JPS6139406A - Transparent conductive film - Google Patents

Transparent conductive film

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Publication number
JPS6139406A
JPS6139406A JP59159179A JP15917984A JPS6139406A JP S6139406 A JPS6139406 A JP S6139406A JP 59159179 A JP59159179 A JP 59159179A JP 15917984 A JP15917984 A JP 15917984A JP S6139406 A JPS6139406 A JP S6139406A
Authority
JP
Japan
Prior art keywords
film
transparent conductive
adhesion
conductive film
curable organic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59159179A
Other languages
Japanese (ja)
Other versions
JPH0424803B2 (en
Inventor
白川 雅義
邦生 上田
孝史 小林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nissan Chemical Corp
Original Assignee
Nissan Chemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nissan Chemical Corp filed Critical Nissan Chemical Corp
Priority to JP59159179A priority Critical patent/JPS6139406A/en
Publication of JPS6139406A publication Critical patent/JPS6139406A/en
Publication of JPH0424803B2 publication Critical patent/JPH0424803B2/ja
Granted legal-status Critical Current

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Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 産業上の利用分野 本発明は透明導電性フィルムに関する。[Detailed description of the invention] Industrial applications The present invention relates to transparent conductive films.

より詳細には高分子フィルムと金属又は金属酸化物との
密着性をあげる為中間に特定のナタネ機被膜を設けたこ
とを特徴とする。
More specifically, it is characterized in that a specific rapeseed coating is provided in the middle to improve the adhesion between the polymer film and the metal or metal oxide.

従来の技術 従来ガラス基板にインジウム−スズ酸化物。Conventional technology Conventional glass substrate with indium-tin oxide.

スズ酸化物などの薄膜を設けた透明導電性ガラスが透明
面発熱体、各種表示素子1選択光透過性ガラスなどに用
いられている。
Transparent conductive glass provided with a thin film of tin oxide or the like is used for transparent heating elements, selective light transmitting glass for various display elements, and the like.

これらの薄膜は通常真空蒸着、スパッタリング、イオン
ブレーティングなど真空系を用いた手法により膜付けさ
れている。しかし、透明導電性ガラスはガラスの機械的
強度及び製造上の制約から軽量化が困難であり、衝撃に
も弱いという欠点がある。又本来的に屈曲性がなく9曲
面への適用や作業性に限界があった。
These thin films are usually deposited by a method using a vacuum system, such as vacuum evaporation, sputtering, or ion blasting. However, transparent conductive glass has the disadvantage that it is difficult to reduce its weight due to the mechanical strength of the glass and manufacturing constraints, and it is also susceptible to impact. Furthermore, it inherently lacks flexibility, which limits its applicability to nine curved surfaces and its workability.

これらの透明導電性ガラスの欠点を改善する為ポリエス
テルなどの高分子フィルムの表面に透明導電性波IIK
を設ける方法が検討され、透明面発熱体、透明スイッチ
、各種表示素子9選択光透過性フィルムなどの用途に広
く利用されるようになってきた。
In order to improve these drawbacks of transparent conductive glass, transparent conductive waves IIK are applied to the surface of polymer films such as polyester.
A method of providing a transparent surface has been studied, and it has come to be widely used in applications such as transparent heating elements, transparent switches, and selective light-transmitting films for various display elements.

しかしながら、高分子フィルム上の透明導電性波膜は直
接には高分子フィルムとの密着性が悪く、シかも耐薬品
性、耐摩耗性が劣っている為限られた用途にのみ用いら
れ又取扱いに特別の注意を必要とするなどの問題がある
However, the transparent conductive corrugated film on the polymer film has poor adhesion to the polymer film and poor chemical resistance and abrasion resistance, so it is used only for limited purposes and is not handled well. There are other issues that require special attention.

高分子フィルムと透明導電性被膜との密着性が悪い理由
として次のことが考えられる。
Possible reasons for poor adhesion between the polymer film and the transparent conductive coating are as follows.

