JPS61295642A - Semiconductor integrated circuit device - Google Patents

Semiconductor integrated circuit device

Info

Publication number
JPS61295642A
JPS61295642A JP60138610A JP13861085A JPS61295642A JP S61295642 A JPS61295642 A JP S61295642A JP 60138610 A JP60138610 A JP 60138610A JP 13861085 A JP13861085 A JP 13861085A JP S61295642 A JPS61295642 A JP S61295642A
Authority
JP
Japan
Prior art keywords
wiring
gate
layer
wirings
circuit device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP60138610A
Other languages
Japanese (ja)
Inventor
Yasushi Kinoshita
木下 靖史
Takahiko Arakawa
荒川 隆彦
Masahiro Ueda
昌弘 植田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP60138610A priority Critical patent/JPS61295642A/en
Publication of JPS61295642A publication Critical patent/JPS61295642A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/10Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
    • H01L27/118Masterslice integrated circuits
    • H01L27/11803Masterslice integrated circuits using field effect technology
    • H01L27/11807CMOS gate arrays

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)

Abstract

PURPOSE:To reduce FORBIDDEN regions, and to contrive to enhance wiring efficiency at a semiconductor integrated circuit device by a method wherein the gate electrode parts of transistors not being used at a CMOS gate array are used as signal wirings in place of second layer aluminium wirings. CONSTITUTION:A poly-silicon gate 7 is so formed as to make signal lines to be led out from both the edges of the gate thereof, the symbol 2 in the figure is an N<+> type diffusion layer and the symbol 3 is the GND (an aluminium wiring). A signal inputted from a first layer aluminium wiring 4a in the lateral direction passes through a poly-silicon layer connected to the gate contact 7, and transmitted to a first layer aluminium wiring 4e connected to a gate contact 8. Because the gate electrode parts are used like this without using second layer aluminium wirings, no FORBIDDEN region is generated. Accordingly, the second layer aluminium wirings 9a-9e in the longitudinal direction can be used.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、相補形MOS)ランジスタをアレイ状に並
べたデーl−アレイ (CMOSゲートアレイ)を有す
る半導体集積回路装置に関し、特にその配線効率の向上
に関するものである。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor integrated circuit device having a data array (CMOS gate array) in which complementary MOS transistors are arranged in an array. It is related to the improvement of

〔従来の技術〕[Conventional technology]

一般に、マスクスライス方式のCMOSゲートアレイに
おいては、予め用意された多数個のトランジスタのうち
の複数個のトランジスタを用いて所望の論理を構成する
ようにしている。
Generally, in a mask slice type CMOS gate array, a desired logic is constructed using a plurality of transistors out of a large number of transistors prepared in advance.

第3図はCMOSのうちのNMO5の部分を示したもの
であり、図において、1はポリシリコンゲート、2はn
十拡散層のドレイン又はソースである。また、3はGN
D (アルミ配線)、4a〜4eは横方向の第1層アル
ミ配線、6は縦方向の配線にだけ使用される第2層アル
ミ配線、5a。
Figure 3 shows the NMO5 part of the CMOS. In the figure, 1 is a polysilicon gate, 2 is an n
10 is the drain or source of the diffusion layer. Also, 3 is GN
D (aluminum wiring), 4a to 4e are horizontal first layer aluminum wirings, 6 is a second layer aluminum wiring used only for vertical wiring, and 5a.

5bは上記第1層アルミ配線4aと第2Nアルミ配線6
とを接続し、第1Nアルミ配線4aと40を結ぶスルー
ホールである。なお、図中×印はグリッドを示している
5b is the first layer aluminum wiring 4a and the second N aluminum wiring 6.
This is a through hole that connects the first N aluminum wiring 4a and 40. Note that the x mark in the figure indicates a grid.

