JPS6133764A - Vapor phase soldering device - Google Patents

Vapor phase soldering device

Info

Publication number
JPS6133764A
JPS6133764A JP15292884A JP15292884A JPS6133764A JP S6133764 A JPS6133764 A JP S6133764A JP 15292884 A JP15292884 A JP 15292884A JP 15292884 A JP15292884 A JP 15292884A JP S6133764 A JPS6133764 A JP S6133764A
Authority
JP
Japan
Prior art keywords
steam
tank
vapor
vessel
heat medium
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15292884A
Other languages
Japanese (ja)
Other versions
JPH0459069B2 (en
Inventor
Mitsugi Shirai
白井 貢
Hideaki Sasaki
秀昭 佐々木
Teishun Ueda
上田 禎俊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Hitachi Plant Technologies Ltd
Original Assignee
Hitachi Techno Engineering Co Ltd
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Techno Engineering Co Ltd, Hitachi Ltd filed Critical Hitachi Techno Engineering Co Ltd
Priority to JP15292884A priority Critical patent/JPS6133764A/en
Publication of JPS6133764A publication Critical patent/JPS6133764A/en
Publication of JPH0459069B2 publication Critical patent/JPH0459069B2/ja
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/012Soldering with the use of hot gas
    • B23K1/015Vapour-condensation soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:To prevent the leakage of vapor by opening a valve device to supply the cooling liquid in a tank to a sprayer to condense the vapor in a vapor vessel in a necessary case such as service interruption. CONSTITUTION:A solenoid valve 12 opens and the cold heat medium 2' stored in a liquid storage tank 10 is fed to a shower nozzle 11 and is sprayed into the vapor vessel 1 when the service interruption arises. The temp. in the vessel 1 is quickly decreased and the satd. vapor of the heat medium is condensed and liquified by such spraying, by which the volume is considerably decreased. As a result, the negative pressure below the atmospheric pressure is temporarily generated in the vessel 1 and the vapor of the heat medium remaining in the vessel 1 is stored in the vessel 1. The leakage of the heat medium vapor is thus prevented.

Description

【発明の詳細な説明】[Detailed description of the invention]

