JPS61259873A - Jig member for soldering - Google Patents

Abstract

PURPOSE:To obtain the jig member for soldering which is inexpensive, of high accuracy and to which no solder is adhered by making a Ni base alloy or Co base alloy the base metal and by coating the surface coming in contact with the molten solder of the base metal by the substance difficult to be wet with the solder. CONSTITUTION:The jig member is made by coating the part coming into contact with the molten solder of the base metal consisting of a Ni base alloy or Co base alloy by the substance which is difficult to be wet with a solder. For the coating substance one kind or more than two kinds are selected among the oxide of Ti, Zr, Al, Si and B, nitride, carbide, carbonitride, boride and Mo, W or its alloy. The film is formed by either method of an ion plating, sputtering or vacuum deposition and the surface roughness is finished more than 3mu. The necessary jig member for soldering of low cost and with high accuracy is thus obtd.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a soldering jig member,
For example, the present invention relates to a member such as a support rod for an object to be soldered used in an automatic soldering device, which is required to have the property that solder does not adhere even when it comes into contact with molten solder.

[Conventional technology]

Conventionally, a single piece of tungsten has been used as a support rod that comes into direct contact with molten solder, as disclosed in JP-A-58-81561.

[Problem that the invention seeks to solve]

Conventional support rods for soldering are made of tungsten, which is very expensive and has poor workability, making it difficult to process with high precision. As a result, solder, which should not originally adhere to the tungsten support rod, adheres locally starting from defects such as processing scratches, resulting in a significant decrease in the number of repeated uses (life) of the support rod, or to the soldering object. There were problems such as poor quality.

[Means for solving problems]

In the present invention, at least the portion that comes into contact with the melting solder is made of one of Ti, Zr, Al, Si, B oxides, nitrides, carbides, carbonitrides, borides, Mo, W, or alloys thereof. Alternatively, the base material is coated with solder and a substance that is difficult to wet with two or more types of solder, and the base material is Ni-based alloy or C.
The above problem is solved by using a soldering jig member made of an o-based alloy. Furthermore, the surface roughness of at least the part that comes into contact with the solder is 3μ or less, and the coating is coated with a substance that is difficult to wet with the solder by ion plating, sputtering, or vacuum evaporation, and the thickness of the coating is is 10μ
The following is desirable.

[Effect]

The base material, Ni-based alloy or Co-based alloy, is cheaper than tungsten and has good workability, so soldering jig members can be manufactured at low cost and with high precision. In addition,
The Ni-based alloy is preferably Hastelloy, and the Co-based alloy is preferably Stellite.

The parts that come into contact with the melting solder are Ti, Zr, and A1.
, Si, B oxides, nitrides, carbides, carbonitrides, borides, Mo, W, or their alloys, which are difficult to wet with solder, so that solder does not adhere to the jig members. The above-mentioned coating also has excellent corrosion resistance against acids, so it is resistant to corrosion by flux, paste, etc., and can be used repeatedly. In addition, the Ni-based alloy and Co-based alloy themselves have good corrosion resistance and relatively good solder adhesion resistance, so if the coating cracks or peels locally during use, However, solder adhesion will progress rapidly and the work will not be interrupted.

The coating in the present invention includes TiN, ZrN, BN, Al,
It is not particularly limited as long as it is a substance that does not get wet with solder, such as O, Sin, W, or Mo.

From the viewpoints of adhesion, abrasion resistance, film formability, etc., TiN is desirable as the film. By setting the surface roughness to 3μ or less, local adhesion of solder can be prevented.

When we investigated the cause of localized adhesion in conventional tungsten rods, we found that flux residue was trapped in sharp and deep defects such as processing scratches, and this was used as a starting point for soldering to the tungsten rod surface, which should not be wetted by solder. It was revealed that adhesion occurs.

That is, setting the surface roughness to 3μ or less has the effect of preventing local adhesion of solder. Further, by covering the surface of the deep and sharp defect with the above-mentioned thin film, it is further smoothed and the effect of preventing local adhesion of solder is further improved. When a thin film is formed by ion plating, sputtering, or vacuum deposition, the surface quality of the film is good and the film thickness is uniform.
It has better solder adhesion resistance. In addition, if the thickness of the coating exceeds 10μ, the coating will easily peel off.
A thickness of 0μ or less is desirable.

〔Example〕

Next, one embodiment of the present invention will be explained in detail with reference to examples.

2 and 5 having the base material, surface coating, and surface roughness shown in Table 1
Four types of test rods of IφX80++aQ were prepared, and a solder adhesion test was conducted by sequentially repeating flux application → immersion in a solder bath for 10 seconds → water washing → drying. Note that the temperature of the solder bath was 250°C.

The results are shown in Table 1. As can be seen from Table 1, with the conventional commercially available tungsten rod, local adhesion of solder occurred on the surface of the rod after approximately 40 repeated treatments. However, the base material is 0.08G
-16Cr-17Mo-4W-5,5Fe-B alN
2 on one surface with a round bar made of Ni-based alloy of Hastelloy C with i composition.
~3μ TiN coated and base material 1°10
A T of 1 to 2 μm is applied to the surface of the Go-based alloy frame rod 1 of Stellite No. 6 having a composition of C-30Cr-2Ni-4W-BalCo.
No solder adhesion was observed in any of the products of the present invention coated with iN even after repeated processing 300 times. However, a comparative product using Stellite No. 6 as a base material whose surface was not coated with a thin film of a substance that is difficult to wet with solder had solder adhesion after 10 repetitions.

Note that the coating in the above embodiments was performed by ion plating.

As a result of using the soldering jig member of the present invention as the lower and upper support rods during IC soldering, no adhesion of solder occurs as described above, and it is possible to repeatedly use the soldering jig member as a support rod. It was also confirmed that the quality of the soldered IC was good.

〔Effect of the invention〕

According to the present invention, a Ni-based alloy and G as the base material.

Since a base alloy is used and the surface is coated with a substance that is difficult to wet with solder, it is possible to provide a soldering jig member that is inexpensive, highly accurate, and can be used repeatedly without adhesion of solder.

Claims (1)

[Scope of Claims] 1. A solder characterized in that the base material is a Ni-based alloy or a Co-based alloy, and at least the portion of the base material that comes into contact with the melting solder is coated with a substance that is difficult to wet with the solder. Attachment jig parts. 2 Substances that are difficult to wet with solder include Ti, Zr, Al, and Si.
, B oxides, nitrides, carbides, carbonitrides, borides, Mo, W, or alloys thereof. Jig parts. 3. The soldering jig member according to claim 1 or 2, wherein the surface roughness of at least the portion that comes into contact with the melted solder is 3μ or less. 4 Substances that are difficult to wet with solder are ion plating,
A soldering jig member according to any one of claims 1 to 3, which is formed by either sputtering or vacuum deposition. 5. The soldering jig member according to any one of claims 1 to 4, wherein the coating thickness of the substance that is difficult to wet with solder is 10 μm or less.