JPS6142969A - Structure with photo transmission window - Google Patents

Structure with photo transmission window

Info

Publication number
JPS6142969A
JPS6142969A JP59164670A JP16467084A JPS6142969A JP S6142969 A JPS6142969 A JP S6142969A JP 59164670 A JP59164670 A JP 59164670A JP 16467084 A JP16467084 A JP 16467084A JP S6142969 A JPS6142969 A JP S6142969A
Authority
JP
Japan
Prior art keywords
glass
light
disk
transmission window
window glass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP59164670A
Other languages
Japanese (ja)
Inventor
Takashi Ikeda
孝 池田
Takashi Maehara
隆 前原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP59164670A priority Critical patent/JPS6142969A/en
Publication of JPS6142969A publication Critical patent/JPS6142969A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02Details

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Led Devices (AREA)
  • Led Device Packages (AREA)
  • Semiconductor Lasers (AREA)
  • Light Receiving Elements (AREA)

Abstract

PURPOSE:To prevent light loss by eliminating the deposits of glass fragments and the like on the glass surface, and removing light, by a method wherein the peripheral edge of a photo transmission window glass is formed into a fused plane by heating. CONSTITUTION:The peripheral edge of the photo transmission window glass 34 is formed into a fused plane by heating. For example, a glass raw material is fused into a plate glass and coated as required; thereafter, a plurality of pieces are laminated by being solidified with resin. Next, this is cut in prismatic form with a cutter, and then processed in cylindrical form with a lathe. Then, a disk glass 34 is obtained by fusing the resin with an organic flux. This disk glass 34 is placed on the tip of an adsorption rod 36 and held by suction under air pressure. While the adsorption rod 36 is rotated, the top of the burner 40 flame which has been adjusted as fine as possible is put to the processed surface of the disk glass 34; thus, the cleavage surface is formed into a softened fused plane by glass fusion. The disk glass thus formed is used as the photo transmission window glass.

Description

【発明の詳細な説明】 本発明は光透過用窓付構体に関し、一層詳細には、光の
通過経路上に配される光透過用窓ガラスの周縁部が加熱
軟化溶融処理されており、加工時に生じた臂開面のガラ
ス片が剥がれてガラス面に付着するという不具合を解消
しえ、半導体素子等の特性を妨げることのない光透過用
窓付構体に関するものである。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a structure with a light-transmitting window, and more particularly, the peripheral edge of the light-transmitting window glass disposed on the light passage path is heated to soften and melt. The present invention relates to a structure with a window for light transmission, which can solve the problem of glass pieces peeling off and adhering to the glass surface, which sometimes occurs when glass pieces are peeled off and sticking to the glass surface, and which does not impede the characteristics of semiconductor elements or the like.

レーザダイオード、フォトダイオード等の発光素子、受
光素子を搭載する半導体装置においては、第1図に示さ
れるように、光を通過させる光透過用窓ガラス10を有
するキャップ12を用いて半導体素子を気密封止してい
る。上記の光を通過させる光透過用窓ガラス10は、光
損失を極力抑えるため、僅かなゴミ等の付着もない完全
な清浄面を有するものであることが要求される。
In a semiconductor device equipped with a light emitting element and a light receiving element such as a laser diode and a photodiode, as shown in FIG. It's sealed. In order to suppress light loss as much as possible, the light transmitting window glass 10 that allows the light to pass through is required to have a completely clean surface without the slightest amount of dust or the like adhering to it.

従来における光透過用窓ガラスの製法について説明する
A conventional manufacturing method for light transmitting window glass will be explained.

(11原材料を加熱溶融し、板ガラスを造る。(11 Raw materials are heated and melted to make plate glass.

(2)必要な透過率を得るため、種々のコーティングを
施す。
(2) Various coatings are applied to obtain the required transmittance.

(3)次に所定の形状に加工する。この加工方法には以
下のものがある。
(3) Next, process it into a predetermined shape. This processing method includes the following.

イ、プレスにより打ち抜く。B. Punch out with a press.

口、ダイヤモンドカッター等で切断する。Cut with a cutter, diamond cutter, etc.

ハ、板ガラスを複数枚樹脂で固めて積層し、この積層し
たものを円柱あるいは角柱状に切断し、旋盤加工で仕上
げる。
C. Multiple plates of glass are hardened with resin and laminated, and the laminated glass is cut into cylinders or squares and finished using a lathe.

二、レーザー光線によって切断する。2. Cut by laser beam.

