JPS6133645Y2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a cooling plate for an electronic device, such as an information processing device or an electronic exchange, which has a heat generating element such as a high-speed, highly integrated semiconductor chip that consumes a large amount of power.

In information processing equipment, electronic switching equipment, etc., highly integrated semiconductor elements and various types of high-density and miniaturized mounting components are gradually being adopted in order to improve the processing performance and reliability of the equipment. Ta. In semiconductor device technology, as seen in logic elements, the speed and power product per gate are gradually decreasing, and the area occupied by each gate is also gradually decreasing due to the development of microfabrication technology. For this reason, semiconductor chips tend to be faster and more highly integrated. However, when the degree of integration is high, the power consumption of the chip increases, and when the degree of integration is constant, the higher the speed of the chip, the higher the power consumption becomes. By using a large number of such semiconductor chips, electronic devices can be miniaturized.
To increase density, the amount of heat generated per unit volume or unit area of the wiring board on which the chip is mounted increases, so a cooling method suitable for this requires a method with a large cooling capacity per unit area or unit area. .

Conventionally, methods of cooling electronic devices have been considered, such as embedding a cooling pipe such as a heat pipe in a wiring board on which a semiconductor chip is mounted, or immersing the entire wiring board in an insulating cooling liquid. However, according to these cooling methods, when a semiconductor chip malfunctions, it is extremely difficult to replace or repair the semiconductor chip or the wiring board on which the semiconductor chip is mounted. Not only that, but the structure was such that major cooling mechanism parts such as heat pipes could not be replaced due to deterioration or failure of the cooling system itself.

In view of the above points, the present invention has been developed to prevent damage to electronic components such as semiconductor chips, wiring boards on which these electronic components are mounted, or in the event of functional deterioration or damage to the cooling section of a cooling system. To provide a cooling plate in which only the malfunctioning parts or faulty parts of the cooling plate can be easily replaced or repaired individually.

Therefore, in this invention, a part of the cooling plate containing multiple refrigerant circulation pipes in parallel can be opened and closed using bendable cooling pipes to form a window that exposes the board equipped with heating elements. This is a small cooling plate, and the drawings will be explained in detail below.

FIG. 1 shows an embodiment of the present invention, in which the extended portion of the cooling pipe 2 extending from the end of the cooling plate 1 to the connector 4 is formed into a wave shape, for example, so as to be bendable. 11 is a board on which a heating element such as a semiconductor chip 12 is mounted in a flat manner,
A hinge 13 that rotatably supports the cooling plate 1 is formed between the tip of the side plate extending from the side plate that covers the side surface of the cooling plate 1, and a lock mechanism 14 is provided between the cooling plate 1 and the other end of the cooling plate 1. It is being Reference numerals 101 and 102 are small cooling plates that can further open and close a part of the cooling plate 1, and a hinge 1 is provided between the cooling plate 1 and the cooling plate 1 on one end side.
31, 132 are provided, and a lock mechanism 141, 142 is provided between the cooling plate 1 and the hinge 1 on the other end side.
Small cooling plates 101, 102 on the 31, 132 side
The cooling pipe between the cooling pipe of the cooling plate 1 and the cooling pipe of the main body of the cooling plate 1 is formed to be flexible. The small cooling plates 101, 102 form windows that open to expose the portion of the board opposite the small cooling plates. The positions where the small cooling plates 101 and 102 are provided are not limited to the illustrated positions, but can be provided at any required location. Therefore, in a device composed of a large number of semiconductor chips and wiring boards, if the small cooling plates 101 and 102 are placed on a specific semiconductor chip or wiring board, that semiconductor chip or wiring board can be replaced. When making repairs, it is possible to eliminate the fear of damaging or damaging the majority of other semiconductor chips and wiring boards.

FIG. 2 shows an example of a cooling plate used in the present invention. The cooling plate 1 has a heat pipe having a circular or flat circular cross section, or a cooling pipe 2 which is formed by arranging a plurality of pipes for circulating cooling liquid in parallel.
A metal plate 3 having excellent thermal conductivity such as copper is bonded to both sides of the plate with low thermal resistance by means such as welding or soldering to form a plate. metal plate 3
has the dual function of evenly distributing the amount of heat transferred by the cooling pipe in the path of transferring the heat generated from the heating element to the heat radiating section 8 via the cooling pipe 2, and protecting the pipe from damage caused by external force. .

As explained above, the cooling plate with a window according to the present invention has a small cooling plate that uses flexible cooling pipes installed in a part of the cooling plate that has multiple refrigerant circulation pipes built in parallel, and a door plate that can be opened and closed. Since the heating elements mounted on the board can be directly exposed through the window, it is possible to replace only some of the failed electronic components mounted on the wiring board with new ones, and the repair process is much easier than with conventional cooling boards. can be significantly reduced compared to

[Brief explanation of the drawing]

Fig. 1 is a schematic perspective view of one embodiment of the present invention;
The figure is an enlarged perspective sectional view of a part of the cooling plate. DESCRIPTION OF SYMBOLS 1... Cooling plate, 2... Cooling pipe, 3... Metal plate, 4... Connector, 8... Heat radiation part, 11... Board, 13... Hinge, 14... Lock mechanism, 10
1,102...Small cooling plate.

Claims (1)

[Scope of utility model claims] A small cooling plate that can be opened and closed using bendable cooling pipes so that a part of the cooling plate has multiple cooling pipes for circulating refrigerant built in parallel, forming a window that exposes the board equipped with heat generating elements. A cooling plate with a window for cooling a heating element, characterized by: