JPS61288133A - Measuring instrument for radiation heating value - Google Patents

Abstract

PURPOSE:To measure radiation heating value without being affected by outside temperature condition by providing a heating and cooling element on one surface of a heat resistor and also providing a temperature measuring element on the surface or in a nearby heat resistor. CONSTITUTION:A measuring instrument 9 mounted on a surface 1 to be measured is provided with a heat flowmeter 2 in or almost at the center part of the surface of the heat resistor 5 which has specific thickness and specific heat conductivity and, therefore, has a specific resistance value. Further, the temperature measuring element 6 and heating and cooling element 7 are arranged on the surface of the heat resistor 5 on an external air side. The temperature measuring element 6 may be installed in the heat resistor 5 nearby the surface. The heating and cooling element 7 uses a thermoelectric element which performs heating and cooling by, for example, Peltier effect and the temperature measuring element 6 uses a thermocouple, etc. Then, the measuring instrument 9 is stuck on the surface 1 to be measured and the temperature of the surface of the heat resistor 5 that the heating and cooling element 7 contacts is held uniform. Consequently, the indicated value of the heat flowmeter 2 is outputted to an indicator 10 by a specific expression and the density of a heat flow based upon thermal variation in the surface to be measured is measured.

Description

Detailed Description of the Invention (Field of Industrial Application) The present invention relates to a device for measuring the amount of heat radiated or absorbed from an object to be measured. The present invention relates to a dissipated heat amount measuring device suitable for measuring changes in the amount of heat generated inside the human body due to changes.

(Prior art) The density of the heat flow transmitted from the inside of the object to be measured to the outside, or the density of the heat flow absorbed from the outside to the inside, depends on the outside air conditions, that is, the temperature of the outside air, the total thermal conductivity, and the heat radiation source such as the sun or heater. Needless to say, it differs depending on the situation.

Conventionally, as a means of measuring the amount of heat dissipated in such an environment where temperature conditions fluctuate, a heat flow meter was simply attached to the surface to be measured, or the heat flow meter was embedded inside the object to be measured, and the density of the heat flow transferred was measured. It was common to measure

For example, by detecting the temperature difference between the front and back sides of a thin thermal resistance plate using a thermometer, active wiring type resistance thermometer, or thermistor, etc., we can calculate the heat flow density dissipated from the surface to be measured or the heat flow density flowing inside the object to be measured. Conventional calorimeters are conventional ones, and the former is attached to the surface of the object to be measured, while the latter is used by being embedded within the object. These devices are described in, for example, Yoshiaki Arayo et al., Neo-Automation, Special Issue, Volume 24, No. 7 (published in 1979), page 27.

As is clear from the above, in conventional devices, when the thermal conditions on the outside air side are different, the density of the heat flow that is radiated or absorbed at the surface to be measured also differs, which causes thermal fluctuations inside the object to be measured. It has been difficult to know the corresponding true heat dissipation or heat absorption variation.

In order to improve the above-mentioned drawbacks, if measures are taken to prevent thermal fluctuations on the outside air side, for example, as shown in FIG. A method was used to adjust the air flow inside the cover 3 by installing a cover 3 made of metal or the like to isolate it from the outside air, but in this method, the total heat transfer coefficient of the atmosphere inside the cover 3 depends on the direction of the surface to be measured. convective heat transfer because the airflow inside the cover 3 changes significantly depending on the upward, downward, vertical, etc. orientation, and the situation in which the airflow inside the cover 3 is exchanged through the gap differs depending on the degree of the gap created when the cover 3 is attached to the surface to be measured 1. The rate is large and therefore measuring the dissipated heat flow density at a desired residual heat transfer rate is extremely difficult. Moreover, in order to adjust the convection situation inside the cover 3, a considerably large air volume inside the cover (
For example, at least 30 cm') is required, which means that the surface to be measured becomes quite large.Also, if the cover is made of metal to increase its mechanical strength, the temperature of the entire cover will rise significantly. However, there were unavoidable inconveniences such as the need for powerful cooling.

(Problems to be Solved by the Invention) The object of the present invention is to provide a dissipated heat amount measuring device that can improve the drawbacks of the conventional devices as described in 2. be.