(1)  蒸着、スパッタリングなどにより透明導電性
被膜を設ける際、ガラスは通常600℃程度まで加熱で
きるが、高分子フィルムは耐熱温度が低く実際上それほ
どの高温に加熱出来ない場合が多い。
(1) When forming a transparent conductive film by vapor deposition, sputtering, etc., glass can usually be heated to about 600°C, but polymer films often have a low heat resistance and cannot actually be heated to such high temperatures.

(3)  高分子フィルム中には、七ツマ−、オリゴマ
ー、有機溶剤などの低分子物が含まれる場合があり真空
系でこれらの低分子物が揮散することがある。
(3) The polymer film may contain low-molecular substances such as polymers, oligomers, and organic solvents, and these low-molecular substances may volatilize in a vacuum system.

(4)  ガラスに較べ高分子フィルムは耐薬品性が悪
く洗浄工程で制限を受ける。この為ガラスよりも表面が
汚損されている可能性がある。
(4) Compared to glass, polymer films have poor chemical resistance and are subject to limitations in the cleaning process. For this reason, there is a possibility that the surface is more contaminated than glass.

(5)高分子フィルムの表面はガラスよりも平滑性が悪
い。
(5) The surface of a polymer film is less smooth than glass.

高分子フィルムと透明4を性被膜との密着性をあげる試
みとしてポリエステルフィルム上に硬化性高分子ti 
を形成し、ポリエステルフィルム中のオリゴマーの揮散
を防止する方法(特開昭5.5−144986)、高分
子フィルム上にこれより硬質な有機物層を設は透明導電
性被膜の耐摩耗性を改良する方法(4!!P開昭56−
1045(+)、高分子フィルムと透明導電性被膜の間
に有機ケイ素化合物を設は透明導電性被膜と高分子フィ
ルムとの密着性を向上させる方法(特開昭57−159
145)があるがいまだ十分なf!着性は得られていな
い。
In an attempt to improve the adhesion between the polymer film and transparent coating, a curable polymer Ti was applied on the polyester film.
A method for forming a polyester film and preventing the volatilization of oligomers in a polyester film (Japanese Unexamined Patent Publication No. 5.5-144986), which improves the abrasion resistance of a transparent conductive film by forming a harder organic layer on a polymer film. How to do it (4!!P Kaisho 56-
1045(+), a method for improving the adhesion between a transparent conductive film and a polymer film by providing an organosilicon compound between the polymer film and the transparent conductive film (Japanese Unexamined Patent Publication No. 57-159
145), but there is still enough f! Adhesion was not achieved.

本発明の動機 一般に有機物たる高分子フィルムと無機物たる透明導電
性波膜の密着性を計るには両方に親オロ性のある化合物
からなる中間層を設けることがおこなわれるが中間層自
体の機械的強度が低くては出来上った透明導電性フィル
ムの実用性が制約をうけることになる。即ち、高分子フ
ィルム、中間層、透明導電性被膜の王者に機械的強度の
バランスが要求されるのである。中間層自体の強度を得
るには中間層に硬化性有機被膜を用いる方法が浸れてい
るが密着性の点では不清足である。即ち、無機物との密
着性を得る為には硬化性有機被膜自体が無機物と良好な
密着性をもっていなければならない。そのために。
Motive of the present invention Generally, in order to measure the adhesion between an organic polymer film and an inorganic transparent conductive wave film, an intermediate layer made of an olophilic compound is provided on both. If the strength is low, the practicality of the resulting transparent conductive film will be limited. That is, a balance of mechanical strength is required for the king of polymer films, intermediate layers, and transparent conductive coatings. In order to obtain the strength of the intermediate layer itself, it is possible to use a curable organic film in the intermediate layer, but this method is insufficient in terms of adhesion. That is, in order to obtain adhesion to inorganic substances, the curable organic film itself must have good adhesion to inorganic substances. for that.

硬化性有機被膜にある一定の添加剤を配合し。Contains certain additives in the curable organic coating.

