JPS6138575U - Probe position adjustment device - Google Patents
Probe position adjustment deviceInfo
- Publication number
- JPS6138575U JPS6138575U JP12368684U JP12368684U JPS6138575U JP S6138575 U JPS6138575 U JP S6138575U JP 12368684 U JP12368684 U JP 12368684U JP 12368684 U JP12368684 U JP 12368684U JP S6138575 U JPS6138575 U JP S6138575U
- Authority
- JP
- Japan
- Prior art keywords
- mounting plate
- probe
- probe mounting
- lead
- horizontal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は本考案のプローブ位置調節装置の一実施例にお
ける垂直断面図、第2図は同じく平面因である。
第3図は薄形ICとプローブとの斜視図、第4図は従来
用いられjXYθテーブルの模式図である。
1・・・薄形IC, la・・・パッケージ、1b・・
・リード、2・・・プローブ、3.3’・・・プローブ
取付板、3a・・・フランジ状支承板、3a−1・・・
バカ孔、3b・・・本体部、4・・・Xステージ、5・
・・Yステージ、6・・・θステージ、7・・・枠部材
、7a・・・雌ネジ孔、7b・・・雌ネジ孔、8・・・
セットボルト、9・・・調節ネジ、10・・・プローブ
カード。FIG. 1 is a vertical sectional view of an embodiment of the probe position adjustment device of the present invention, and FIG. 2 is a plan view thereof. FIG. 3 is a perspective view of a thin IC and a probe, and FIG. 4 is a schematic diagram of a conventionally used jXYθ table. 1... Thin IC, la... Package, 1b...
・Lead, 2...Probe, 3.3'...Probe mounting plate, 3a...Flanged support plate, 3a-1...
Baka hole, 3b...Main body, 4...X stage, 5.
...Y stage, 6...θ stage, 7...frame member, 7a...female screw hole, 7b...female screw hole, 8...
Set bolt, 9...adjustment screw, 10...probe card.
Claims (1)
たプローブ取付板を水平に支承し、このプローブ取付板
を水平面内で移動、回転させて前記プローブの先端をI
Cリードに対向せしめるように調節する装置において、
前記のブロー取付板を長方形に構成するとともにこのプ
ローブ取付板に水平な支承部材を固着し、上記の支承部
材を介してプローブ取付板を水平に支承する水平な長方
形の枠状部材を構成し、かつ、上記長方形の枠状部材の
各辺に直交せしめて2本ずつ螺合貫通した調節ボルトの
先端をそれぞれプローブ取付板の−側面に当接せしめる
とともに、前記枠状部材とプローブ取付板との水平面内
における相対的位置を固定・解除し得る手段を設けたこ
・とを特徴とする、プローブ位置の調節装置。A probe mounting plate in which a probe is implanted that contacts the lead of a thin IC for conduction is horizontally supported, and the probe mounting plate is moved and rotated in a horizontal plane to attach the tip of the probe to an I.
In a device that adjusts the C lead to face the C lead,
The blow mounting plate is configured in a rectangular shape, and a horizontal support member is fixed to the probe mounting plate to form a horizontal rectangular frame member that horizontally supports the probe mounting plate via the support member, In addition, the tips of two adjustment bolts screwed through each side of the rectangular frame-like member are brought into contact with the negative side of the probe mounting plate, and the contact between the frame-like member and the probe mounting plate is A device for adjusting the position of a probe, comprising means for fixing and releasing the relative position in a horizontal plane.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12368684U JPS6138575U (en) | 1984-08-14 | 1984-08-14 | Probe position adjustment device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12368684U JPS6138575U (en) | 1984-08-14 | 1984-08-14 | Probe position adjustment device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6138575U true JPS6138575U (en) | 1986-03-11 |
Family
ID=30682432
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12368684U Pending JPS6138575U (en) | 1984-08-14 | 1984-08-14 | Probe position adjustment device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6138575U (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63110649A (en) * | 1986-10-28 | 1988-05-16 | Tokyo Electron Ltd | Prober |
JPH02307075A (en) * | 1989-05-23 | 1990-12-20 | Mitsubishi Electric Corp | Inspection device for electronic component |
JP2009545753A (en) * | 2006-08-04 | 2009-12-24 | フォームファクター, インコーポレイテッド | Adjustment mechanism |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55125639A (en) * | 1979-03-23 | 1980-09-27 | Hitachi Ltd | Inspection apparatus |
-
1984
- 1984-08-14 JP JP12368684U patent/JPS6138575U/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55125639A (en) * | 1979-03-23 | 1980-09-27 | Hitachi Ltd | Inspection apparatus |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63110649A (en) * | 1986-10-28 | 1988-05-16 | Tokyo Electron Ltd | Prober |
JPH02307075A (en) * | 1989-05-23 | 1990-12-20 | Mitsubishi Electric Corp | Inspection device for electronic component |
JP2009545753A (en) * | 2006-08-04 | 2009-12-24 | フォームファクター, インコーポレイテッド | Adjustment mechanism |
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