JPS6138776U - 電気接続端子 - Google Patents

電気接続端子

Info

Publication number
JPS6138776U
JPS6138776U JP1984123362U JP12336284U JPS6138776U JP S6138776 U JPS6138776 U JP S6138776U JP 1984123362 U JP1984123362 U JP 1984123362U JP 12336284 U JP12336284 U JP 12336284U JP S6138776 U JPS6138776 U JP S6138776U
Authority
JP
Japan
Prior art keywords
water
repellent
electrical connection
connection terminal
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1984123362U
Other languages
English (en)
Japanese (ja)
Other versions
JPH033968Y2 (en:Method
Inventor
純一 谷井
敏生 山木
潔 清玄寺
Original Assignee
ミノルタ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ミノルタ株式会社 filed Critical ミノルタ株式会社
Priority to JP1984123362U priority Critical patent/JPS6138776U/ja
Priority to US06/763,738 priority patent/US4687266A/en
Publication of JPS6138776U publication Critical patent/JPS6138776U/ja
Application granted granted Critical
Publication of JPH033968Y2 publication Critical patent/JPH033968Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0256—Electrical insulation details, e.g. around high voltage areas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2018—Presence of a frame in a printed circuit or printed circuit assembly
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Multi-Conductor Connections (AREA)
JP1984123362U 1984-08-11 1984-08-11 電気接続端子 Granted JPS6138776U (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP1984123362U JPS6138776U (ja) 1984-08-11 1984-08-11 電気接続端子
US06/763,738 US4687266A (en) 1984-08-11 1985-08-08 Electrical connecting terminal

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984123362U JPS6138776U (ja) 1984-08-11 1984-08-11 電気接続端子

Publications (2)

Publication Number Publication Date
JPS6138776U true JPS6138776U (ja) 1986-03-11
JPH033968Y2 JPH033968Y2 (en:Method) 1991-01-31

Family

ID=14858707

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984123362U Granted JPS6138776U (ja) 1984-08-11 1984-08-11 電気接続端子

Country Status (2)

Country Link
US (1) US4687266A (en:Method)
JP (1) JPS6138776U (en:Method)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0287703B1 (de) * 1987-03-14 1992-05-13 Steuerungstechnik Staiger GmbH u. Co. Produktions-Vertriebs-KG Dichtung
DE4034113A1 (de) * 1990-10-26 1992-04-30 Bosch Gmbh Robert Hydraulische mehrkreis-bremsanlage, insbesondere fuer kraftfahrzeuge
CN1186972C (zh) 2000-02-11 2005-01-26 蒂科电子比利时公司 印制电路板
JP3829327B2 (ja) * 2002-05-20 2006-10-04 日本電気株式会社 カードエッジコネクタ及びカード部材
US7484981B2 (en) * 2007-02-01 2009-02-03 Motorola, Inc. Assembly for sealing an audio connector within an electronic device
US7762832B2 (en) 2007-02-12 2010-07-27 Minnick Jamie J Systems for providing electrical interconnection between solar modules
US7850476B2 (en) * 2008-10-29 2010-12-14 Tyco Electronics Corporation Low profile solar laminate connector assembly
US7997931B2 (en) 2009-12-11 2011-08-16 Aerovironment, Inc. Waterproof electrical connector and system

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49132556A (en:Method) * 1973-04-25 1974-12-19
JPS54155810A (en) * 1978-05-29 1979-12-08 Tdk Corp Bonding method of electronic parts
JPS5527926U (en:Method) * 1978-08-10 1980-02-22

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2524939A (en) * 1948-09-09 1950-10-10 Philco Corp Integral socket and printed circuit panel
US3993382A (en) * 1971-12-10 1976-11-23 Rockwell International Corporation Moisture seal for electrical interconnect system
US4113981A (en) * 1974-08-14 1978-09-12 Kabushiki Kaisha Seikosha Electrically conductive adhesive connecting arrays of conductors
US4202588A (en) * 1978-11-29 1980-05-13 Technical Wire Products Electrical connector and support means therefor
JPS55138291A (en) * 1979-04-11 1980-10-28 Alps Electric Co Ltd Substrate for mounting electric parts
US4310211A (en) * 1979-12-26 1982-01-12 Amp Incorporated High current contact system for solar modules
JPS5855576Y2 (ja) * 1980-05-07 1983-12-20 クラリオン株式会社 コネクタ−固定装置
US4429348A (en) * 1982-01-18 1984-01-31 International Telephone And Telegraph Corporation Printed circuit mounting apparatus especially for use in luminaires
US4480289A (en) * 1983-09-29 1984-10-30 Hewlett-Packard Company Electrical component supported on a support member by a ring mount
US4602125A (en) * 1985-05-10 1986-07-22 The Bergquist Company Mounting pad with tubular projections for solid-state devices

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49132556A (en:Method) * 1973-04-25 1974-12-19
JPS54155810A (en) * 1978-05-29 1979-12-08 Tdk Corp Bonding method of electronic parts
JPS5527926U (en:Method) * 1978-08-10 1980-02-22

Also Published As

Publication number Publication date
US4687266A (en) 1987-08-18
JPH033968Y2 (en:Method) 1991-01-31

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