JPS6147501U - microwave stripline circuit - Google Patents
microwave stripline circuitInfo
- Publication number
- JPS6147501U JPS6147501U JP13126584U JP13126584U JPS6147501U JP S6147501 U JPS6147501 U JP S6147501U JP 13126584 U JP13126584 U JP 13126584U JP 13126584 U JP13126584 U JP 13126584U JP S6147501 U JPS6147501 U JP S6147501U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- ground conductor
- stripline circuit
- stripline
- microwave
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図aは従来例の上面図、第1図bは同図aのA−A
矢視断面図、第2図aは本考案の第1の実施例の上面図
、第2図bは同図aのB−B矢視断面′図、第3図aは
本考案の他の実施例の上面図、第3図bは同図aのC−
C矢視断面図、第4図aは本考案の第3の実施例の上面
図、第4図bは同図aのD−D矢視断面図。
図中、1・・・接地導体、2・・・ストリップライン回
路基板、3・・・ストリップライン回路基板、6川はん
だ逃げ溝、7・・・回路接続リボン、8・・・接地導体
、板、10・・・座ぐり。Figure 1a is a top view of the conventional example, and Figure 1b is A-A in Figure 1a.
FIG. 2a is a top view of the first embodiment of the present invention, FIG. 2b is a sectional view taken along line B-B of FIG. The top view of the embodiment, FIG. 3b is C- in FIG. 3a.
FIG. 4a is a top view of the third embodiment of the present invention, and FIG. 4b is a sectional view taken along line D-D in FIG. 4a. In the figure, 1...Grounding conductor, 2...Stripline circuit board, 3...Stripline circuit board, 6-way solder relief groove, 7...Circuit connection ribbon, 8...Grounding conductor, plate , 10...Spot facing.
Claims (1)
に際し、該ストリップライン回路基板全取付けるに際し
、該ストリップライン回路基板の周囲に沿うように前記
接地導体に溝を設け、この溝をはんだ逃げ及び位置合せ
として前記ストリップライン回路基板を前記接地導体に
はんだ付けして成ることを特徴とするマイクロ波ストリ
ップライン回路。 2 実用新案登録請求の範囲第1項記載のマイクロ波ス
トリップライン回路において、前記ストリップライン回
路基板の取付け面となる前記接地導体の溝の内側領域の
高さを、該ストリップライン回路基板面とこれに隣接し
て前記接地導体に取付けられる回路基板面とがそろうよ
うに設定したことを特徴とすφマイクロ波ストリッテラ
イン回路。[Claims for Utility Model Registration] 1. When installing a stripline circuit board on a ground conductor, when the entire strip line circuit board is installed, a groove is provided in the ground conductor along the periphery of the strip line circuit board; A microwave stripline circuit characterized in that the stripline circuit board is soldered to the ground conductor using grooves for solder relief and alignment. 2 Utility Model Registration In the microwave stripline circuit according to claim 1, the height of the inner region of the groove of the ground conductor, which is the mounting surface of the stripline circuit board, is set to be the same as that of the surface of the stripline circuit board. A φ microwave Stritter line circuit, characterized in that the circuit board surface adjacent to the ground conductor is aligned with the surface of the circuit board attached to the ground conductor.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13126584U JPS6147501U (en) | 1984-08-31 | 1984-08-31 | microwave stripline circuit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13126584U JPS6147501U (en) | 1984-08-31 | 1984-08-31 | microwave stripline circuit |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6147501U true JPS6147501U (en) | 1986-03-29 |
Family
ID=30689858
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13126584U Pending JPS6147501U (en) | 1984-08-31 | 1984-08-31 | microwave stripline circuit |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6147501U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010199392A (en) * | 2009-02-26 | 2010-09-09 | Toshiba Corp | High frequency module |
JP2018506860A (en) * | 2015-02-15 | 2018-03-08 | 華為技術有限公司Huawei Technologies Co.,Ltd. | Power pipe connection structure for power amplifier and power amplifier |
-
1984
- 1984-08-31 JP JP13126584U patent/JPS6147501U/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010199392A (en) * | 2009-02-26 | 2010-09-09 | Toshiba Corp | High frequency module |
JP2018506860A (en) * | 2015-02-15 | 2018-03-08 | 華為技術有限公司Huawei Technologies Co.,Ltd. | Power pipe connection structure for power amplifier and power amplifier |
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