このように、従来構造のものでは、スルーホール5aで
、第1Mアルミ配線4aと第2Nアルミ配線6とを接続
し、スルーホール5bで第1層アルミ配線4eと第2層
アルミ配線6とを接続して第1層アルミ配線4aと4e
を結ぶようにしておリ、第2Mアルミ配線6!I・上に
は、他の配線は使用できない。即ち、縦配線禁止帯(F
ORBIDDEN )ができることとなる。
In this way, in the conventional structure, the first M aluminum wiring 4a and the second N aluminum wiring 6 are connected by the through hole 5a, and the first layer aluminum wiring 4e and the second layer aluminum wiring 6 are connected by the through hole 5b. Connect first layer aluminum wiring 4a and 4e
Connect the 2nd M aluminum wiring 6! No other wiring can be used on I. In other words, vertical wiring prohibited zone (F
ORBIDDEN).

これを第4図及び第5図を用いてより詳細に説明する。This will be explained in more detail using FIGS. 4 and 5.

第4図は上記第3図のNMOSの部分に第2層アルミ配
線9a、9cを設けたものであり、そのv−v線断面を
第5図に示している。この第5図において、第4図と同
一符号は同一のものを示し、15はP型ウェル領域、1
4はゲート絶縁膜、11.12.13はそれぞれ層間絶
縁膜、10は表面保護膜である。
FIG. 4 shows that second layer aluminum interconnections 9a and 9c are provided in the NMOS portion of FIG. 3, and FIG. 5 shows a cross section taken along the line v--v. In FIG. 5, the same symbols as in FIG. 4 indicate the same parts, 15 is a P-type well region, 1
4 is a gate insulating film, 11, 12, and 13 are interlayer insulating films, and 10 is a surface protection film.

これらの図から明らかなように、第1層アルミ配線4a
と48とを接続するために第2層アルミ配線6を使用し
ているので、この部分では縦方向配線9a、9cに相当
する配線を使用することはできない。
As is clear from these figures, the first layer aluminum wiring 4a
Since the second layer aluminum wiring 6 is used to connect the lines 48 and 48, wiring corresponding to the vertical wirings 9a and 9c cannot be used in this portion.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

以上のように、従来のCMOSゲートアレイでは、第1
層アルミ配線を接続するために縦方向の第2層アルミ配
線を使用しているため禁止帯cp。
As mentioned above, in the conventional CMOS gate array, the first
Forbidden band CP because vertical second layer aluminum wiring is used to connect layer aluminum wiring.

RBIDDEN領域)ができてしまい、その領域内で他
の縦方向配線ができないという問題があった。
There is a problem in that an RBIDDEN region) is formed, and other vertical wiring cannot be done within that region.

この発明は、上記のような問題点を解消するためになさ
れたもので、第2JWアルミ配線を使用せずに、すなわ
ちFORBIDDEN領域をつくらずに横方向配線を接
続することのできる半導体集積回路装置を得ることを目
的とする。
This invention was made in order to solve the above-mentioned problems, and provides a semiconductor integrated circuit device in which horizontal wiring can be connected without using the second JW aluminum wiring, that is, without creating a FORBIDDEN region. The purpose is to obtain.

ところで、従来のマスクスライス方式のCMOSゲート
アレイにおいては、論理セルを構成していないMOSト
ランジスタは全く使用されていない。従って、この使用
されていないトランジスタを利用して各論理セル間を接
続すれば合理的であり、配線効率の向上が期待できると
考えられる。
Incidentally, in a conventional mask slice type CMOS gate array, MOS transistors that do not constitute logic cells are not used at all. Therefore, it is reasonable to connect each logic cell using these unused transistors, and it is considered that improvement in wiring efficiency can be expected.

〔問題点を解決するための手段〕[Means for solving problems]

そこでこの発明に係る半導体集積回路装置は、CMOS
ゲートアレイにおける使用されていないトランジスタの
ゲート電極部を、第2層アルミ配線の代わりに信号配線
として用いるようにしたものである。
Therefore, the semiconductor integrated circuit device according to the present invention is a CMOS
The gate electrode portions of unused transistors in the gate array are used as signal wiring instead of the second layer aluminum wiring.

〔作用〕[Effect]

この発明においては、論理セルを構成しないトランジス
タのゲートを第2層アルミ配線の代わりに使用すること
から、FORBIDDEN領域ができず、他の縦方向の
配線領域が増加し、配線効率が上がる。
In this invention, since the gate of a transistor that does not constitute a logic cell is used in place of the second layer aluminum wiring, a FORBIDDEN region is not created, other vertical wiring regions are increased, and wiring efficiency is improved.