機械強度の面では前者の特長を生かしつつ、密着性の面
では後者の作用を活用するという方法がとられている。
The method used is to take advantage of the former feature in terms of mechanical strength, while utilizing the latter effect in terms of adhesion.

この場合、密着性にのみ着目して、添加剤の配合比を高
めると、硬化性有機被膜の機械的特性が損われるし、配
合比が低いと添加剤が硬化性有機被膜中に稀釈分散され
密着性が著しく減する結果くなる。
In this case, if we focus only on adhesion and increase the blending ratio of additives, the mechanical properties of the curable organic film will be impaired, and if the blending ratio is low, the additives will be diluted and dispersed in the curable organic film. This results in a significant decrease in adhesion.

本発明者は種々検討の結果、従来の矛盾を克照し特定の
添加物を硬化性有機被11H中に一定量添加することに
より透明4電性被膜との密着性が大巾に向上することを
見出し本発明を完成するに至った。
As a result of various studies, the present inventor has overcome the conventional contradictions and found that by adding a certain amount of a specific additive to the curable organic coating 11H, the adhesion with the transparent tetraelectric coating can be greatly improved. This discovery led to the completion of the present invention.

本発明の要旨 本発明における特定の添加物とは R:アルキル基  Hm 1〜5 の一般式で示される特定のチタネート系カップリング剤
である。
Summary of the Invention The specific additive in the present invention is a specific titanate coupling agent represented by the general formula R: alkyl group Hm 1-5 .

具体的な化合物例としてはイソプロピルトリス(ジオク
チルパイロホスフェート)チタネート(商品名グレンア
クト513B、味の素KK)。
A specific example of the compound is isopropyl tris (dioctyl pyrophosphate) titanate (trade name: GlenAct 513B, Ajinomoto KK).

ビス(ジオクチルパイロホスフェート)オキシアセテー
トチタネート(商品名プレンアクト158 B、味の素
KK)、ビス(ジオクチルパイロホスフェート)エチレ
ンチタネート(商品名プレンアク)258S、味の素K
K)  などである。
Bis(dioctyl pyrophosphate) oxyacetate titanate (trade name Prene-Act 158 B, Ajinomoto KK), bis(dioctyl pyrophosphate) ethylene titanate (trade name Prene-Ac) 258S, Ajinomoto K
K) etc.

添加量は硬化性有機被膜に対し2〜10重量パーセント
が好ましい。添加量が2を量パーセント以下であると、
添加物を含む硬化性有機被膜と無機物たる透明導電性被
膜相互の密着力が不充分であり9反ct1a重量パーセ
/ト以上では硬化性有機被膜の特長が減殺される。
The amount added is preferably 2 to 10 percent by weight based on the curable organic film. When the amount added is less than 2%,
The adhesion between the curable organic coating containing additives and the inorganic transparent conductive coating is insufficient, and the advantages of the curable organic coating are diminished if the coating exceeds 9% by weight per ct1a.

本発明に適当とされる高分子フィルムとしては実質的に
透明なポリエチレンテレフタレート。
Polymeric films suitable for the present invention include substantially transparent polyethylene terephthalate.

ポリカーボネート、ポリサルホン、ポリエーテルサルホ
ン、ポリエチレン、ポリプロピレン。
Polycarbonate, polysulfone, polyethersulfone, polyethylene, polypropylene.

ポリ塩化ビニール、アセテート、ポリスチレン。PVC, acetate, polystyrene.

ボリアリレート、ポリエーテルエーテルケトン。Polyarylate, polyetheretherketone.

フッ素樹脂、ポリイミドなどのフィルムが用いられる。Films made of fluororesin, polyimide, etc. are used.

 ゛ 硬化性有機被膜の選定に当っては、高分子フィルムと密
着性が良好であること、かつ9本発明のチタネートカッ
プリング剤と相溶性の充分なものであれば任意に選択可
能であ9熱硬化性有機被膜又は紫外線硬化性有機被膜い
ずれでも良い。
゛When selecting the curable organic film, any film can be selected as long as it has good adhesion to the polymer film and is sufficiently compatible with the titanate coupling agent of the present invention9. Either a thermosetting organic coating or an ultraviolet curable organic coating may be used.