ところが上記イ0ロ、ハによる加工の場合、機械的な加
工であるところから、加工面が貝殻状の襞間面を成して
いる。また上記二による加工の場合、加工部周辺に無数
のマイクロクランクが発生している。このような襞開面
やマイクロクラ・ツクが発生している加工面からは、光
透過用窓ガラス10をキャップ12に低融点ガラスを用
いて封止する際等におけるすべてのハンドリング時に、
ガラス同士の接触、治具との接触、ピンセット等との接
触などにより微少ガラス片が襞間、脱落してガラス面に
付着する。
However, in the case of the processing according to A, B, and C above, since the processing is mechanical processing, the processed surface forms a shell-like interfold surface. In addition, in the case of machining according to the above-mentioned method 2, countless micro-cranks are generated around the machined part. During handling, such as when sealing the light-transmitting window glass 10 with the cap 12 using low-melting glass, the processed surface where such creases or microcracks have occurred may be removed.
Due to contact between pieces of glass, contact with a jig, contact with tweezers, etc., minute pieces of glass fall out between the folds and adhere to the glass surface.

ここで生じるガラス片は1μm〜100μm程度まで種
々あり、ガラス面に付着したガラス片は30μm以上の
ものは洗浄、エアー吹き付は等で除去可能であるが、3
0μm以下のものについては適切な除去方法がなく、光
透過用窓ガラスとして用いた場合に光損失を招くという
不具合がある。
The glass fragments generated here vary from 1 μm to 100 μm, and glass fragments of 30 μm or larger attached to the glass surface can be removed by cleaning, air blowing, etc.
There is no suitable removal method for particles with a diameter of 0 μm or less, which causes a problem of light loss when used as a light-transmitting window glass.

本発明は上記難点を解消すべくなされ、その目的とする
ところは、ガラス面にガラス片等の付着物がなく、光損
失を極力防止しうる光透過用窓付構体を提供するにあり
、その特徴は、発光素子1受光素子等を搭載し、光の通
過経路上に光透過用窓ガラスを有する半導体装置等の光
透過用窓付構体において、前記光透過用窓ガラスの周縁
部が加熱処理によって溶融面に形成されているところに
ある。
The present invention has been made to solve the above-mentioned problems, and its purpose is to provide a structure with a light transmission window that is free from adhesion such as glass fragments on the glass surface and can prevent light loss as much as possible. The feature is that in a structure with a light transmitting window such as a semiconductor device equipped with a light emitting element 1 light receiving element, etc. and having a light transmitting window glass on the light passage path, the peripheral edge of the light transmitting window glass is heat-treated. It is located on the molten surface formed by

以下本発明の好適な実施例を添付図面に基づき詳細に説
明する。
Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

第2図は本発明に係る光透過用窓付構体の実施例として
の半導体レーザー装置の概要を示す。
FIG. 2 shows an outline of a semiconductor laser device as an embodiment of the structure with a window for light transmission according to the present invention.

20はアイレット(金属外環)、22は受光半導体素子
、24はレーザー素子、26はリード線である。
20 is an eyelet (metallic outer ring), 22 is a light-receiving semiconductor element, 24 is a laser element, and 26 is a lead wire.

28はキャップであり、アイレット20上面を覆って固
着され、受光半導体素子22、レーザー素子24を気密
に封じている。
A cap 28 is fixed to cover the upper surface of the eyelet 20, and hermetically seals the light-receiving semiconductor element 22 and the laser element 24.

キャップ28の上面開口部には光透過用窓ガラス30が
低融点ガラス32によって気密封止されている。
A light transmitting window glass 30 is hermetically sealed in the upper opening of the cap 28 with a low melting point glass 32 .

本発明において特徴的なことは、上記の光透過用窓ガラ
ス30の周縁部が加熱処理によって溶融面に形成されて
いるところにある。
A feature of the present invention is that the peripheral edge of the above-mentioned light-transmitting window glass 30 is formed into a melted surface by heat treatment.

光透過用窓ガラス30の製造工程の一例を以下に示す。An example of the manufacturing process of the light transmitting window glass 30 is shown below.

まず、ガラス原材料を溶融し、板ガラスに形成し、所定
のコーティングを施したのち、樹脂で固めて複数枚積層
する。次にこれを適宜なカッターによって角柱状に切断
し、次いで旋盤を用いて円柱状に加工する。次に有機溶
剤を用いて樹脂を溶解し、第3図に示すように円板状ガ
ラス34を得る。この円板状ガラス34は機械的加工工
程を経ているから、その加工面たる周縁部は貝殻状襞間
面となっているところは従来と同様である。
First, glass raw materials are melted, formed into sheet glass, coated with a predetermined coating, solidified with resin, and laminated into multiple sheets. Next, this is cut into a prismatic shape using an appropriate cutter, and then processed into a cylindrical shape using a lathe. Next, the resin is dissolved using an organic solvent to obtain a disk-shaped glass 34 as shown in FIG. Since this disk-shaped glass 34 has undergone a mechanical processing process, its processed surface, which is the peripheral edge, is a shell-like interfold surface, which is the same as in the prior art.

