JPS6133081U - electrode substrate - Google Patents
electrode substrateInfo
- Publication number
- JPS6133081U JPS6133081U JP1984114731U JP11473184U JPS6133081U JP S6133081 U JPS6133081 U JP S6133081U JP 1984114731 U JP1984114731 U JP 1984114731U JP 11473184 U JP11473184 U JP 11473184U JP S6133081 U JPS6133081 U JP S6133081U
- Authority
- JP
- Japan
- Prior art keywords
- electrode substrate
- lead
- external lead
- conductive layer
- external
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【図面の簡単な説明】
第１図乃至第３図は本考案の一実施例を示すもので、第
１図はガス放電表示パネルに適用した場合の斜視図、第
２図は第１図の要部斜視図、第３図Ａ及び第３図Ｂはそ
れぞれリードピンの形状例を示す斜視図であり、第４図
は従来例の要部斜視図である。
１・・・電極基板、２・・・接続基板、３・・・導電体
層、４・・・リードピン、４ａ・・・外部リード接続部
、５・・・外部リード導出部。[Brief Description of the Drawings] Figures 1 to 3 show an embodiment of the present invention, in which Figure 1 is a perspective view when applied to a gas discharge display panel, and Figure 2 is a view of the embodiment of the present invention. 3A and 3B are perspective views showing examples of the shape of the lead pin, respectively, and FIG. 4 is a perspective view of the main part of a conventional example. DESCRIPTION OF SYMBOLS 1... Electrode substrate, 2... Connection board, 3... Conductor layer, 4... Lead pin, 4a... External lead connection part, 5... External lead lead-out part.
Claims (2)
層に、外部リード接続部を有するリードピンを接続して
外部リード導出部を形成したことを特徴とする電極基板
。(1) An electrode substrate characterized in that a conductive layer is deposited on an insulating substrate, and a lead pin having an external lead connecting portion is connected to the conductive layer to form an external lead lead-out portion.
することを特徴とする実用新案登録請求の範囲第１項に
記載の電極基板。(2) The electrode substrate according to claim 1, wherein the external lead connection portion of the lead pin has a hollow structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984114731U JPS6133081U (en) | 1984-07-27 | 1984-07-27 | electrode substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984114731U JPS6133081U (en) | 1984-07-27 | 1984-07-27 | electrode substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6133081U true JPS6133081U (en) | 1986-02-28 |
Family
ID=30673739
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984114731U Pending JPS6133081U (en) | 1984-07-27 | 1984-07-27 | electrode substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6133081U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5121439B2 (en) * | 1972-02-26 | 1976-07-02 |
-
1984
- 1984-07-27 JP JP1984114731U patent/JPS6133081U/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5121439B2 (en) * | 1972-02-26 | 1976-07-02 |
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