JPS6144447Y2 - - Google Patents
Info
- Publication number
- JPS6144447Y2 JPS6144447Y2 JP1981005387U JP538781U JPS6144447Y2 JP S6144447 Y2 JPS6144447 Y2 JP S6144447Y2 JP 1981005387 U JP1981005387 U JP 1981005387U JP 538781 U JP538781 U JP 538781U JP S6144447 Y2 JPS6144447 Y2 JP S6144447Y2
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- substrate
- hole
- thermal conductivity
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 14
- 239000011889 copper foil Substances 0.000 claims description 14
- 230000017525 heat dissipation Effects 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 14
- 239000000758 substrate Substances 0.000 claims description 12
- 230000000694 effects Effects 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981005387U JPS6144447Y2 (US07494231-20090224-C00006.png) | 1981-01-20 | 1981-01-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981005387U JPS6144447Y2 (US07494231-20090224-C00006.png) | 1981-01-20 | 1981-01-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57119546U JPS57119546U (US07494231-20090224-C00006.png) | 1982-07-24 |
| JPS6144447Y2 true JPS6144447Y2 (US07494231-20090224-C00006.png) | 1986-12-15 |
Family
ID=29803766
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1981005387U Expired JPS6144447Y2 (US07494231-20090224-C00006.png) | 1981-01-20 | 1981-01-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6144447Y2 (US07494231-20090224-C00006.png) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4673949B2 (ja) * | 1999-11-12 | 2011-04-20 | 富士通株式会社 | 半導体ユニットおよびその製造方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5143563B2 (US07494231-20090224-C00006.png) * | 1972-04-03 | 1976-11-22 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5143563U (US07494231-20090224-C00006.png) * | 1974-09-27 | 1976-03-31 | ||
| JPS5479965U (US07494231-20090224-C00006.png) * | 1977-11-18 | 1979-06-06 |
-
1981
- 1981-01-20 JP JP1981005387U patent/JPS6144447Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5143563B2 (US07494231-20090224-C00006.png) * | 1972-04-03 | 1976-11-22 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57119546U (US07494231-20090224-C00006.png) | 1982-07-24 |