〔発明の利用分野〕 本発明は、蒸気の気化潜熱を利用してはんだ付けを行う
蒸気はんだ付け装置に係り、特に、停電時などにおける
蒸気の漏出を防止するための改良に関する。 〔発明の背景〕 従来、蒸気の気化潜熱を利用してはんだ付けを行う蒸気
はんだ付け装置としては、特開昭55−80 ’395
号の「はんだ付方法」に開示されているようなバッチ式
が一般的であった。このような装置では、密閉状態の容
器内に閉じ込めた熱媒の蒸気相に被はんだ付け物を浸漬
し7て、はんだ付けするから、蒸気の漏出事故は起りに
くい。 1:れに対し、で、近年になって用いられるようになっ
たインライン連続形の蒸気はんだ付け装置の場合、停電
時などに蒸気槽から蒸気が漏出する事故が起りやすい。 これについて以下に説明する。 インライン連続形蒸気はんだ付け装置においては、処理
の高速化を図るために、ベルトコンベヤにより被はんだ
付け物を蒸気槽に対し連続的に搬入搬出する関係上、蒸
気槽に開放開口が設けられている。そし・て、被はんだ
付け物を熱媒の飽和蒸気相中に浸漬させる必要があるた
め、開放開口の位置より上側にも蒸気が存在するように
開放開口の高さ位置が決められる。一方、熱媒としては
。 米国スリーエム社販売のフロリナートFc>7゜のよう
な空気より重いフッ素系の溶剤が一般に用いられる。従
って、何等の対策も講じなければ、蒸気槽内の蒸気が開
放開口より外部へ漏出してしまう、、ところが、上記の
ようなフッ素系溶剤は、加熱により有毒な副生成物(フ
ッ化水素酸など)を生しることが知られており、漏出す
ると極めて危険である。 そ、二で従来は、開放開口部分に復線器および排気装置
などを設けることにより、開放開口からの蒸気漏出を防
11−シている。し・かし・、このような従来装置の構
成では、停電などにより復線器や排気装置が正常に作動
し、ないと、開放開口より蒸気が外部に漏出してしまう
という問題がある。 〔発明の目的〕 従って本発明の目的は、停電時などにおける蒸気漏出を
防止した蒸気はんだ付け装置を提供する1:とにある。 〔発明の概要〕 本発明は、蒸気槽内の蒸気と同組成の冷液を貯蔵するタ
ンクと、このタンクに弁装置を介して接−3= 続された散布装置を蒸気槽内に設置し、停電時など必要
な場合に弁装置を開いてタンク内の冷液を散布装置へ供
給し7.冷液を蒸気槽内に散布させて蒸気槽内の蒸気を
復線せし・めることにより、蒸気槽内の大気圧より負圧
にし、それにより蒸気の漏出を防止するものである。 〔発明の実施例〕 以下、本発明の一実施例を図を参照して説明する。第1
図において、1は蒸気槽であり、その底部にはヒータ3
が設けられている。蒸気槽】の底部に溜られた熱!jL
2はヒータ3により加熱されて気化し、熱媒の飽和蒸気
相4が蒸気槽1の内部に形成される。蒸気槽1の側面
[Field of Application of the Invention] The present invention relates to a steam soldering device that performs soldering using the latent heat of vaporization of steam, and particularly relates to an improvement for preventing leakage of steam during power outages. [Background of the Invention] Conventionally, a steam soldering device that performs soldering using the latent heat of vaporization of steam is disclosed in Japanese Patent Application Laid-Open No. 55-80 '395.
Batch-type soldering methods, such as those disclosed in ``Soldering Methods,'' were common. In such an apparatus, since the object to be soldered is immersed in the vapor phase of the heat medium confined in a sealed container and then soldered, accidents such as vapor leakage are less likely to occur. 1: On the other hand, in the case of in-line continuous steam soldering equipment that has come into use in recent years, accidents such as steam leaking from the steam tank during power outages are likely to occur. This will be explained below. In in-line continuous steam soldering equipment, in order to speed up the process, the items to be soldered are continuously carried in and out of the steam tank using a belt conveyor, so an open opening is provided in the steam tank. . Since it is necessary to immerse the object to be soldered in the saturated vapor phase of the heating medium, the height position of the open opening is determined so that steam is present above the position of the open opening. On the other hand, as a heating medium. Fluorinated solvents that are heavier than air, such as Fluorinert Fc>7°, sold by 3M, USA, are generally used. Therefore, if no measures are taken, the steam in the steam tank will leak to the outside through the open opening.However, the above-mentioned fluorinated solvents produce toxic byproducts (hydrofluoric acid) when heated. etc.) and is extremely dangerous if leaked. Second, conventionally, leakage of steam from the open opening has been prevented by providing a restorer, an exhaust device, etc. in the open opening. However, in the configuration of such a conventional device, there is a problem in that the restorer and the exhaust device operate normally in the event of a power outage or the like, otherwise steam would leak to the outside through the open opening. [Object of the Invention] Accordingly, an object of the present invention is to provide a steam soldering device that prevents steam leakage during power outages and the like. [Summary of the Invention] The present invention includes a tank for storing a cold liquid having the same composition as the steam in the steam tank, and a dispersion device connected to the tank via a valve device, which is installed in the steam tank. 7. When necessary, such as during a power outage, the valve device is opened to supply the cold liquid in the tank to the spraying device. By distributing cold liquid into the steam tank and forcing the steam inside the steam tank to return to its original position, the pressure inside the steam tank is made negative from the atmospheric pressure, thereby preventing steam leakage. [Embodiment of the Invention] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. 1st
In the figure, 1 is a steam tank, and a heater 3 is installed at the bottom of the tank.
is provided. Heat accumulated at the bottom of the steam tank! jL
2 is heated by the heater 3 and vaporized, and a saturated vapor phase 4 of the heating medium is formed inside the steam tank 1 . Side of steam tank 1


