JPH07163892A - Heating cooling apparatus - Google Patents

Heating cooling apparatus

Info

Publication number
JPH07163892A
JPH07163892A JP34360893A JP34360893A JPH07163892A JP H07163892 A JPH07163892 A JP H07163892A JP 34360893 A JP34360893 A JP 34360893A JP 34360893 A JP34360893 A JP 34360893A JP H07163892 A JPH07163892 A JP H07163892A
Authority
JP
Japan
Prior art keywords
cooling fluid
heating
cooling
supply pipe
compressed air
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP34360893A
Other languages
Japanese (ja)
Other versions
JP3170669B2 (en
Inventor
Takayuki Morii
高之 森井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TLV Co Ltd
Original Assignee
TLV Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TLV Co Ltd filed Critical TLV Co Ltd
Priority to JP34360893A priority Critical patent/JP3170669B2/en
Publication of JPH07163892A publication Critical patent/JPH07163892A/en
Application granted granted Critical
Publication of JP3170669B2 publication Critical patent/JP3170669B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D5/00Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, using the cooling effect of natural or forced evaporation

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
  • Devices For Use In Laboratory Experiments (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)

Abstract

PURPOSE:To provide a heating cooling apparatus, with which thermal damage of an objective article to be cooled can be prevented, by eliminating cooling unevenness by making a cooling fluid to be evaporated adhere uniformly to the whole body of a heat exchanger. CONSTITUTION:A jacket part 2 is formed in the area covering the whole circumference of a reaction furnace 1. A spiral cooling fluid supplying pipe 5 and fluid collecting plates 9 are installed in the jacket part 2. Nozzles 15, 16 are attached above the cooling fluid supplying pipe 5 and the fluid collecting plates. The nozzle 15, 16 are connected with a compressed air supplying pipe 6. A vacuum pump 22 is connected with the lower part of the jacket part 2 through a steam trap 13 and a valve 8.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は熱交換器内の被熱処理物
を加熱冷却するものに関し、特に熱交換室内を減圧状態
にして、100度C以下程度の比較的低温度で加熱する
と共に、冷却流体の蒸発潜熱により被冷却物を気化冷却
する加熱冷却装置に関する。具体的には各種反応釜や食
品や医療品や医薬品等の加熱冷却に用いるものである。
これらの被冷却物は少しの温度上昇によって熱損傷を起
こす場合が多くあり、従って、全体を均一に且つ精度良
く冷却する必要があった。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to heating and cooling an object to be heat-treated in a heat exchanger, and in particular, heating the chamber at a relatively low temperature of about 100 degrees C. The present invention relates to a heating and cooling device that evaporates and cools an object to be cooled by the latent heat of vaporization of a cooling fluid. Specifically, it is used for heating and cooling various reaction kettles, foods, medical products, pharmaceuticals, and the like.
These objects to be cooled often cause thermal damage due to a slight temperature rise, and therefore it is necessary to cool the whole uniformly and accurately.

【0002】[0002]

【従来技術】従来の加熱冷却装置として例えば特開昭6
3−189763号公報に示されたものが用いられてい
た。これは、ジャケット室内に蒸発させた熱媒体を供給
して加熱すると共に、ジャケット室内に熱交換装置と集
液整流装置を設け、ジャケット室内の蒸発した熱媒体
を、熱交換装置によって凝縮させ、この凝縮熱媒体を集
液整流装置によって冷却容器の外壁面に極力均一に膜状
または滴状にして流下させ、その蒸発潜熱により被冷却
物を気化冷却するものである。
2. Description of the Related Art As a conventional heating and cooling device, for example, Japanese Patent Laid-Open No.
What was shown by the 3-189763 gazette was used. This is to supply and heat the vaporized heat medium into the jacket chamber, to provide a heat exchange device and a liquid collecting and rectifying device in the jacket chamber, and to condense the vaporized heat medium in the jacket chamber by the heat exchange device. The condensing heat medium is made to flow into the outer wall surface of the cooling container as uniformly as possible in the form of a film or droplets by a liquid collecting and rectifying device, and the condensing heat medium is evaporated and cooled by the latent heat of vaporization.

