JP3170669B2 - Heating and cooling device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for heating and cooling an object to be heat-treated in a heat exchanger, and more particularly, to heating a heat exchange chamber at a relatively low temperature of about 100.degree. The present invention relates to a heating and cooling device for evaporating and cooling an object to be cooled by the latent heat of evaporation of a cooling fluid. Specifically, it is used for heating and cooling various kinds of reactors, foods, medical products, pharmaceuticals and the like.
These objects to be cooled often cause thermal damage due to a slight rise in temperature, and therefore, it is necessary to cool the entire object uniformly and accurately.

[0002]

2. Description of the Related Art As a conventional heating / cooling apparatus, for example, Japanese Unexamined Patent Publication No.
The one disclosed in Japanese Patent Application Laid-Open No. 3-189763 was used. This is to supply and heat the evaporated heat medium into the jacket chamber, provide a heat exchange device and a liquid collection and rectification device in the jacket room, and condense the evaporated heat medium in the jacket chamber by the heat exchange device. The condensed heat medium is made to flow as uniformly as possible in the form of a film or droplets on the outer wall surface of the cooling vessel by the liquid collecting and rectifying device, and the object to be cooled is evaporated and cooled by the latent heat of evaporation.

[0003]

The above-mentioned conventional evaporative cooling apparatus can perform evaporative cooling relatively uniformly,
There is still a problem that the condensed heat medium cannot partially adhere to the outer wall of the container, and the object to be cooled partially suffers thermal damage. This is because the condensed heat medium generated by cooling in the heat exchange device is allowed to flow down to the outer wall of the container only from the liquid collecting and rectifying device by natural gravity. The surface condition of the outer wall of the container changes due to the adhesion or oxidation of foreign matter over the period of use, and the evaporation amount of the condensing heat medium changes depending on the temperature of the object to be cooled in the container. This causes partial cooling unevenness and leads to thermal damage.

Accordingly, a technical problem of the present invention is to uniformly vaporize and cool a fluid on the entire container so that vaporization and cooling can be performed more uniformly, and to prevent partial thermal damage of an object to be cooled. .

[0005]

The constitution of the heating and cooling device of the present invention is as follows. A heat exchanger, a heat exchange chamber covering substantially the entire circumference of the heat exchanger, a heating / cooling fluid pipe for supplying a heating / cooling fluid to the heat exchange chamber, and a liquid collecting plate provided below the cooling fluid pipe. together, in what made the heat exchange chamber and a suction means for maintaining a reduced pressure state, pressure in the cooling fluid conduit and the liquid-collecting plate
A compressed air supply pipe for blowing compressed air is connected.

[0006]

The heat exchange chamber is maintained in a reduced pressure state by driving the suction means, and a heating fluid, for example, heating steam is supplied to the heat exchange chamber from the heating fluid pipe. By supplying the cooling fluid to the cooling fluid pipe, the heated steam on the outer periphery of the cooling fluid pipe is condensed to become a liquid and reaches the liquid collecting plate. By connecting the compressed air supply pipe near the cooling fluid pipe and the liquid collecting plate, the amount of liquid condensed in the cooling fluid pipe immediately reaches the liquid collecting plate, and the amount of liquid condensed increases. By vigorously flowing a large amount of liquid by the air, the cooling liquid can be supplied more uniformly throughout the heat exchanger.

[0007] The cooling fluid uniformly supplied to the entire heat exchanger takes away the heat of the object to be cooled and evaporates and evaporates. The vaporized vapor is sucked by the suction means and discharged from the heat exchange chamber. On the other hand, when heating the heat exchanger, by stopping the supply of the cooling fluid, the heat exchanger can be heated by the heating steam supplied from the heating fluid pipe. Also in this case, the condensed water as the condensed water generated by the heating is sucked by the suction means and removed to the outside.

[0008]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. In this embodiment, an example in which the reactor 1 is used as a heat exchanger will be described.
The reactor 1, the jacket 2 as a heat exchange chamber, the vacuum pump 22 as a suction means, and the heating fluid supply pipe 7, the cooling fluid supply pipe 11, and the compressed air supply pipe 6 constitute a reduced-pressure evaporative cooling device. .

The reactor 1 has been used in the past, and a jacket portion 2 is provided substantially all around. A heating fluid supply pipe 7 is connected above the jacket portion 2. In the jacket portion 2, a part of the cooling fluid supply pipe 11 is continuously connected via a pipe 21, and a spiral cooling fluid supply pipe 5 is arranged from below to above. A spiral liquid collecting plate 9 is attached to the lower part of the spiral cooling fluid supply pipe 5. The spiral cooling fluid supply pipe 5 and the liquid collecting plate 9 are both mounted a little apart from the outer surface of the reactor 1. The outlet of the spiral cooling fluid supply pipe 5 is connected to the pipe 3.