二は被はんだ付け物8を搬入搬出するための開放開口1
6が設けられており、この開放開口16を介し、てコン
ベア7により被けんだ付け物8は搬入され、飽和蒸気相
4を通過したのち搬出されるようになっている。開放開
口16から熱媒の蒸気が外部に流出することを防止する
ために、開放開口部には種線コイル5から成る復線器6
および排気ダクト9が設けられ=4− ている。 15け熱媒2をフィルター14に送るためのポンプであ
る。蒸気槽1の上方には貯液タンク10が設けられてお
り、これにはフィルター14から排出される熱媒(液体
)が蓄えられる。13は電磁弁であり、フィルター14
から排出される熱媒は電磁弁13を介して蒸気槽1に戻
されるようになっている。蒸気槽1の上部内側にはシャ
ワーノズル11が設けられている。にのシャワーノズル
11け電磁弁12を介して貯液タンク10と接続され、
この電磁弁12が開いた時に、貯液タンクlOに蓄えら
れた熱媒2′がシャワーノズル11に供給され、蒸気槽
1の内部に散布されるようになっている。電磁弁13は
、当該蒸気はんだ付け装置の電源投入時から一定時間だ
け閉状態になり、その後は開状態になるように制御され
る。また電磁弁12は、当該蒸気はんだ付け装置の運転
中においては閉状態に制御され、停電が起こると開状態
に制御される。 次に動作を説明する。当該蒸気はんだ付け装置の電源が
投入されると、ポンプ15が作動し、蒸気槽1内の熱媒
2はフ、イルター14に送られる。 電源投入直後の一定時間は電磁弁13け閉状態であるか
ら、フィルター14を通過した熱媒(液体)は貯液タン
ク10へ送られ、そこに蓄えられる。 一定時間を経過すると、電磁弁3は開状態となるため、
フィルター14によりろ過された熱媒は。 貯液タンク10よりも低い位置にある蒸気槽1に流れる
。かくして装置の運転中においては、蒸気槽1内Φ熱媒
2はフィルター14を介して循環する。 熱媒2けヒータ1によって加熱され、蒸気槽1の内部に
飽和蒸気相4を形成する。飽和蒸気相4が形成された状
態において、コンベア7が作動し。 被はんだ付け物8を開放間口16を経由して蒸気槽1内
に搬入し、飽和蒸気相4を通過させることにより被はん
だ付け物8を加熱し、一定時間後に開放開口16から搬
出する。被はんだ付け物8を飽和蒸気相4の中を通過さ
せる関係上、開放開口】6は飽和蒸気相4よりも低い位
置に設けられている。また熱媒の飽和蒸気は空気よりも
比重が大きい。従って、熱媒の飽和蒸気の一部は開放開
口16へ流れ出す。1:の流れ出した飽和蒸気は凝縮コ
イル5により種線され、液化し、た熱媒は導通管17を
通って蒸気槽1内に戻る。凝縮コイル5によって液化さ
れなかった一部の蒸気は排気ダクト9により空気と共に
吸引され1図に示されていない回収部に回収される。 このような動作の途中において停電が起こると、凝縮コ
イル5および排気ダクト6の動作が停止するため、蒸気
槽1内の熱媒の飽和蒸気が開放開口16より外部へ流れ
出す恐れがある。これを防止するために、電磁弁12が
開き、貯液タンク10に貯蔵されている冷たい熱媒2′
がシャワーノズル11に送られ、蒸気槽1内に散布され
る。この散布により、蒸気槽l内部の温度が急速に降下
すると共に熱媒の飽和蒸気が接縮液化し、体積が著し・
く減少する。その結果、蒸気槽1内は一時的に大気圧よ
り負圧になり、蒸気槽1内に残っている熱媒の蒸気は蒸
気槽1内に溜められる。このようにして、熱媒蒸気の漏
出が防止される。 なお、貯液タンク10内に貯蔵する熱媒2′の量は、飽
和蒸気相4の持つ標線潜熱と熱媒2の量に応じて、上記
の作用を達成できるように決定される。また電磁弁13
の閉状態時間はポンプ15の能力を考慮し7、必要量の
熱媒が貯液タンク10に供給されるように決定される。 貯液タンク10には、熱媒が約/IO”C以下の温度で
貯蔵されることが一般に好まし、い。 以上、一実施例について詳細に説明したが、本発明はそ
れのみに限定されるものではない。たとえば、停電時に
限らず、凝縮コイル5や排気ダクト9の動作異常を検出
し・た場合や、開放開口16から蒸気の漏出を検出した
場合に、電磁弁を開いて冷たい熱媒を散布させるように
してもよい。また、冷たい熱媒を散布するための装置は
、シャワー、ノズル11以外の手段に置き換える1:と
も可能である。また、被はんだ付け物を搬入搬出するた
めの搬送装置は、コンベア7以外の装置とすることもで
きる。1:れ以外にも、以上説明し、た作用を達成でき
る範囲で、各部の槽成を変更する。:とはさしつかえな
い。 〔発明の効果〕 以上の説明から明らかなように1本発明によれば、停電
時などにおける熱媒蒸気の漏出を防止し、作業者の安全
を確保できるとともに、蒸気槽内の温度を急速に下げる
ことができるため、蒸気槽内部に取り残された被はんだ
付け物の熱的損傷を防止する1:ともできるという効果
を達成できる。
[
2 is an open opening 1 for carrying in and out the soldering object 8;
6 is provided, and through this open opening 16, the object to be hardened 8 is carried in by a conveyor 7, and after passing through the saturated vapor phase 4, it is carried out. In order to prevent the vapor of the heating medium from flowing out from the open opening 16, a restorer 6 consisting of a seed wire coil 5 is installed at the open opening.
and an exhaust duct 9 are provided. This is a pump for sending the heat medium 2 to the filter 14. A liquid storage tank 10 is provided above the steam tank 1, and the heat medium (liquid) discharged from the filter 14 is stored in this tank. 13 is a solenoid valve, and filter 14
The heat medium discharged from the steam tank 1 is returned to the steam tank 1 via a solenoid valve 13. A shower nozzle 11 is provided inside the upper part of the steam tank 1. A shower nozzle 11 is connected to a liquid storage tank 10 via a solenoid valve 12,
When this electromagnetic valve 12 is opened, the heat medium 2' stored in the liquid storage tank IO is supplied to the shower nozzle 11 and sprayed inside the steam tank 1. The solenoid valve 13 is controlled to be closed for a certain period of time from the time when the steam soldering apparatus is powered on, and then to be opened. Further, the solenoid valve 12 is controlled to be closed while the steam soldering apparatus is in operation, and is controlled to be opened when a power outage occurs. Next, the operation will be explained. When the steam soldering apparatus is powered on, the pump 15 is activated and the heat medium 2 in the steam tank 1 is sent to the filter 14. Since the solenoid valve 13 is closed for a certain period of time immediately after the power is turned on, the heat medium (liquid) that has passed through the filter 14 is sent to the liquid storage tank 10 and stored there. After a certain period of time, the solenoid valve 3 becomes open, so