〔実施例〕〔Example〕

以下、この発明の一実施例を図について説明する。第1
図において、1はポリシリコンゲートであり、その両端
は該両端から信号線が引き出せるような形状となってい
る。2はn十拡散層、3はGND (アルミ配線)、4
a〜4fは、横方向の第1層アルミ配線である。7.8
はゲートコンタクトであり、ゲートコンタクト7で第1
層アルミ配線4aとポリシリコン(ポリシリコンゲート
1)とを接続し、ゲートコンタクト8で第1層アルミ配
線4eとポリシリコンを接続している。
An embodiment of the present invention will be described below with reference to the drawings. 1st
In the figure, reference numeral 1 denotes a polysilicon gate, and both ends thereof are shaped so that signal lines can be drawn out from both ends. 2 is n10 diffusion layer, 3 is GND (aluminum wiring), 4
a to 4f are horizontal first layer aluminum wirings. 7.8
is the gate contact, and gate contact 7 is the first
Layer aluminum wiring 4a and polysilicon (polysilicon gate 1) are connected, and gate contact 8 connects first layer aluminum wiring 4e and polysilicon.

このような構成においては、第1層アルミ配線4aから
入った信号は、ゲートコンタクト7で接続されたポリシ
リコンを通り、ゲートコンタクト8で接続された第1層
アルミ配線4eへと伝わる。
In such a configuration, a signal input from the first layer aluminum wiring 4a passes through the polysilicon connected by the gate contact 7, and is transmitted to the first layer aluminum wiring 4e connected to the gate contact 8.

このような本実施例では、従来と異なり、第2層アルミ
配線を使用せずに構成するため、FORBIDDEN領
域はできない。
Unlike the conventional example, this embodiment is configured without using the second layer aluminum wiring, so a FORBIDDEN region cannot be formed.

これを第2図に詳細に示す。第2図中、第1図と同一符
号は同一のものを示し、9a〜9Cは縦方向の第2層ア
ルミ配線である。この第2図と第4図とを比較すれば明
らかなように、第4図の例では第1層アルミ配線4aと
46との接続に第2層アルミ配線6を使用したので、そ
の部分に他の縦方向配線ができなかった訳であるが、本
実施例では配線にゲート電極部を使用するので、縦方向
の第2層アルミ配線9bを使用することができ、配線効
率は向上する。
This is shown in detail in FIG. In FIG. 2, the same reference numerals as in FIG. 1 indicate the same parts, and 9a to 9C are vertical second layer aluminum wirings. As is clear from a comparison between FIG. 2 and FIG. 4, in the example of FIG. 4, the second layer aluminum wiring 6 is used to connect the first layer aluminum wiring 4a and 46, so Although other vertical wiring could not be done, in this embodiment, since the gate electrode portion is used for the wiring, the vertical second layer aluminum wiring 9b can be used, and the wiring efficiency is improved.

〔発明の効果〕〔Effect of the invention〕

以上のように、この発明によれば、CMOSゲートアレ
イのPチャネルMO5)ランジスタ又はNチャネルMO
S)ランジスタのゲート電極を信号配線として用いるよ
うにしたので、FORBIDDEN領域が小なくなり5
、配線効率を向上できる効果がある。
As described above, according to the present invention, P channel MO5) transistor or N channel MO of CMOS gate array
S) Since the gate electrode of the transistor is used as a signal wiring, the FORBIDDEN area becomes smaller.
, which has the effect of improving wiring efficiency.