(Means for Solving the Problems) As a means for solving the above-mentioned problems, the device of the present invention is composed of a heat flow meter and a flat thermal resistor having a predetermined thermal resistance value. This is a dissipated heat amount measuring device characterized by comprising a temperature measuring element inside the element and a thermal resistor on or near the surface, and by providing a temperature controller in the pixel element, The amount of heat dissipated can be measured accurately and efficiently. The heating/cooling element means a device having a heating and/or cooling function, and can be appropriately selected from, for example, a thermoelectric element, a heater, hot/cold water, hot/cold air, etc. Furthermore, by configuring the heat flow meter to be surrounded by a covering material that causes capillary action, and by configuring a part of the covering material to be in contact with the outside air, if moisture or the like is generated from the object to be measured, it is removed from the system. This allows for more accurate measurements.

The thermal resistor needs to have a predetermined thermal resistance value, and a foamed material such as foamed polyurethane can be used.

It is also characterized by comprising a flat heat flow meter having a predetermined thermal resistance value, a heating and cooling element on one side of the heat flow meter, and a temperature measuring element inside the thermal resistor on or near the surface. A dissipated heat measurement device or a flat thermal resistor having a predetermined thermal resistance value, which has a temperature measuring element and a heating/cooling element on one side, and a different temperature measuring element inside the thermal resistor on the other side or in the vicinity thereof. The desired objective can also be achieved by a dissipated heat quantity measuring device characterized by having the following.

The basic heat flow theory that led to the invention of the device of the present invention as described above will now be explained.

Figures 1a and 1b show schematic diagrams illustrating the thermal theory. In Fig. 1a, the heat flow density q (W
/ryf), then q=α. (Tw-TA) +
6w(r (Tw4-TR4) (D here α
: Convective heat transfer coefficient of gas (W/m”・K) Tw: Temperature of the surface to be measured (K) TA: Temperature of the gas (K) εW = Emissivity of the surface to be measured σ : Stefan-Polzmann constant TR: Surroundings Temperature of an object (K) Usually, TA is TR, and Tw is TA.

When it is higher than TR, it can be treated as TA=TR, so equation (1) can be written as the following equation: q=(αc+εWσ(TW+TA) (TW2+TA)
) ) x (Tw-TA)
(2) α, = εWσ(Tw+TA)(7w2+T
A2) If (3) is set, then q=(α.+αρCTW+TA) (4) When the temperature of the surface to be measured is approximately equal to the gas temperature, the following equation is given.

q=(α.+αρ(Tw=TA)(5)TA=(αcT
A+αrTR)/(α.+αr) (6) Formula (
From 4) and (5), the radiation heat flow density q is the convective heat transfer coefficient α,
Radiation heat transfer coefficient α, that is, residual heat transfer rate α (=α + α) and gas temperature TA or C
It is known that r changes if TA& changes.

On the other hand, as shown in Fig. 1b, a constant thermal resistance value R (
A flat thermal resistor (its thickness d (m), no heat transfer (W / m・K)) having a diameter of When the temperature of the gas side surface of the thermal resistor is maintained at a constant temperature Ta (K), the heat flow density q'(W/m') flowing through the thermal resistor is given by the following formula: q'=in (T '' -Ta)/d= (T'-Ta
)/R(7)W That is, in equation (7), since R and Ta values are constant, changes in heat flow density q' indicate only thermal fluctuations inside the surface to be measured. This means that when inspecting the insulation performance of a heat-retaining and cold-retaining wall on-site, the emissivity on the outside air side of the wall under specified outside air conditions, such as natural convection (no wind), is 0.9.
This method can be applied to measuring the heat flow density flowing through a wall under the conditions of an outside temperature of 20° C. and zero radiation sources from other sources.

Under the above conditions, ct = 4.5 CW/m'eK), a = 4.5
Since it is estimated that (W/r?K)Cr, a closed measuring device is prepared and attached to the surface to be measured, and a heat flow meter is attached to the measuring device. This means that the through-flow heat flow density q' under these conditions can be measured.

The device of the present invention is a dissipated heat quantity measuring device invented based on the above-mentioned theory.

FIG. 2 shows the main parts constituting the apparatus of the present invention.

This measuring device placed on the surface to be measured 1 has a predetermined thickness d, a predetermined heat transfer resistance, and therefore a predetermined thermal resistance value R (rrr'
The heat flow meter 2 is disposed approximately in the center of the thermal resistor 5 inside or on the surface (whichever surface may be used) of the thermal resistor 5 having a temperature of -K/W). A temperature measuring element 6 and a heating/cooling element 7 are provided. The temperature measuring element can also be installed inside the thermal resistor near the part.

