JPS6137367A - Soldering jig member - Google Patents
Soldering jig memberInfo
- Publication number
- JPS6137367A JPS6137367A JP15735884A JP15735884A JPS6137367A JP S6137367 A JPS6137367 A JP S6137367A JP 15735884 A JP15735884 A JP 15735884A JP 15735884 A JP15735884 A JP 15735884A JP S6137367 A JPS6137367 A JP S6137367A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- jig
- adhere
- stainless steel
- alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/087—Soldering or brazing jigs, fixtures or clamping means
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physical Vapour Deposition (AREA)
Abstract
Description
【発明の詳細な説明】
「産業上の利用分野」
本発明は、自動ハンダ付け用冶共林等に使用しても、ハ
ンダが付着しないようにした／＼ンダ４＝Ｊけ用冶具部
材に関する。DETAILED DESCRIPTION OF THE INVENTION "Field of Industrial Application" The present invention relates to a jig member for automatic soldering that prevents solder from adhering even when used in a joint or the like for automatic soldering. .
「従来の技術」
従来の自動ハンダ付け装こは、特開昭５８−８１５６１
号公報に開示されるように、タングステン酸の治具棒で
ＩＣ等の被ハンダ付け物をそのリードフレームが下方に
突出した状態となるように保持して、ハンダ付けをして
いた。"Prior art" The conventional automatic soldering equipment is disclosed in Japanese Patent Application Laid-Open No. 58-81561.
As disclosed in the publication, soldering was carried out by holding an object to be soldered, such as an IC, with a tungstic acid jig rod so that its lead frame protruded downward.
「発明が解決しようとする問題点」
従来の自動ハンダ付け装置用の治具棒は、タングステン
酸であったので、治具棒がＩＣを保持してハンダ槽を通
るときハンダは治具棒に付着しないが、治具棒自体が高
価となり、また治具棒がタングステン酸のため直伸状に
製造しにくく、精度よく加工するのが困難であった。"Problem to be Solved by the Invention" The jig rod for conventional automatic soldering equipment was made of tungstic acid, so when the jig rod holds the IC and passes through the solder bath, the solder is transferred to the jig rod. Although it does not adhere, the jig rod itself is expensive, and since the jig rod is made of tungstic acid, it is difficult to manufacture it in a straight shape, making it difficult to process with high precision.
「問題点を解決するための手段」
本発明は上記問題点を解決するものであり、ステンレス
部材またはＴｉ合金部材の外周面を、ＴｉＮ、 Ａｌ１
０３ 、５ｉ０２ 、 Ｍｏ、 Ｗ等のハンダを付着さ
せない材料で覆って、ハンダが何着せず、かつ寸法精度
を正確に容易に製造できるようにした／＼ンダ付け用治
具部材を提供する。"Means for Solving the Problems" The present invention solves the above problems, and the outer circumferential surface of a stainless steel member or a Ti alloy member is made of TiN, Al1
To provide a soldering jig member which is covered with a material that does not allow solder to adhere, such as 03, 5i02, Mo, W, etc., so that no solder is applied, and it can be easily manufactured with accurate dimensional accuracy.
「作用」
上記手段のハンダ付け用治具部材を、例えば■Ｃのハン
ダ付けを自動的に行なう装置に使用するときは、ＩＣの
リードフレームがハンダ槽に対し、適切な位置関係とな
るように治具部材を使用してＩＣを搬送ホルダに保持さ
せる。この場合、治具部材の基材は、ステンレスまたは
１１合金製であるので精度よく治具部材が形成されてＩ
Ｃが安定に保持され、さらに基材の外周をハンダが付着
しない材料で覆っているので搬送ホルダがハンダ槽上を
搬送されるときに、治具部材にハンダが付着しない。"Function" When using the soldering jig member of the above means, for example, in a device that automatically performs soldering of The IC is held in the transport holder using a jig member. In this case, since the base material of the jig member is made of stainless steel or 11 alloy, the jig member can be formed with high precision.
C is stably held, and since the outer periphery of the base material is covered with a material to which solder does not adhere, solder does not adhere to the jig member when the transport holder is transported over the solder tank.