【図面の簡単な説明】[Brief explanation of drawings]

第1図はこの発明の一実施例による半導体集積回路装置
を示す平面図、第2図は該装置に第2層アルミ配線を形
成した場合の平面図、第3図は従来の半導体集積回路装
置の平面図、第4図は該従来の回路装置に第2層アルミ
配線を形成した場合の平面図、第5図はそのV−V線断
面図である。 1・・・ポリシリコンゲート、2・・・n十解散層、4
a〜4e・・・第2層アルミ配線、5・・・スルーホー
ル、7.8・・・ゲートコンタクト。 なお図中、同一符号は同−又は相当部分を示す。
FIG. 1 is a plan view showing a semiconductor integrated circuit device according to an embodiment of the present invention, FIG. 2 is a plan view when a second layer of aluminum wiring is formed in the device, and FIG. 3 is a plan view of a conventional semiconductor integrated circuit device. FIG. 4 is a plan view of the conventional circuit device in which a second layer of aluminum wiring is formed, and FIG. 5 is a cross-sectional view taken along the line V--V. 1...Polysilicon gate, 2...n-dissolution layer, 4
a to 4e... Second layer aluminum wiring, 5... Through hole, 7.8... Gate contact. In the drawings, the same reference numerals indicate the same or equivalent parts.

Claims (1)

【特許請求の範囲】[Claims] (1)相補形MOSトランジスタがアレイ状に配列され
たゲートアレイを有する半導体集積回路装置において PチャネルMOS、あるいはNチャネルMOSのトラン
ジスタゲート電極の両端に信号線引き出し部を有し、 論理セルを構成していないMOSトランジスタのゲート
電極を各論理セル間を接続する信号配線として使用した
ことを特徴とする半導体集積回路装置。
(1) In a semiconductor integrated circuit device having a gate array in which complementary MOS transistors are arranged in an array, signal line lead-out portions are provided at both ends of the transistor gate electrode of a P-channel MOS or an N-channel MOS, and a logic cell is configured. 1. A semiconductor integrated circuit device characterized in that a gate electrode of a MOS transistor that is not connected to a gate electrode is used as a signal wiring for connecting logic cells.
JP60138610A 1985-06-24 1985-06-24 Semiconductor integrated circuit device Pending JPS61295642A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60138610A JPS61295642A (en) 1985-06-24 1985-06-24 Semiconductor integrated circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60138610A JPS61295642A (en) 1985-06-24 1985-06-24 Semiconductor integrated circuit device

Publications (1)

Publication Number Publication Date
JPS61295642A true JPS61295642A (en) 1986-12-26

Family

ID=15226103

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60138610A Pending JPS61295642A (en) 1985-06-24 1985-06-24 Semiconductor integrated circuit device

Country Status (1)

Country Link
JP (1) JPS61295642A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007173474A (en) * 2005-12-21 2007-07-05 Oki Electric Ind Co Ltd Gate array

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5553440A (en) * 1978-10-16 1980-04-18 Mitsubishi Electric Corp Large-scale integrated circuit

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5553440A (en) * 1978-10-16 1980-04-18 Mitsubishi Electric Corp Large-scale integrated circuit

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007173474A (en) * 2005-12-21 2007-07-05 Oki Electric Ind Co Ltd Gate array
KR101318220B1 (en) * 2005-12-21 2013-10-15 오끼 덴끼 고오교 가부시끼가이샤 Gate array

Similar Documents

Publication Publication Date Title
US5444275A (en) Radial gate array cell
US7257779B2 (en) Sea-of-cells array of transistors
JP2000021987A (en) Semiconductor device
US4771327A (en) Master-slice integrated circuit having an improved arrangement of transistor elements for simplified wirings
JPH04102370A (en) Semiconductor integrated circuit device
JPH0558582B2 (en)
JPH0243349B2 (en)
JPS61295642A (en) Semiconductor integrated circuit device
JPH0252428B2 (en)
JPS62150740A (en) Semiconductor integrated circuit device
JPS58107648A (en) Integrated circuit device
JPS5844592Y2 (en) Semiconductor integrated circuit device
JPH0410468A (en) Semiconductor integrated circuit
JPH0362551A (en) Standard cell and standard cell row
JP2614844B2 (en) Semiconductor integrated circuit
JPH03270268A (en) Semiconductor integrated circuit device
KR100548593B1 (en) SRAM cell structure
JPH0312963A (en) Gate array
JPS63311740A (en) Semiconductor integrated circuit device
JP3236745B2 (en) LSI chip layout method
JPH0154861B2 (en)
JPH10223898A (en) Semiconductor device
JPH03145762A (en) Master slice integrated circuit
JP2679034B2 (en) Semiconductor integrated device
JPH01175241A (en) Master slice of semiconductor device