The heating medium filtered by the filter 14 is as follows. It flows into the steam tank 1 located at a lower position than the liquid storage tank 10. Thus, during operation of the apparatus, the Φ heating medium 2 in the steam tank 1 is circulated through the filter 14. The heating medium is heated by two heaters 1 to form a saturated vapor phase 4 inside the steam tank 1 . The conveyor 7 is operated in a state where the saturated vapor phase 4 is formed. The objects 8 to be soldered are carried into the steam tank 1 through the open opening 16, heated by passing through the saturated steam phase 4, and then carried out through the open opening 16 after a certain period of time. In order to allow the object to be soldered 8 to pass through the saturated vapor phase 4, the open opening 6 is provided at a position lower than the saturated vapor phase 4. In addition, saturated steam as a heating medium has a higher specific gravity than air. A portion of the saturated vapor of the heating medium therefore flows out into the open opening 16. The saturated steam flowing out of 1: is seeded by the condensing coil 5 and liquefied, and the resulting heating medium returns to the steam tank 1 through the conduction pipe 17. A portion of the vapor that has not been liquefied by the condensing coil 5 is sucked together with air through the exhaust duct 9 and recovered in a recovery section (not shown in Figure 1). If a power outage occurs during such an operation, the condensing coil 5 and the exhaust duct 6 will stop operating, so there is a risk that the saturated steam of the heating medium in the steam tank 1 will flow out through the open opening 16. To prevent this, the solenoid valve 12 is opened and the cold heat medium 2' stored in the liquid storage tank 10 is opened.
is sent to the shower nozzle 11 and sprayed into the steam tank 1. As a result of this dispersion, the temperature inside the steam tank 1 rapidly decreases, and the saturated vapor of the heating medium is condensed into liquid, resulting in a significant volume increase.
decrease. As a result, the pressure inside the steam tank 1 becomes temporarily lower than the atmospheric pressure, and the steam of the heat medium remaining in the steam tank 1 is stored in the steam tank 1. In this way, leakage of heat medium vapor is prevented. Note that the amount of the heating medium 2' stored in the liquid storage tank 10 is determined according to the marked latent heat of the saturated vapor phase 4 and the amount of the heating medium 2 so as to achieve the above-mentioned effect. Also, the solenoid valve 13
The closed state time of is determined in consideration of the capacity of the pump 15 7 so that the required amount of heat medium is supplied to the liquid storage tank 10 . It is generally preferred that the heat medium is stored in the liquid storage tank 10 at a temperature of about IO"C or less. Although one embodiment has been described above in detail, the present invention is not limited thereto. For example, not only during a power outage, but also when an abnormality in the operation of the condensing coil 5 or exhaust duct 9 is detected, or when leakage of steam from the open opening 16 is detected, the solenoid valve is opened to release cold heat. The medium may be dispersed.Also, the device for dispersing the cold heat medium may be replaced with a means other than the shower or nozzle 11.Also, it is possible to use a means other than the shower or the nozzle 11. [ [Effects of the Invention] As is clear from the above description, 1. According to the present invention, leakage of heat medium vapor can be prevented during power outages, etc., safety of workers can be ensured, and the temperature in the steam tank can be rapidly lowered. Therefore, it is possible to achieve the effect of preventing thermal damage to objects to be soldered left inside the steam tank.