「実施例」
次に本発明の実施例を図面により説明する。治具部材は
、基材として強度が十分でしかもタングステンに比較し
て製造しやすいステンレスまたはＴｉ合金で、直径２．
５ ｒｎｍ長さ３００ ｎ＋＋ａの丸棒ｌを形成する。"Example" Next, an example of the present invention will be described with reference to the drawings. The jig member is made of stainless steel or Ti alloy, which has sufficient strength as a base material and is easier to manufacture than tungsten, and has a diameter of 2.
A round bar l having a length of 5 rnm and a length of 300 n++a is formed.
なお、丸棒１の一端は、ハンダ伺けをする例えばＩＣを
搬送ホルダに保持するときの係止部として細く形成する
が、これら基材の形状を限定するものではない。丸棒ｌ
の外周に被覆材２としてＴｉＮをイオンブレーティング
により厚さ２ｇｍコーティングし、冶具部材３を完成す
る。この冶具部材を２５０℃のハンダ浴に５秒間浸漬し
た後、引出すという動作を繰換えし１万回行ない、／＼
ンダーの付着状況を検査したが、はとんど付着が認めら
れなかった。Note that one end of the round bar 1 is formed thin as a locking portion for holding solder, for example, an IC in a transport holder, but this is not intended to limit the shape of these base materials. round bar l
The jig member 3 is completed by coating the outer periphery of the jig member 3 with TiN as a coating material 2 to a thickness of 2 gm by ion blasting. This jig member was immersed in a 250°C solder bath for 5 seconds, and then pulled out, which was repeated 10,000 times.
I inspected the condition of adhesion of the powder, but almost no adhesion was observed.
上記実施例ではＴｉＮ膜の生成をイオンブレーティング
で行なったが、本発明はこれに限定されるものではなく
、スパッタリングでＴｉ膜をコーティングしてもよい。Although the TiN film was formed by ion blasting in the above embodiment, the present invention is not limited to this, and the Ti film may be coated by sputtering.
また皮膜材質としては、丸棒１の外周にＡｌ２Ｏ３，ま
たは５ｉ０２ 、 Ｓ４３ Ｎ４ 、 ＳｉＣをイオン
ブレーティング。またはスパッタリングによりコーティ
ングしてもほぼ同等の結果が得られた。、さらにはＭＯ
またはＷなどの金属皮膜をコーティングする場合には、
真空蒸着によりコーティングしても、ハンダが付着しな
い治具部材となる。As for the coating material, Al2O3, 5i02, S43N4, or SiC is ion-bladed on the outer periphery of the round bar 1. Alternatively, almost the same results were obtained by coating by sputtering. , and even M.O.
Or when coating a metal film such as W,
Even if coated by vacuum evaporation, the jig member will not have solder attached to it.
上記の実施例は、ハンダの付着しないこと、腐食しない
こと、強度が十分という点で、ハンダ付けの治具部材と
して望ましいものであったが、本発明者は他の材料でも
実験し、良い結果の得られなかったものを参考までに記
載する。Although the above embodiment is desirable as a soldering jig member in that it does not adhere to solder, does not corrode, and has sufficient strength, the inventor has experimented with other materials and obtained good results. Those that were not obtained are listed for reference.
ステンレス棒にテフロンをコーティングした治具棒は、
約２０００〜３０００回の使用でテフロンがはがれてし
まった。The jig rod is a stainless steel rod coated with Teflon.
The Teflon peeled off after about 2,000 to 3,000 uses.
ステンレス棒そのままを治具棒としたときは。When using a stainless steel rod as a jig rod.
ハンダが少し付着し、／＼ンダ伺げに使用する薬品にも
腐食された。A small amount of solder adhered to it, and the chemicals used to solder it also corroded it.
チタン合金により治具棒を形成したときは、耐食性はよ
いがハンダが付着した。When the jig rod was made of titanium alloy, it had good corrosion resistance, but solder adhered to it.
セラミックス例えばＡｌ２Ｏ３により治具棒を形成した
ときは、ハンダは付着しないが、Ａｌ２Ｏ３の強度は高
々４０ｋｇ／ａｍ ”であり、妙１撃力に弱く、取扱い
時に折損しやすい。When the jig rod is made of ceramics, such as Al2O3, solder does not adhere to it, but Al2O3 has a strength of at most 40 kg/am'', is weak against impact force, and easily breaks during handling.