次に上記円板状ガラス34を、第4図に示す吸着棒36
先端に載せる。吸着棒36では円板状ガラス34をエア
圧によって吸引保持する。なお38は吸着バンドである
Next, the disk-shaped glass 34 is attached to a suction rod 36 shown in FIG.
Place it on the tip. The suction rod 36 suctions and holds the disk-shaped glass 34 using air pressure. Note that 38 is an adsorption band.

次に吸着棒36を回転させつつ、円板状ガラス34の加
工面に、バーナー40の極力細<調整した炎先端を当て
、ガラスを溶かして襞開面を軟化溶融面に形成するもの
である。このように形成した円板状窓ガラスを光透過用
窓ガラス30として用いる。なお、バーナー40の炎は
ガラス面に歪を生じさせないために、周縁の加工面にの
み当てる必要がある。また、円板状ガラス34は固定さ
せておき、バーナー40を適宜機構によって回転させて
もよい。
Next, while rotating the suction rod 36, the tip of the flame of the burner 40, which has been adjusted to be as fine as possible, is applied to the processed surface of the disk-shaped glass 34, melting the glass and forming a folded surface into a softened and melted surface. . The disk-shaped window glass formed in this way is used as the light transmission window glass 30. Note that the flame of the burner 40 needs to be applied only to the peripheral processed surface in order not to cause distortion on the glass surface. Alternatively, the disk-shaped glass 34 may be fixed and the burner 40 may be rotated by an appropriate mechanism.

なお光透過用窓ガラスは円板状でなく、例えば矩形状等
であってもよいことはもちろんである。
It goes without saying that the light-transmitting window glass may have a rectangular shape, for example, instead of a disk shape.

また製造方法は上記に限られず、例えば加熱手段は電気
的手段その他適宜な手段を採用しうる。
Further, the manufacturing method is not limited to the above, and for example, as the heating means, electric means or other appropriate means may be employed.

また上記は光透過用窓ガラス30がキャップ28に気密
封止される半導体レーザー装置について説明したが本発
明はこれに限られることはなく、例えば光透過用窓ガラ
ス30が装置内部に組み込まれる半導体装置、あるいは
光通信分野等における装置において光透過用窓ガラスが
必要位置に組み込まれる装置等においても応用しうるち
のである。
Furthermore, although the above description has been made regarding a semiconductor laser device in which the light transmitting window glass 30 is hermetically sealed in the cap 28, the present invention is not limited to this, and for example, a semiconductor laser device in which the light transmitting window glass 30 is incorporated inside the device. The present invention can also be applied to devices in the field of optical communication, etc., in which a light-transmitting window glass is installed at a necessary position.

以上のように本発明に係る光透過用窓付構体によれば、
光透過用窓ガラスの加工面が加熱処理されて溶融面に形
成されているから、従来のように加工面の璧開面やマイ
クロクランク部からガラス片が脱落してガラス面に付着
するという不具合がなく、ガラス面が常に完全な清浄面
に保てるから、光損失がなく、業界の厳しい要求に応え
る光透過用窓付構体を提供することができるという著効
を奏する。
As described above, according to the structure with a light transmission window according to the present invention,
Because the processed surface of the light-transmitting window glass is heated and formed into a molten surface, there is the problem that glass pieces fall off from the cracked surface or micro-crank part of the processed surface and adhere to the glass surface, as in the past. Since the glass surface can always be kept completely clean, there is no light loss and it is possible to provide a structure with a light transmission window that meets the strict requirements of the industry.