As the heating/cooling element 7, for example, a thermoelectric element, a heater, etc., which performs heating or cooling by the Peltier effect, is used. Further, as the temperature measuring element 6, a thermocouple, a thermistor, a temperature measuring resistor, or the like may be used, and it is used by being connected to the temperature regulator 8 in order to operate the device.

However, if the temperature is known from the indicated value of the temperature measuring element 6 and the current and voltage to the heating/cooling element 7 are adjusted manually, a current and voltage regulator may be used instead of the temperature regulator 8.

The material 51 present on the side surface of the heat flow meter 2 is a dummy material,
The same material as the heat flow meter 2 may be used, and the same material as the thermal resistor 5 may be used.

Materials for the thermal resistor include silicone rubber, cloth, etc., and are selected in consideration of heat resistance and safety in the measurement range temperature, but foam materials with small heat capacity and low thermal conductivity, such as foamed polyurethane, Foamed polystyrene, foamed polyethylene, foamed silicone rubber, etc. are preferred.

If the device 9 of the present invention is attached to the surface to be measured 1 and the temperature of the surface of the resistor 5 in contact with the heating/cooling element 7 is maintained at a uniform and constant temperature, the indicated value q of the heat flow meter 2 present in the device 9 is According to the equation (7), the heat flow density can be outputted to the indicator 10 and measured based on the thermal change inside the surface to be measured.

(Embodiment 1) FIG. 3 shows one aspect of the basic configuration of the apparatus of the present invention explained using FIG. 2. This measuring device is used when the outside air temperature is low and it is necessary to maintain the temperature of the heating/cooling element side of the thermal resistor 5 at a value higher than the outside air temperature. is used.

A neoprene e sponge with dimensions 10100 x 100 x 6 was prepared as the thermal resistor 5, and the heat flow meter 2 was made by Showa Denko
An S sensor was used. A commercially available film heater was used as the heater, and was attached to the neorene sponge using double-sided adhesive tape. A strip-shaped thermocouple was used as the measuring element 6.

A test was carried out by attaching the above device to a black uniform heat radiation surface having a diameter of 500 ma+φ and an emissivity of 0.9. The atmosphere of this device was indoors and approximated the situation of natural convection. Under the condition that the room temperature fluctuated in the range of 15 to 23°C, the temperature of the temperature measuring element 6 was automatically controlled to a constant 40°C using a PID temperature controller. On the other hand, the temperature of the surface to be measured was controlled using another PID temperature controller so as to maintain a constant value of 46°C. Figure 4 shows the change in room temperature in this case (Figure 4A), and the amount of heat dissipated from the output of the heat flow meter (Figure 4A).
Fig. 4 B) and the density of heat flow radiated from the black uniform heat dissipation surface (
Figure 4C) is shown.

The temperature difference in the thermal resistor in this device is 6°C, and when examining the thermal resistance value of the thermal resistor, the thermal conductivity of neoprene sponge at 30°C is approximately 0.06 (W
/m-K), so the thermal resistance value is approximately 0,1 (m
'·K /W) Therefore, the heat flow density flowing directly through the device is approximately 6o (w/m'), which agrees well with the calculated value. In other words, it was demonstrated that the amount of dissipated heat can be evaluated as a constant amount even if the room temperature fluctuates, and that the dissipated heat flow density can be measured without being affected by outside air conditions.

[Example 2] FIG. 5 shows an embodiment of the apparatus of the present invention using a thermoelectric element as the heating/cooling element. In this device, heat radiation fins 11 are provided considering that heat radiation is necessary during cooling. Note that it is also possible to use a blower instead of the radiation fins. As the thermoelectric element 72, a commercially available product such as a Komatsu Electronismo thermoelectric element was used. By using a thermoelectric element, the surface on which the temperature measuring element 6 is present can be heated or cooled by changing the direction of the direct current applied to the element, so for example, the temperature of the temperature measuring element 6 can be maintained at a constant 20'O. This is convenient in an atmosphere where the outside temperature fluctuates, for example, from 15 to 25°C.

