of a blade showing another embodiment of the present invention. 1...Blade, 2...Motor, 3...Belt,
4... St single crystal (object to be cut), 5... Support table, 6... Blade displacement sensor, 7... Control means,
7A... Wear-resistant guide, 8... Air flow or magnetic field, 9... Control unit, 10... Water supply nozzle. Agent Patent Attorney Akira Takahashi Mistake 1 Figure 2 (6L) 3 (b)

Claims (1)

[Scope of Claims] 1. A slicer blade for cutting articles with an inner circumferential blade, characterized in that warping of the blade is controlled by applying a forced restraining force from both sides of the rotating blade. How to control the warpage of a blade. 2. The method for controlling the warp of a blade for a slicer according to claim 1, wherein the warp of the blade is controlled in a non-contact manner using a fluid or a magnetic field. 3. The method for controlling the warpage of a slicer blade according to claim 1, characterized in that the warpage of the blade is controlled by a wear-resistant material in contact with the blade.