熱硬化性有機被膜に用りられる樹脂の例としではエボキ
7系樹脂、ウレタン系樹脂、ポリエステル系樹脂、メラ
ミン系樹脂、アクリル系樹脂、尿素系樹脂などがあげら
れる。
Examples of resins used for the thermosetting organic film include EBOKI 7 resin, urethane resin, polyester resin, melamine resin, acrylic resin, and urea resin.

紫外線硬化性有機被膜に用いられる樹脂の例としてアク
リル系樹脂、エポキシ系樹脂、ウレタン系樹脂などがあ
る。
Examples of resins used for ultraviolet curable organic coatings include acrylic resins, epoxy resins, and urethane resins.

硬化性有機被膜の厚みは1〜10μmであることが好ま
しい。これよ抄薄い場合硬化性有機被膜の均一な塗布が
困難で透明導電性被膜との密着性が不均一とな抄良好な
透明導電性フィルムを得(〈くなる。又これより厚い場
合、硬化性有機被膜の屈曲性の低下や高分子フィルムと
硬化性有機被膜との密着性の低下が生じ好ましくない。
The thickness of the curable organic film is preferably 1 to 10 μm. If the film is thinner than this, it is difficult to uniformly apply the curable organic film and the adhesion to the transparent conductive film becomes uneven. This is undesirable because it causes a decrease in the flexibility of the curable organic coating and a decrease in the adhesion between the polymer film and the curable organic coating.

本発明における硬化性有機被膜を設けた高分子フィルム
は真空蒸着法、スパッタリング法。
The polymer film provided with the curable organic film in the present invention is produced by vacuum deposition method or sputtering method.

イオンブレーティング法などにより透明導電性被膜を形
成する。透明導電性被膜に用いられる金属酸化物はIn
、O,、日no、等、又はこれらの混′合物が挙げられ
る。又金属としては^u、Pt、Pbなどが挙げられる
A transparent conductive film is formed using an ion blating method or the like. The metal oxide used for the transparent conductive film is In
, O,, day no, etc., or a mixture thereof. Examples of the metal include u, Pt, and Pb.

本発明による透明導電性フィルムは密着性。The transparent conductive film according to the present invention has good adhesion.

機械的強度の両面ですぐれてお抄透明面発熱体。A transparent heating element with excellent mechanical strength.

透明スイッチ、各種表示素子9選択光透過性フィルムな
どの用途に利用できる。
It can be used for applications such as transparent switches and various display elements 9 selective light transmitting films.

以下実施例によね詳細に説明する。This will be explained in detail in Examples below.

実施例 実施例1.比較例1 ユニオンカーバイト社製ポリサルホン樹脂を溶融IAM
法により100μmのフィルムに製膜した。次に以下に
述べるコーティング剤の固形分く対し第1表に示す添加
物を5重量パーセント添加しメイヤーバーコーターヲ用
い、フィルム上に硬化被膜として5μm厚さになるよう
塗布後160℃5分間乾燥、硬化させ硬化性有機被膜を
作製した。
Examples Example 1. Comparative Example 1 Melting polysulfone resin manufactured by Union Carbide Co., Ltd. using IAM
A 100 μm film was formed by the method. Next, 5% by weight of the additives shown in Table 1 were added to the solid content of the coating agent described below, and coated on the film using a Mayer bar coater to form a cured film with a thickness of 5 μm, and then dried at 160°C for 5 minutes. , to produce a curable organic film.

コーティング剤は次の組成からなる。The coating agent consists of the following composition.

