JPS613452A - Solid-state image pickup element - Google Patents

Abstract

PURPOSE:To enable easy positioning of a chip of solid-state image pickup element by a method wherein an outer positioning recess or projection for positoning the appearance of a chip of solid-state image pickup element is formed in the upper surface of the stem integrally with the stem. CONSTITUTION:A recess nearly equal to a chip 2 of solid-state image pickup element in appearance is press-formed in the upper surface of a stem 1, and this cap 2 is fixed by positioning in the recess. The lower surface of the stem 1 is reversely formed in projection by press of the recess. The level of this projection is higher than the creep level of the glass that seals lead terminals 3. Otherwise, a plurality of projections 8 are press-formed along the appearance of the chip 2 in the upper surface of the stem 1, and the chip 2 is fixed by positioning with the projections 8. This facilitates the set-up of said chip on the stem.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a solid-state image sensor used in a television camera.

[Prior art]

In addition to features such as small size, light weight, long life, and low power consumption, solid-state image sensors are free from the problems associated with conventional image pickup tubes, such as afterimages, burn-in, and
Since there are no drawbacks such as shape distortion, it is rapidly being put into practical use.

FIG. 1 shows a solid-state image sensing device with a conventional metal case made of Kovar or the like mm thick, and FIG. 1(α) is a plan view, and FIG. 1(b) is a front sectional view. The conventional example shown in the figure includes a stem 1, a plurality of lead terminals 8 which are sealed in stem IK glass and serve as external electrodes, a solid-state image sensor chip 2 fixed to the stem 1, and the solid-state image sensor chip. 2 and the lead terminal 8, and a box-shaped sealing case 6, etc., which is airtightly joined to the stem 1 by welding or the like and has an opening 5 on the top surface, and the sealing It consists of a lid 7 made of a transparent material such as glass that is adhered to the inside of the case 6 with low melting point glass or the like to seal the opening 5. In conventional solid-state imaging devices with the above configuration, it is difficult to accurately position the solid-state imaging device chip on the top surface of the stem. There were problems with the screen being obstructed, resulting in insufficient light and the screen being curved. In order to prevent the above-mentioned insufficient amount of light from occurring even if the positional deviation is large, it is necessary to make the aperture sufficiently wide, and as a result, the sealing case becomes large, making it difficult to miniaturize. there were.

〔the purpose〕

OBJECTS OF THE INVENTION //'i It is an object of the present invention to solve these problems and provide a compact solid-state image sensor in which the solid-state image sensor chip can be easily positioned.

〔overview〕

The solid-state image sensor of the present invention includes a stem, a plurality of lead terminals sealed in glass to the stem, a solid-state image sensor chip fixed to the stem, and the solid-state image sensor chip and the lead terminals. In a solid-state imaging device, the solid-state imaging device is composed of a thin metal wire that is electrically connected, a box-shaped sealing case that is bonded to the stem and has an opening on the top surface, and a transparent material that seals the opening of the sealing case. A solid-state image sensor, characterized in that the solid-state image sensor is formed like a chip on the upper surface of the solid-state image sensor.

〔Example〕

Hereinafter, the present invention will be explained in detail based on examples.

FIGS. 2 and 8 are front sectional views showing an embodiment of the present invention, and the same numbers as in the conventional example in each figure indicate the same parts. In FIG. 2, a recessed portion having approximately the same external shape as the solid-state image sensor chip 2 is press-molded on the upper surface of the stem 1 (the solid-state image sensor chip 2 is positioned and fixed in the recessed portion). The concave portion is pressed to become a convex portion, and the height of the convex portion is higher than the height of the glass sealing the lead terminal 8.

In FIG. 3, a plurality of protrusions 8 are press-molded at positions along the outer shape of the solid-state image sensor chip 2 on the upper surface of the stem 1, and the solid-state image sensor chip 2 is positioned and fixed by the protrusions 8. There is.

〔effect〕

As described above, according to the present invention, the solid-state image sensor chip is positioned without bending by the concave or convex portion formed on the top surface of the stem, so the solid-state image sensor chip can be extremely easily set on the stem. . Also, since the chip is accurately positioned, it does not shift relative to the opening of the sealing case, so the amount of incident light at the edge of the imaging surface is not obstructed by the edge of the opening, and there is no shortage of light. : This is especially true when the imaging surface size of a solid-state image sensor chip becomes smaller than 1 inch, and the lens system is used in a general TV camera.
With a mount, the imaging surface will be smaller than the rear effective diameter of the lens. Therefore, the opening of the sealing case needs to be wider than the imaging surface. At this time, if the solid-state image sensor chip is accurately positioned, the aperture size can be minimized in design, and as a result, the entire solid-state image sensor can be miniaturized. Further, the positioning recesses or protrusions formed on the stem can be processed during the pressing process of the outer periphery of the stem, etc., and there is no increase in cost.

FIG. 2 and FIG. 8 are diagrams showing an embodiment of a solid-state image sensing device according to the present invention.

11 Netem 2. Fist-hardening gymnastics image element 8.Lead terminal 4・φ metal thin wire 5...Aperture 6. Sealed case 7. Lid 8.Convex part that's all

Claims (1)

[Claims] A stem, a plurality of lead terminals glass-sealed to the stem, a solid-state image sensor fixed to the stem, a thin metal wire electrically connecting the solid-state image sensor chip and the lead terminals, and the stem. In a solid-state imaging device comprising a box-shaped sealing case having an opening on the upper surface and a transparent material sealing the opening of the sealing case, the solid-state imaging device has a structure on the top surface of the stem for positioning the outer shape of the solid-state imaging device chip. A solid-state imaging device characterized in that a concave portion or a convex portion is integrally formed with a stem.