【0003】[0003]

【本発明が解決しようとする課題】上記従来の気化冷却
装置は、比較的均一に気化冷却を行うことはできるが、
いまだ部分的に凝縮熱媒体が容器外壁に付着することが
できずに、被冷却物が部分的に熱損傷を生じる問題があ
った。これは、熱交換装置で冷却により生じた凝縮熱媒
体を、集液整流装置から重力による自然流下によっての
み容器外壁に流下させているためである。容器外壁の表
面状態は使用期間と共に異物の付着や酸化等によって変
化すると共に、容器内の被冷却物の温度の高低によって
も凝縮熱媒体の蒸発量が変化するために、重力による自
然流下のみでは部分的に冷却ムラを生じて熱損傷に至る
のである。
Although the above-mentioned conventional evaporative cooling apparatus can evaporatively cool relatively uniformly,
There was a problem that the condensation heat medium could not be partially adhered to the outer wall of the container and the object to be cooled was partially damaged by heat. This is because the condensation heat medium generated by cooling in the heat exchange device is caused to flow down from the liquid collecting and rectifying device to the outer wall of the container only by gravity flow. The surface condition of the outer wall of the container changes due to the adhesion and oxidation of foreign matter over the period of use, and the evaporation amount of the condensation heat medium also changes depending on the temperature of the object to be cooled in the container. Uneven cooling is partially caused and heat damage is caused.

【0004】従って本発明の技術的課題は、容器全体に
均一に気化冷却流体を付着させて、より均一に気化冷却
ができるようにし、被冷却物の部分的な熱損傷を防止す
ることである。
Therefore, a technical problem of the present invention is to uniformly vaporize and cool the vaporized cooling fluid to the entire container so that the vaporized and cooled fluid can be more uniformly vaporized and prevent partial heat damage of the object to be cooled. .

【0005】[0005]

【課題を解決する為の手段】本発明の加熱冷却装置の構
成は次の通りである。熱交換器と、該熱交換器のほぼ全
周を覆う熱交換室と、該熱交換室に加熱冷却流体を供給
する加熱冷却流体管と、該冷却流体管の下部に集液板を
設置すると共に、熱交換室を減圧状態に維持する吸引手
段とから成るものにおいて、冷却流体管と集液板の近傍
に圧縮空気を供給する圧縮空気供給管を接続したもので
ある。
The constitution of the heating / cooling device of the present invention is as follows. A heat exchanger, a heat exchange chamber that covers substantially the entire circumference of the heat exchanger, a heating / cooling fluid pipe for supplying a heating / cooling fluid to the heat exchange chamber, and a liquid collecting plate below the cooling fluid pipe. In addition, a suction means for maintaining the heat exchange chamber in a decompressed state is connected to a cooling fluid pipe and a compressed air supply pipe for supplying compressed air in the vicinity of the liquid collecting plate.

【0006】[0006]

【作用】熱交換室は吸引手段の駆動により減圧状態に維
持されており、加熱流体管からは加熱流体例えば加熱蒸
気が熱交換室に供給される。冷却流体管に冷却流体を供
給することにより、冷却流体管の外周にある加熱蒸気が
凝縮して液体となって集液板に至る。冷却流体管と集液
板の近傍に圧縮空気供給管を接続したことにより、冷却
流体管で凝縮した液体は直ちに集液板に至るために凝縮
する液体量が増加すると共に、集液板から圧縮空気によ
って勢いよく多量の液体が流下することにより熱交換器
の全体に渡ってより均一に冷却液体を供給することがで
きる。
The heat exchange chamber is maintained in a depressurized state by driving the suction means, and the heating fluid such as heating steam is supplied to the heat exchange chamber from the heating fluid pipe. By supplying the cooling fluid to the cooling fluid pipe, the heated steam on the outer periphery of the cooling fluid pipe is condensed to become a liquid and reaches the liquid collecting plate. By connecting the compressed air supply pipe near the cooling fluid pipe and the liquid collecting plate, the liquid condensed in the cooling fluid pipe reaches the liquid collecting plate immediately, so that the amount of condensed liquid increases and the liquid is compressed from the liquid collecting plate. By virtue of the large amount of liquid flowing down by the air, the cooling liquid can be supplied more uniformly throughout the heat exchanger.

【0007】熱交換器の全体に均一に供給された冷却流
体は、被冷却物の熱を奪って蒸発して気化する。気化し
た蒸気は吸引手段に吸引されて熱交換室から排除され
る。一方、熱交換器を加熱する場合は、冷却流体の供給
を停止することにより、加熱流体管から供給された加熱
蒸気により加熱することができる。この場合も、加熱す
ることにより生じた凝縮水としての復水は吸引手段に吸
引されて外部へ排除される。
The cooling fluid uniformly supplied to the entire heat exchanger takes heat of the object to be cooled, evaporates and vaporizes. The vaporized vapor is sucked by the suction means and removed from the heat exchange chamber. On the other hand, when the heat exchanger is heated, the supply of the cooling fluid is stopped so that it can be heated by the heating steam supplied from the heating fluid pipe. Also in this case, condensate as condensed water generated by heating is sucked by the suction means and discharged to the outside.

