JPS614422U - Chip type solid electrolytic capacitor - Google Patents
Chip type solid electrolytic capacitorInfo
- Publication number
- JPS614422U JPS614422U JP8820084U JP8820084U JPS614422U JP S614422 U JPS614422 U JP S614422U JP 8820084 U JP8820084 U JP 8820084U JP 8820084 U JP8820084 U JP 8820084U JP S614422 U JPS614422 U JP S614422U
- Authority
- JP
- Japan
- Prior art keywords
- anode
- solid electrolytic
- lead
- type solid
- electrolytic capacitor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は従来の断面図、第2図は本考案のコンデンサの
リードを折曲しない前の断面図、第3図は本考案の正面
図。
図面において、5i素子、6はモールド樹脂、7は陽極
導出線、11は陽極リード、12は陰極リード。FIG. 1 is a sectional view of a conventional capacitor, FIG. 2 is a sectional view of the capacitor of the present invention before the leads are bent, and FIG. 3 is a front view of the present invention. In the drawing, 5i element, 6 a mold resin, 7 an anode lead wire, 11 an anode lead, and 12 a cathode lead.
Claims (1)
膜層、半導体性金属酸化物層及び陰極層を順次積層形成
してコンデンサ素子となし、この素子を絶縁性樹脂でモ
ールド外装したチップ形固体電解コンデンサにおいて、
前記コンデンサ素子の陽極導出線に陽極リードが接続さ
れ、この素子の陰極層に陰極リードが接続され、これら
の陽蔭極両リードはモールド外装に沿ってL字形に対象
に折曲され、これらの両リードの先端部はモールド外装
の底部に配設され、この底部に配設された水平部のリー
ドの板厚T,に対し立上り部のリードの板厚T2の寸法
関係がT,> T2であることを特徴とするチップ形固
体電解コンデンサ。A chip in which a capacitor element is formed by sequentially laminating an anode oxide film layer, a semiconductor metal oxide layer, and a cathode layer on an anode body made of valve metal and has an anode lead wire, and this element is molded and exteriorized with an insulating resin. In solid electrolytic capacitors,
An anode lead is connected to the anode lead wire of the capacitor element, a cathode lead is connected to the cathode layer of this element, and both of these anode leads are bent symmetrically into an L-shape along the mold exterior. The tips of both leads are disposed at the bottom of the mold exterior, and the dimensional relationship between the thickness T2 of the horizontal lead disposed at the bottom and the thickness T2 of the lead at the rising part is T, > T2. A chip-type solid electrolytic capacitor characterized by:
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8820084U JPS614422U (en) | 1984-06-15 | 1984-06-15 | Chip type solid electrolytic capacitor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8820084U JPS614422U (en) | 1984-06-15 | 1984-06-15 | Chip type solid electrolytic capacitor |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS614422U true JPS614422U (en) | 1986-01-11 |
Family
ID=30641112
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8820084U Pending JPS614422U (en) | 1984-06-15 | 1984-06-15 | Chip type solid electrolytic capacitor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS614422U (en) |
-
1984
- 1984-06-15 JP JP8820084U patent/JPS614422U/en active Pending
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