The nozzle 1 is further provided on the upper part of the jacket 2.
The compressed air supply pipe 6 is connected via 5 and 16. The nozzle portions 15, 16 are opened above the spiral cooling fluid supply pipe 5 and the liquid collecting plate 9, and are arranged so that compressed air can be blown to both. The drawing shows two nozzles 15, 16
However, the number can be increased or decreased as necessary.

The lower portion of the jacket portion 2 is connected to a steam trap 13 and a valve 8 through a pipe 30, and a vacuum pump 2
Connect to 2. The vacuum pump 22 includes an ejector 25 including a nozzle portion 23 and a diffuser 24, and a tank 26.
And a volute pump 27. The lower part of the tank 26 is connected to the suction port of the spiral pump 27, and the discharge port is connected to the nozzle 23 of the ejector 25. The ejector type vacuum pump 22 pumps the fluid in the tank 26 by the vortex pump 2.
By circulating at 7 and passing through the nozzle portion 23, a suction force is generated at the nozzle portion 23. An excess liquid discharge passage 29 is connected via a valve 28 to a circulation passage connected to the discharge port of the spiral pump 27. A supply pipe 33 branched from the cooling fluid supply pipe 11 is connected to the tank 26.

Next, the operation will be described. When cooling the reaction vessel 1, a heating fluid, for example, heating steam is supplied from the heating fluid supply pipe 7 into the jacket portion 2 and the vacuum pump 22
, The cooling fluid and the compressed air are simultaneously supplied from the cooling fluid supply pipe 11 and the compressed air supply pipe 6 into the jacket portion 2. The heating fluid is condensed around the cooling fluid supply pipe 5 by the cooling fluid and drops on the liquid collecting plate 9. In this case, the compressed air is supplied from the nozzle portions 15 and 16 through the compressed air supply pipe 6, so that the amount of condensed liquid increases and the large amount of liquid condenses from the liquid collecting plate 9 to the outer surface of the reactor 1. The condensed liquid can be uniformly attached to the entire surface of the reaction vessel 1 by vigorously spraying the condensed liquid.

The reaction vessel 1 can be cooled by the latent heat of vaporization caused by the condensed liquid uniformly attached to remove the heat of the reaction vessel 1 and evaporate. The remaining vapor and condensed liquid vaporized by cooling are sucked into the ejector 25 through the valve 8 and the steam trap 13.

When heating the reactor 1, the supply of the cooling fluid to the spiral cooling fluid supply pipe 5 is stopped,
The heating can be performed by the heating steam supplied from the heating fluid supply pipe 7. Also in this case, the condensate generated by the heating is sucked into the ejector 25 through the steam trap 13.

[0015]

According to the present invention, a compressed air supply pipe is connected near a cooling fluid pipe and a liquid collecting plate to supply compressed air, so that more condensed liquid is generated in the cooling fluid pipe. And a large amount of the condensed liquid can be supplied uniformly from the liquid collecting plate to the entire heat exchanger with compressed air, and the entire heat exchanger can be cooled evenly and partially. Thermal damage can be prevented.

[Brief description of the drawings]

FIG. 1 is a configuration diagram of an embodiment of a heating / cooling device of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Reaction vessel 2 Jacket part 5 Spiral cooling fluid supply pipe 6 Compressed air supply pipe 7 Heating fluid supply pipe 9 Liquid collecting plate 11 Cooling fluid supply pipe 13 Steam trap 15, 16 Nozzle part 22 Vacuum pump 23 Nozzle part 25 Ejector 26 tank 27 centrifugal pump

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁷ identification code FI F28D 5/00 F28D 5/00 7/02 7/02 (58) Fields investigated (Int. Cl. ⁷ , DB name) B01L 7 / 00 B01J 19/00 301 F25D 7/00 F25D 9/00 F28D 5/00 F28D 7/02

Claims (1)

(57) [Claims] 1. A heat exchanger, a heat exchange chamber covering substantially the entire circumference of the heat exchanger, a heating / cooling fluid pipe for supplying a heating / cooling fluid to the heat exchange chamber, and a collecting pipe located below the cooling fluid pipe. with installing a liquid plate, in the heat exchange chamber made of a suction means for maintaining a reduced pressure state, the compressed air to the cooling fluid conduit and the liquid-collecting plate
A heating and cooling device to which a blown compressed air supply pipe is connected.