【0008】[0008]

【実施例】図示の実施例を詳細に説明する。本実施例に
おいては、熱交換器として反応釜1を用いた例を示す。
反応釜1と熱交換室としてのジャケット部2と、吸引手
段としての真空ポンプ22、及び、加熱流体供給管7と
冷却流体供給管11と圧縮空気供給管6とで減圧気化冷
却装置を構成する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The illustrated embodiment will be described in detail. In this embodiment, an example in which the reaction kettle 1 is used as the heat exchanger is shown.
The reaction vessel 1, the jacket portion 2 as a heat exchange chamber, the vacuum pump 22 as a suction means, the heating fluid supply pipe 7, the cooling fluid supply pipe 11, and the compressed air supply pipe 6 constitute a reduced pressure evaporative cooling device. .

【0009】反応釜1は従来から用いられているもの
で、ほぼ全周にジャケット部2を設けて、このジャケッ
ト部2の上方に加熱流体供給管7を接続する。ジャケッ
ト部2内には、冷却流体供給管11の一部を管21を介
して連設し下方から上方へ螺旋状冷却流体供給管5を配
置する。螺旋状冷却流体供給管5の下部に同じく螺旋状
の集液板9を取り付ける。螺旋状冷却流体供給管5と集
液板9は共に反応釜1の外表面から少し離して取り付け
る。螺旋状冷却流体供給管5の出口部は管3と接続す
る。
The reactor 1 has been used conventionally, and a jacket portion 2 is provided on almost the entire circumference, and a heating fluid supply pipe 7 is connected above the jacket portion 2. In the jacket portion 2, a part of the cooling fluid supply pipe 11 is connected via a pipe 21 and a spiral cooling fluid supply pipe 5 is arranged from the lower side to the upper side. A spiral liquid collecting plate 9 is attached to the lower part of the spiral cooling fluid supply pipe 5. Both the spiral cooling fluid supply pipe 5 and the liquid collecting plate 9 are attached at a distance from the outer surface of the reaction vessel 1. The outlet of the spiral cooling fluid supply pipe 5 is connected to the pipe 3.

【0010】ジャケット部2の上部には更にノズル部1
5,16を介して圧縮空気供給管6を接続する。ノズル
部15,16は、螺旋状冷却流体供給管5と集液板9の
上方に開口して、両者に圧縮空気を吹付けることができ
るように配置する。図面には2個のノズル部15,16
を示したが必要に応じて更に増やしたりあるいは減らし
たりすることもできる。
The nozzle portion 1 is further provided above the jacket portion 2.
The compressed air supply pipe 6 is connected via 5 and 16. The nozzle portions 15 and 16 are arranged above the spiral cooling fluid supply pipe 5 and the liquid collecting plate 9 so that compressed air can be blown to them. In the drawing, two nozzle parts 15 and 16 are shown.
However, the number can be increased or decreased as needed.

【0011】ジャケット部2の下部は管30を介してス
チ―ムトラップ13と弁8に接続し、更に真空ポンプ2
2と接続する。真空ポンプ22は、ノズル部23とディ
フュ―ザ24から成るエゼクタ―25と、タンク26
と、渦巻きポンプ27とで構成する。タンク26の下部
と渦巻きポンプ27の吸込み口を接続し吐出口をエゼク
タ―25のノズル部23と接続する。このエゼクタ―式
真空ポンプ22はタンク26内の流体を渦巻きポンプ2
7で循環してノズル部23へ通過させることにより、ノ
ズル部23で吸引力を生じるものである。渦巻きポンプ
27の吐出口と連設する循環路に弁28を介して余剰液
排出通路29を接続する。また、タンク26には冷却流
体供給管11から分岐した供給管33を接続する。
The lower part of the jacket portion 2 is connected to the steam trap 13 and the valve 8 via a pipe 30, and further the vacuum pump 2
Connect with 2. The vacuum pump 22 includes an ejector 25 including a nozzle portion 23 and a diffuser 24, and a tank 26.
And a centrifugal pump 27. The lower portion of the tank 26 is connected to the suction port of the centrifugal pump 27, and the discharge port is connected to the nozzle portion 23 of the ejector 25. This ejector type vacuum pump 22 swirls the fluid in the tank 26
The suction force is generated in the nozzle portion 23 by circulating it in 7 and passing it to the nozzle portion 23. An excess liquid discharge passage 29 is connected via a valve 28 to a circulation passage that is connected to the discharge port of the spiral pump 27. A supply pipe 33 branched from the cooling fluid supply pipe 11 is connected to the tank 26.