以上本発明につき好適な実施例を挙げて種々説明したが
、本発明はこの実施例に限定されるものではなく、発明
の精神を逸脱しない範囲内で多くの改変を施し得るのは
もちろんのことである。
Although the present invention has been variously explained above with reference to preferred embodiments, the present invention is not limited to these embodiments, and it goes without saying that many modifications can be made without departing from the spirit of the invention. It is.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は半導体装置のキャップの説明図、第2図は光透
過用窓付構体の一例としての半導体レーザー装置の概要
を示す断面図、第3図は円板状ガラスの斜視図、第4図
は円板状ガラスの加工面にバーナーの炎を当てて軟化溶
融面とする工程の説明図である。 10・・・光透過用窓ガラス、  12・・・キャップ
、  20・・・アイレット  22・・・受光半導体
素子、  24・・・レーザー素子。 26・・・リード線、  28・・・キャップ。 30・・・光透過用窓ガラス、  32・・・低融点ガ
ラス、  34・・・円板状ガラス、  36・・・吸
着棒、  38・・・吸着パッド、   40・・・バ
ーナー。
FIG. 1 is an explanatory diagram of a cap of a semiconductor device, FIG. 2 is a sectional view showing an outline of a semiconductor laser device as an example of a structure with a window for light transmission, FIG. 3 is a perspective view of a disk-shaped glass, and FIG. The figure is an explanatory view of the process of applying burner flame to the processed surface of a disk-shaped glass to soften and melt the surface. DESCRIPTION OF SYMBOLS 10... Window glass for light transmission, 12... Cap, 20... Eyelet 22... Light receiving semiconductor element, 24... Laser element. 26...Lead wire, 28...Cap. 30... Window glass for light transmission, 32... Low melting point glass, 34... Disc shaped glass, 36... Suction rod, 38... Suction pad, 40... Burner.

Claims (1)

【特許請求の範囲】[Claims] 1、発光素子、受光素子等を搭載し、光の通過経路上に
光透過用窓ガラスを有する半導体装置等の光透過用窓付
構体において、前記光透過用窓ガラスの周縁部が加熱処
理によって溶融面に形成されていることを特徴とする光
透過用窓付構体。
1. In a structure with a light-transmitting window such as a semiconductor device that is equipped with a light-emitting element, a light-receiving element, etc. and has a light-transmitting window glass on the light passage path, the peripheral edge of the light-transmitting window glass is heated. A structure with a light transmission window, characterized in that it is formed on a molten surface.
JP59164670A 1984-08-06 1984-08-06 Structure with photo transmission window Pending JPS6142969A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59164670A JPS6142969A (en) 1984-08-06 1984-08-06 Structure with photo transmission window

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59164670A JPS6142969A (en) 1984-08-06 1984-08-06 Structure with photo transmission window

Publications (1)

Publication Number Publication Date
JPS6142969A true JPS6142969A (en) 1986-03-01

Family

ID=15797594

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59164670A Pending JPS6142969A (en) 1984-08-06 1984-08-06 Structure with photo transmission window

Country Status (1)

Country Link
JP (1) JPS6142969A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6181720B1 (en) 1997-01-16 2001-01-30 Nec Corporation Semiconductor laser device and method for manufacturing same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6181720B1 (en) 1997-01-16 2001-01-30 Nec Corporation Semiconductor laser device and method for manufacturing same

Similar Documents

Publication Publication Date Title
US10315403B2 (en) Method for cutting object to be processed
KR100549982B1 (en) Method for Producing Small, Sheet Glass Plates and Larger Sheet Glass Plates as Semi-finished Products for Producing the Former
JP4907965B2 (en) Laser processing method
KR101721709B1 (en) Method for cutting processing target
JPS61229487A (en) Method for cutting glass by laser beam
US5745989A (en) Method of preparation of an optically transparent article with an embedded mesh
WO2005088689A1 (en) Method for cutting object to be processed
KR100420919B1 (en) Cutting method of masking sheet for silicon wafer processing
KR20070034974A (en) Method of separating member from substrate
JP3509985B2 (en) Chip separation method for semiconductor device
JPS6142969A (en) Structure with photo transmission window
US7491288B2 (en) Method of cutting laminate with laser and laminate
JP2014201452A (en) Glass-ceramic joined body
JP2564836B2 (en) Method of coupling substrate of optical integrated circuit and optical fiber
JPH02440Y2 (en)
JPS58143553A (en) Manufacture of semiconductor device
JP2003088989A (en) Method for breaking and cutting with laser beam, method for manufacturing lens or lens mold using the method for breaking and cutting and lens and lens mold formed with the method for manufacturing
JPH01215736A (en) Cutting of thin glass plate
WO2023067860A1 (en) Protective cap, electronic device, and protective cap production method
JP2020040863A (en) Composite article manufacturing method, and composite article
JP3635651B2 (en) Window glass for optical semiconductor and optical semiconductor module
JP7233815B2 (en) Dummy wafer and dummy wafer manufacturing method
JPS62105934A (en) Production of optical element
KR20210152773A (en) Optical filter and manufacturing method of the optical filter
JP2564837B2 (en) Method of coupling substrate of optical integrated circuit and optical fiber