エポキク樹脂(エポ) −トYD7019.東部化成社
製)21重量パーセント メラばン樹脂〔ニーパン22R1三井東圧化学社製)9
ffiffi:パーセント 溶媒 キラV7       49重量パーセントN−
ブタノール    21重量′4−ゝ′トその後、硬化
性有機被膜上にインジウム−スズ酸化物のスパッタリン
グを行ない透明導電性被膜を形成した。
Epoxy resin (Epo) - YD7019. (Manufactured by Tobu Kasei Co., Ltd.) 21% by weight Melaban resin (Kneepan 22R1 Manufactured by Mitsui Toatsu Chemical Co., Ltd.) 9
ffiffi: percent solvent Kira V7 49 weight percent N-
After that, indium-tin oxide was sputtered onto the curable organic film to form a transparent conductive film.

スパッタリング条件 スパッタリング装置 高周波スパッタリング装置ターゲ
ット    インジウムスズ酸化物(スズ酸化物 5重
−vk3ざ) ガス種、圧力   アルゴン 5 x 10  Tor
r透明導電性被膜厚 500λ 表面抵抗  500m/スケアー 透明導電性被膜の密着性評価は次の方法にょ9行なった
Sputtering conditions Sputtering equipment High frequency sputtering equipment target Indium tin oxide (tin oxide 5-vk3) Gas type, pressure Argon 5 x 10 Tor
rTransparent conductive film thickness: 500λ Surface resistance: 500 m/square Adhesion of the transparent conductive film was evaluated by the following method.

(1)  セロテープはく離試験 セロテープを透明導電性被膜上に貼りつけ180°はぐ
り試験を4回くり返す。試験前の表向抵抗(R,)と試
験後の表面抵抗(Et)の比R/−によ抄あられす。
(1) Cellotape peeling test Cellotape was pasted on the transparent conductive coating and the 180° peeling test was repeated four times. It is determined by the ratio R/- of the surface resistance (R,) before the test and the surface resistance (Et) after the test.

(2)耐アルカリ性試験 5X苛性ソーダ水溶液に5分間浸漬する。(2) Alkali resistance test Soak in 5X caustic soda solution for 5 minutes.

試験前の表面抵抗(Ro)と試験後の表面抵抗(R)と
の比R/R0によりあられす。又試験後の透明導電性被
膜を光学顕微鏡を用い70倍にて観察し耐アルカリ性試
験後のフィルム外観をもって判定した。試験結果を第2
表に示す。
It is determined by the ratio R/R0 of the surface resistance (Ro) before the test and the surface resistance (R) after the test. The transparent conductive film after the test was observed at 70 times magnification using an optical microscope, and the appearance of the film after the alkali resistance test was evaluated. Second test result
Shown in the table.

比較例1はセロテープはく離テスト、耐アルカリ性テス
ト、耐アルカリ性テスト後のフィルタネート系カップリ
ング剤が優れていることが理屏できる。
In Comparative Example 1, it can be seen that the filterate coupling agent is excellent after the Cellotape peeling test, the alkali resistance test, and the alkali resistance test.

実施例2.比較例2 実施例1.比較例1において添加剤をイノプロピルトリ
ス(ジオクチルパイロホスフェート)/チタネート(商
品名プレンアク) 58 B。
Example 2. Comparative Example 2 Example 1. In Comparative Example 1, the additive was inopropyltris (dioctyl pyrophosphate)/titanate (trade name: Preneac) 58B.

味の素KK )に固定し添加tfe115.7.15重
量パーセントに変化させた。他の条件は実施例1.比較
例1と同じである。結果を第2表に示す。
Ajinomoto KK) was fixed and the added TFE was changed to 115.7.15% by weight. Other conditions are as in Example 1. Same as Comparative Example 1. The results are shown in Table 2.

イノプロピルトリス(ジオクチルパイロホスフェート)
チタネートの添加量が少ないと透明導電性被膜との良好
な密着性が得られず、又多すぎるとクラックが生じるこ
とがわかる。
Inopropyltris (dioctyl pyrophosphate)
It can be seen that if the amount of titanate added is too small, good adhesion with the transparent conductive film cannot be obtained, and if it is too large, cracks occur.