【0012】次に作用を説明する。反応釜1を冷却する
場合は、加熱流体供給管7から加熱流体例えば加熱蒸気
をジャケット部2内へ供給すると共に、真空ポンプ22
を駆動させながら冷却流体供給管11と圧縮空気供給管
6から、冷却流体と圧縮空気を同時にジャケット部2内
へ供給する。冷却流体によって加熱蒸気が冷却流体供給
管5の周囲で凝縮して集液板9上に滴下する。この場
合、圧縮空気供給管6を介してノズル部15,16から
圧縮空気が供給されることにより、凝縮する液体量が多
くなり、且つ、集液板9から反応釜1の外表面にこの多
量の凝縮液体が勢いよく吹付けられることによって、反
応釜1の全面に均一に凝縮液体を付着させることができ
る。
Next, the operation will be described. When the reaction kettle 1 is cooled, a heating fluid such as heating steam is supplied from the heating fluid supply pipe 7 into the jacket portion 2, and the vacuum pump 22 is used.
The cooling fluid and the compressed air are simultaneously supplied into the jacket portion 2 from the cooling fluid supply pipe 11 and the compressed air supply pipe 6 while driving. The heating fluid is condensed around the cooling fluid supply pipe 5 by the cooling fluid and drops on the liquid collecting plate 9. In this case, the compressed air is supplied from the nozzle portions 15 and 16 through the compressed air supply pipe 6, so that the amount of the liquid to be condensed increases, and the large amount of the condensed liquid flows from the liquid collecting plate 9 to the outer surface of the reaction vessel 1. By vigorously spraying the condensed liquid of No. 1, the condensed liquid can be uniformly attached to the entire surface of the reaction vessel 1.

【0013】均一に付着した凝縮液体が反応釜1の熱を
奪って気化することによる蒸発潜熱でもって反応釜1を
冷却することができる。そして、冷却により気化した蒸
気と凝縮液体の残りは弁8とスチ―ムトラップ13とを
経てエゼクタ―25に吸引される。
The reaction vessel 1 can be cooled by the latent heat of vaporization caused by the uniformly adhered condensed liquid absorbing the heat of the reaction vessel 1 and evaporating. Then, the vaporized vapor and the rest of the condensed liquid by cooling are sucked into the ejector 25 through the valve 8 and the steam trap 13.

【0014】反応釜1を加熱する場合は、螺旋状冷却流
体供給管5への冷却流体の供給を停止することにより、
加熱流体供給管7から供給された加熱蒸気によって加熱
することができる。この場合も加熱によって生じた復水
はスチ―ムトラップ13を経てエゼクタ―25に吸引さ
れる。
When heating the reaction kettle 1, by stopping the supply of the cooling fluid to the spiral cooling fluid supply pipe 5,
It can be heated by the heating steam supplied from the heating fluid supply pipe 7. Also in this case, the condensed water generated by heating is sucked into the ejector 25 through the steam trap 13.

【0015】[0015]

【発明の効果】本発明によれば、冷却流体管と集液板の
近傍に圧縮空気供給管を接続して圧縮空気を供給したこ
とにより、冷却流体管でより多くの凝縮液体を発生する
ことができると共に、この多量の凝縮液体を圧縮空気に
よって勢いよく集液板から熱交換器の全体に均一に供給
することができ、熱交換器の全体をムラなく冷却するこ
とができて部分的な熱損傷を防止することができる。
According to the present invention, more compressed liquid is generated in the cooling fluid pipe by connecting the compressed air supply pipe near the cooling fluid pipe and the liquid collecting plate to supply compressed air. At the same time, this large amount of condensed liquid can be vigorously supplied uniformly from the liquid collecting plate to the entire heat exchanger by the compressed air, and the entire heat exchanger can be cooled evenly and partially. It is possible to prevent heat damage.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の加熱冷却装置の実施例の構成図であ
る。
FIG. 1 is a configuration diagram of an embodiment of a heating / cooling device of the present invention.