【図面の簡単な説明】[Brief explanation of drawings]

第】図は本発明の一実施例に係る蒸気はんだ付け装置の
概略断面図である。 ■・・・蒸気槽、  2・・・熱媒、  3・・・ヒー
タ。 4・・・飽和蒸気相、  5・・・凝縮コイル、 6・
・・復線器、  7・・・コンベア、  8・・・被は
んだ付け物、9・・・排気ダクト、  10・・・貯液
タンク、11・・・シャワーノズル循環1.2.13・
・・電磁弁、14・・・フィルター、  15・・・ポ
ンプ。
FIG. 1 is a schematic sectional view of a steam soldering apparatus according to an embodiment of the present invention. ■...Steam tank, 2...Heating medium, 3...Heater. 4... Saturated vapor phase, 5... Condensing coil, 6.
... Reconverter, 7... Conveyor, 8... Soldered object, 9... Exhaust duct, 10... Liquid storage tank, 11... Shower nozzle circulation 1.2.13.
...Solenoid valve, 14...filter, 15...pump.

Claims (1)

【特許請求の範囲】[Claims] (1)内部に蒸気を収容する蒸気槽に、該蒸気槽の開放
開口を経由して搬送装置によって被はんだ付け物を搬入
搬出する蒸気はんだ付け装置において、該蒸気槽内の蒸
気と同組成の冷液を貯蔵するタンクと、該蒸気槽の内部
に設けられ、該タンクに弁装置を介して接続された散布
装置とを備え、必要な場合に該弁装置を開いて該タンク
内の冷液を該散布装置へ供給し該蒸気槽内に散布せしめ
るようにして成ることを特徴する蒸気はんだ付け装置。
(1) In a steam soldering device in which objects to be soldered are carried into and out of a steam tank containing steam by means of a conveying device via an open opening of the steam tank, It includes a tank for storing cold liquid, and a dispersion device provided inside the steam tank and connected to the tank via a valve device, and when necessary, opens the valve device to discharge the cold liquid in the tank. A steam soldering device, characterized in that the vapor soldering device is configured to supply water to the spraying device and spray it into the steam tank.
JP15292884A 1984-07-25 1984-07-25 Vapor phase soldering device Granted JPS6133764A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15292884A JPS6133764A (en) 1984-07-25 1984-07-25 Vapor phase soldering device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15292884A JPS6133764A (en) 1984-07-25 1984-07-25 Vapor phase soldering device

Publications (2)

Publication Number Publication Date
JPS6133764A true JPS6133764A (en) 1986-02-17
JPH0459069B2 JPH0459069B2 (en) 1992-09-21

Family

ID=15551205

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15292884A Granted JPS6133764A (en) 1984-07-25 1984-07-25 Vapor phase soldering device

Country Status (1)

Country Link
JP (1) JPS6133764A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106461417A (en) * 2014-10-07 2017-02-22 现代凯菲克株式会社 Device and method for controlling rotator detection sensor for rotator having run-out

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106461417A (en) * 2014-10-07 2017-02-22 现代凯菲克株式会社 Device and method for controlling rotator detection sensor for rotator having run-out

Also Published As

Publication number Publication date
JPH0459069B2 (en) 1992-09-21

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