実施例3.比較例3 市販ノポリエチレンテレフタレートフイルム(商品名ダ
イヤホイル、ダイヤホイルKK )100μmに市販の
2液性ウレタン系コーテイング剤(商品名ハイクレック
スP、武Ra料KK)を硬化性被膜として5μmになる
ようメイヤーパーコーターを用いて塗布後100℃、7
0分の乾燥、硬化を行ない、更に2日間取エージングし
て硬化性有機被膜を作製し友。
Example 3. Comparative Example 3 A commercially available polyethylene terephthalate film (trade name: Diafoil, Diafoil KK) with a thickness of 100 μm was coated with a commercially available two-component urethane coating agent (trade name: Hyclex P, Takera KK) as a curable coating to a thickness of 5 μm. After coating using Mayer Percoater, 100℃, 7
After drying and curing for 0 minutes, a curable organic film was prepared by aging for another 2 days.

コーティング剤中には樹脂固形分あたり0゜1、5.5
  重tパーセントのビス(ジオクチルパイロホスフェ
ート)エチレンチタネート(商品名プレンアクト25B
B、味の素KK )を添加し実施例及び比較例とした。
The coating agent contains 0゜1, 5.5 per resin solid content.
Bis(dioctylpyrophosphate) ethylene titanate (trade name Preneact 25B)
B, Ajinomoto KK) was added to provide Examples and Comparative Examples.

他の条件は実施例1.比較例1と同一である。試験結果
′fr:第2象に示す。
Other conditions are as in Example 1. Same as Comparative Example 1. Test results 'fr: Shown in the second quadrant.

実施例2.比較例2と同様にビス(ジオクチルパイロホ
スフェート)エチレンチタネートの添加により透明導電
性被膜との密着性が向上する。
Example 2. As in Comparative Example 2, the addition of bis(dioctylpyrophosphate) ethylene titanate improves the adhesion to the transparent conductive coating.

第1表Table 1

Claims (1)

【特許請求の範囲】[Claims] (1)高分子フィルム上に高分子からなる硬化性有機被
膜を設け、その上に金属又は金属酸化物からなる透明導
電性被膜を形成するに当り、硬化性有機被膜が次の構造
をもつチタネート系カップリング剤を2〜10重量%含
むことを特長とする透明導電性フィルム。 ▲数式、化学式、表等があります▼ n=1〜5 R:アルキル基
(1) When a curable organic film made of a polymer is provided on a polymer film and a transparent conductive film made of a metal or metal oxide is formed thereon, the curable organic film is titanate having the following structure. A transparent conductive film characterized by containing 2 to 10% by weight of a coupling agent. ▲There are mathematical formulas, chemical formulas, tables, etc.▼ n=1-5 R: Alkyl group
JP59159179A 1984-07-31 1984-07-31 Transparent conductive film Granted JPS6139406A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59159179A JPS6139406A (en) 1984-07-31 1984-07-31 Transparent conductive film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59159179A JPS6139406A (en) 1984-07-31 1984-07-31 Transparent conductive film

Publications (2)

Publication Number Publication Date
JPS6139406A true JPS6139406A (en) 1986-02-25
JPH0424803B2 JPH0424803B2 (en) 1992-04-28

Family

ID=15688023

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59159179A Granted JPS6139406A (en) 1984-07-31 1984-07-31 Transparent conductive film

Country Status (1)

Country Link
JP (1) JPS6139406A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999059814A1 (en) * 1998-05-15 1999-11-25 Toyo Boseki Kabushiki Kaisha Transparent conductive film and touch panel

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999059814A1 (en) * 1998-05-15 1999-11-25 Toyo Boseki Kabushiki Kaisha Transparent conductive film and touch panel
US6629833B1 (en) 1998-05-15 2003-10-07 Toyo Boseki Kabushiki Kaisha Transparent conductive film and touch panel

Also Published As

Publication number Publication date
JPH0424803B2 (en) 1992-04-28

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