【符号の説明】[Explanation of symbols]

1 反応釜 2 ジャケット部 5 螺旋状冷却流体供給管 6 圧縮空気供給管 7 加熱流体供給管 9 集液板 11 冷却流体供給管 13 スチ―ムトラップ 15,16 ノズル部 22 真空ポンプ 23 ノズル部 25 エゼクタ― 26 タンク 27 渦巻きポンプ 1 Reactor 2 Jacket 5 Spiral Cooling Fluid Supply Pipe 6 Compressed Air Supply Pipe 7 Heating Fluid Supply Pipe 9 Liquid Collection Plate 11 Cooling Fluid Supply Pipe 13 Steam Trap 15, 16 Nozzle Part 22 Vacuum Pump 23 Nozzle Part 25 Ejector 26 tank 27 centrifugal pump

フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 FI 技術表示箇所 F28D 5/00 7/02 Continuation of front page (51) Int.Cl. 6 Identification number Office reference number FI technical display location F28D 5/00 7/02

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 熱交換器と、該熱交換器のほぼ全周を覆
う熱交換室と、該熱交換室に加熱冷却流体を供給する加
熱冷却流体管と、該冷却流体管の下部に集液板を設置す
ると共に、熱交換室を減圧状態に維持する吸引手段とか
ら成るものにおいて、冷却流体管と集液板の近傍に圧縮
空気を供給する圧縮空気供給管を接続したことを特徴と
する加熱冷却装置。
1. A heat exchanger, a heat exchange chamber that covers substantially the entire circumference of the heat exchanger, a heating / cooling fluid pipe for supplying a heating / cooling fluid to the heat exchange chamber, and a collection unit at the lower portion of the cooling fluid pipe. In addition to installing a liquid plate and suction means for maintaining the heat exchange chamber in a depressurized state, a cooling fluid pipe and a compressed air supply pipe for supplying compressed air to the vicinity of the liquid collection plate are connected. Heating and cooling device.
JP34360893A 1993-12-15 1993-12-15 Heating and cooling device Expired - Lifetime JP3170669B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP34360893A JP3170669B2 (en) 1993-12-15 1993-12-15 Heating and cooling device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP34360893A JP3170669B2 (en) 1993-12-15 1993-12-15 Heating and cooling device

Publications (2)

Publication Number Publication Date
JPH07163892A true JPH07163892A (en) 1995-06-27
JP3170669B2 JP3170669B2 (en) 2001-05-28

Family

ID=18362855

Family Applications (1)

Application Number Title Priority Date Filing Date
JP34360893A Expired - Lifetime JP3170669B2 (en) 1993-12-15 1993-12-15 Heating and cooling device

Country Status (1)

Country Link
JP (1) JP3170669B2 (en)

Cited By (7)

* Cited by examiner, † Cited by third party
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JP2006308188A (en) * 2005-04-28 2006-11-09 Tlv Co Ltd Heat exchange device
JP2008096062A (en) * 2006-10-13 2008-04-24 Tlv Co Ltd Evaporative cooling device
JP2008122041A (en) * 2006-11-15 2008-05-29 Tlv Co Ltd Heating/cooling device
JP2010266144A (en) * 2009-05-15 2010-11-25 Tlv Co Ltd Vaporization cooling device
WO2011016443A1 (en) * 2009-08-04 2011-02-10 大陽日酸株式会社 Reaction device
JP2011038725A (en) * 2009-08-12 2011-02-24 Tlv Co Ltd Heating and cooling device
CN112237893A (en) * 2019-07-17 2021-01-19 南京凯旋化学科技有限公司 Device for producing polyformaldehyde dimethyl ether

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006255503A (en) * 2005-03-15 2006-09-28 Tlv Co Ltd Heating/cooling apparatus
JP2006308187A (en) * 2005-04-28 2006-11-09 Tlv Co Ltd Vaporization cooling device
JP2009168308A (en) * 2008-01-15 2009-07-30 Tlv Co Ltd Evaporative cooling apparatus

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006308188A (en) * 2005-04-28 2006-11-09 Tlv Co Ltd Heat exchange device
JP2008096062A (en) * 2006-10-13 2008-04-24 Tlv Co Ltd Evaporative cooling device
JP2008122041A (en) * 2006-11-15 2008-05-29 Tlv Co Ltd Heating/cooling device
JP2010266144A (en) * 2009-05-15 2010-11-25 Tlv Co Ltd Vaporization cooling device
WO2011016443A1 (en) * 2009-08-04 2011-02-10 大陽日酸株式会社 Reaction device
CN102472590A (en) * 2009-08-04 2012-05-23 大阳日酸株式会社 Reaction device
JP5249419B2 (en) * 2009-08-04 2013-07-31 大陽日酸株式会社 Reactor
US8721982B2 (en) 2009-08-04 2014-05-13 Taiyo Nippon Sanso Corporation Reaction device
JP2011038725A (en) * 2009-08-12 2011-02-24 Tlv Co Ltd Heating and cooling device
CN112237893A (en) * 2019-07-17 2021-01-19 南京凯旋化学科技有限公司 Device for producing polyformaldehyde dimethyl ether

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