JPS6130245U - Tape pasting machine for semiconductor chips - Google Patents

Tape pasting machine for semiconductor chips

Info

Publication number
JPS6130245U
JPS6130245U JP11395584U JP11395584U JPS6130245U JP S6130245 U JPS6130245 U JP S6130245U JP 11395584 U JP11395584 U JP 11395584U JP 11395584 U JP11395584 U JP 11395584U JP S6130245 U JPS6130245 U JP S6130245U
Authority
JP
Japan
Prior art keywords
tape
pasting machine
semiconductor chips
tape pasting
different type
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11395584U
Other languages
Japanese (ja)
Inventor
直樹 管生
昇 小野里
Original Assignee
富士通株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士通株式会社 filed Critical 富士通株式会社
Priority to JP11395584U priority Critical patent/JPS6130245U/en
Publication of JPS6130245U publication Critical patent/JPS6130245U/en
Pending legal-status Critical Current

Links

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図aおよびbは本考案のテープ貼付機に使用するポ
リイミドテープの平面図と断面図、第2図は本考案にか
かるポリイミド薄片をピレクアップする状態を示す断面
図、第3図はテープ貼付機の概要平面図、第4図は従来
のポリイミド薄片全ピックアンプする状態を示す断面図
、第5図は従来のポリイミドテープの打ち抜き後の状態
を示す図である。 図において、1は従来のポリイミドテープ、1Tはポリ
イミド薄片、2’,2“はリール、3は打抜キユニット
、4は貼付ユニット、4Pはチャッキングコレット、5
はパッケージ、5Cは半導体チップ、6はパッケージフ
ィーダ、7は2テレビカメラ、110はビニールテープ
、11ハ本考案に用いるポリイミドテープ、31はカッ
ター、32は突上げ棒、を示している。
Figures 1 a and b are a plan view and a sectional view of the polyimide tape used in the tape applicator of the present invention, Figure 2 is a sectional view showing the state in which the polyimide thin piece according to the present invention is pulled up, and Figure 3 is the tape applicator. FIG. 4 is a schematic plan view of the machine, FIG. 4 is a sectional view showing a state in which a conventional polyimide thin film is fully picked and amplified, and FIG. 5 is a diagram showing a state after punching a conventional polyimide tape. In the figure, 1 is a conventional polyimide tape, 1T is a polyimide thin piece, 2', 2'' are reels, 3 is a punching unit, 4 is a pasting unit, 4P is a chucking collet, 5
5C is a package, 5C is a semiconductor chip, 6 is a package feeder, 7 is 2 television cameras, 110 is a vinyl tape, 11 is a polyimide tape used in the present invention, 31 is a cutter, and 32 is a push-up rod.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 異種テープ・に張り合わせた所定寸法のテープ片を、異
種テープ裏面より突き上げ、上方からチャツキングコレ
ットによって異種テープ表面上のテープ片番ピックアッ
プし、次いで該チャツキングコレットを移動して、半導
体チップ上にテープ片を貼付するようにしたことを特徴
とする半導体チップ用テープ貼付機。
A piece of tape of a predetermined size pasted onto a different type of tape is pushed up from the back side of the different type of tape, a piece of tape on the surface of the different type of tape is picked up from above by a chucking collet, and then the chucking collet is moved to place it on a semiconductor chip. A semiconductor chip tape pasting machine characterized by pasting tape pieces.
JP11395584U 1984-07-25 1984-07-25 Tape pasting machine for semiconductor chips Pending JPS6130245U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11395584U JPS6130245U (en) 1984-07-25 1984-07-25 Tape pasting machine for semiconductor chips

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11395584U JPS6130245U (en) 1984-07-25 1984-07-25 Tape pasting machine for semiconductor chips

Publications (1)

Publication Number Publication Date
JPS6130245U true JPS6130245U (en) 1986-02-24

Family

ID=30672983

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11395584U Pending JPS6130245U (en) 1984-07-25 1984-07-25 Tape pasting machine for semiconductor chips

Country Status (1)

Country Link
JP (1) JPS6130245U (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS511322U (en) * 1974-06-20 1976-01-07
JPS51146980A (en) * 1975-06-12 1976-12-16 Toyo Boseki Bottle stopper

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS511322U (en) * 1974-06-20 1976-01-07
JPS51146980A (en) * 1975-06-12 1976-12-16 Toyo Boseki Bottle stopper

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