ステンレス棒にＴｉＮ、 Ａ１２０３ 、 ＳｉＯ□等
のセラミックスを溶射法によりコーティングして治具棒
を形成したときは、治具棒のコーナ一部の寸法精度が不
十分となり、またセラミックスの緻冨度が悪Ｕ）−ため
セラミックス部分を浸透した薬品がステンレスを腐食す
るので、使用−にの注意が必要である。When a jig rod is formed by coating a stainless steel rod with ceramics such as TiN, A1203, SiO□, etc. by thermal spraying, the dimensional accuracy of a part of the corner of the jig rod is insufficient, and the density of the ceramic is Chemicals that have penetrated the ceramic parts will corrode the stainless steel, so care must be taken when using them.
以上により実施例の前半に記載したようにステンレス部
材またはＴｉ合金部材の外周にＴｉＮ、Ａｌ２Ｏ３、５
ｉ０２ 、 Ｎｏ、Ｗ等をコーティングしたものがハン
ダ付け用の治具部材として使用できる。As described above in the first half of the example, TiN, Al2O3, 5
Those coated with i02, No., W, etc. can be used as jig members for soldering.
「発明の効果」
本発明のハンダ付け用治具部材は、基材としてステンレ
スまたはＴｉ合金を使用しているので、タングステンを
使用するより製造しやすく、寸法精度のよいしかも強度
のある治具部材を安価に製造できる。また、ステンレス
製の基材の外周はノ＼ンダが付着しない材質で覆ってい
るので、ノ＼ンダ付けの治具部材として使用することが
できる。"Effects of the Invention" Since the soldering jig member of the present invention uses stainless steel or Ti alloy as the base material, it is easier to manufacture than using tungsten, and has good dimensional accuracy and strength. can be manufactured at low cost. Furthermore, since the outer periphery of the stainless steel base material is covered with a material to which solder does not adhere, it can be used as a jig member for soldering.
第１図は本発明の一実施例である治具部材の側面図、第
２図は第１図の■−■線断面図である。
１；丸棒 ２；被覆材
３；治具部材FIG. 1 is a side view of a jig member according to an embodiment of the present invention, and FIG. 2 is a sectional view taken along the line ■--■ in FIG. 1; Round bar 2; Covering material 3; Jig member
Claims (2)
ＴｉＮ、Ａｌ＿２Ｏ＿３、ＳｉＯ＿２、Ｍｏ、Ｗ等のハ
ンダを付着させない材料で覆ったハンダ付け用治具部材
。(1) The outer peripheral surface of the stainless steel member or Ti alloy member,
A soldering jig member covered with a material to which solder does not adhere, such as TiN, Al_2O_3, SiO_2, Mo, W, etc.
グ、スパッタリングあるいは真空蒸着によりステンレス
部材またはＴｉ合金部材の外周面に付着させた特許請求
の範囲第１項記載のハンダ付け用治具部材。(2) The soldering jig member according to claim 1, wherein a material to which solder is not attached is attached to the outer circumferential surface of the stainless steel member or Ti alloy member by ion blasting, sputtering, or vacuum evaporation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15735884A JPS6137367A (en) | 1984-07-30 | 1984-07-30 | Soldering jig member |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15735884A JPS6137367A (en) | 1984-07-30 | 1984-07-30 | Soldering jig member |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6137367A true JPS6137367A (en) | 1986-02-22 |
Family
ID=15647919
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15735884A Pending JPS6137367A (en) | 1984-07-30 | 1984-07-30 | Soldering jig member |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6137367A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01317683A (en) * | 1988-06-15 | 1989-12-22 | Showa Alum Corp | Method of brazing aluminum material |
| US7031434B1 (en) * | 2003-08-06 | 2006-04-18 | General Electric Company | Method of manufacturing, and a collimator mandrel having variable attenuation characteristics for a CT system |
-
1984
- 1984-07-30 JP JP15735884A patent/JPS6137367A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01317683A (en) * | 1988-06-15 | 1989-12-22 | Showa Alum Corp | Method of brazing aluminum material |
| US7031434B1 (en) * | 2003-08-06 | 2006-04-18 | General Electric Company | Method of manufacturing, and a collimator mandrel having variable attenuation characteristics for a CT system |
| US7266180B1 (en) | 2003-08-06 | 2007-09-04 | General Electric Company | Method of manufacturing a collimator mandrel having variable attenuation characteristics for a CT system |
| US7436933B2 (en) | 2003-08-06 | 2008-10-14 | General Electric Company | Method of manufacturing, and a collimator mandrel having variable attenuation characteristics for a CT system |
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