(Embodiment 3) Figure 6 shows this device which maintains the temperature of the surface of the thermal resistor 5 where the temperature measuring element 6 is present by flowing a fluid having a predetermined temperature such as hot or cold water or hot or cold air in the direction of the arrow. As with the thermoelectric element, which is one aspect of the above, it is extremely convenient because it can perform either heating or cooling in response to fluctuations in outside temperature. Note that in this example, the temperature measuring element 6 is not necessarily required as long as the temperature of the fluid is separately known, and such an embodiment is also possible.

(Example 4) FIG. 7 shows an embodiment of the second invention of the present application using a heat flow meter having a desired thermal resistance value by integrating a thermal resistor and a heat flow meter. In this example, the thermopile 12 is used as the detection element of the heat flow meter, but since this increases the thermal resistance value of the heat resistance plate of the heat flow meter, the temperature drop in the heat flow meter also increases, and therefore the output of the thermopile 12 also increases. This has the advantage of increasing detection capability.

(Example 5) According to the third invention of the present application, a temperature measuring element 6 and a different temperature measuring element 61 are arranged on the surface of the thermal resistor 5 on the surface to be measured or near the surface in place of the heat flow meter to obtain a detection output. One embodiment is shown in FIG.
The temperatures of temperature measuring elements 61i and 6 are T' and T('
If the W a thermal resistance value of the thermal resistor 5 is R (m'・K /W), the above formula (7) is obtained.
Therefore, the following equation holds true: Tw';R11q'+Ta However, since R and T are constant values, the heat flow density q' flowing through the thermal resistor 5 and Tw' are in a proportional relationship. That is, if Tw' can be measured, q' can be known.

(Example 6) An embodiment of the third invention device of the present application in which the two temperature measuring elements 6 and 61 in Example 5 are replaced with differential connection elements 6' and 61' is shown in FIG. 9. If a differentially connected element is used as an element for obtaining a detection signal, it corresponds to the case where there is one pair of thermopiles in Example 4, and the circuit of FIG. 9 showing this example is shown in FIG. It is equivalent to the circuit shown.

(Example 7) A device shown in FIG. 10 was prototyped as an embodiment of the device of the third invention of the present application using the temperature measuring element 61 as the sensing element. In this figure, the temperature value set in temperature yJ muscle device 8 is
3 and multiplied by the value (1/R) in the arithmetic circuit 14, the value displayed on the display meter 10 is the heat flow density q
′.

(Example 8) The device shown in FIG. 11 was manufactured as an embodiment of the device of the present invention in which a material that causes capillarity, such as gauze or fiber, was added to the basic configuration of the device of the present invention (FIG. 2). 0 This device is used for heat flow accompanied by water evaporation from the surface 1 to be measured. 0 A heat flow meter using capillary material 15 is described in Japanese Patent Application Laid-Open No. 59-145 by the present inventors.
Although this has already been disclosed in No. 938, this example is developed into a further different aspect.

The total area of the portion of the capillary material 15 extending outside the measuring device 9 is approximately equal to the area of one side of the heat flow meter 2. Also hair mv
The material 15 is transferred from the surface to be measured of the heat flow meter 2 to the opposite side.
The apparatus configuration shown in the figure, which requires the device to be taken out and then drawn out through the boundary between the dummy material 51 and the thermal resistor, allows the density of heat flow dissipated from a sweating object such as a human body to be set under predetermined conditions. It is possible to measure under

(Effects of the Invention) As detailed above, the device of the present invention can measure the amount of heat radiated from the surface to be measured or the amount of heat absorbed by the surface to be measured when the outside air temperature condition and the total heat transfer coefficient have predetermined values. This makes it possible to directly evaluate the insulation performance of an insulated wall without being affected by changes in the outside air.

In addition, the practical effects on the human body are extremely significant, such as the amount of heat dissipated due to changes in blood flow conditions can be measured without being affected by changes in the outside air, and abnormalities affecting life can be easily determined.

[Brief explanation of the drawing]

Figures 1a and 1b are schematic diagrams explaining the heat flow theory of the device of the present invention, Figure 2 is a diagram of the main parts of the device of the present invention, Figure 3 is an embodiment of the device of the present invention, and Figure 4 is the amount of heat dissipated and room temperature over time. Figures 5 to 11 show the first embodiment of the device of the present invention.
FIG. 2 is an explanatory diagram of the prior art. 1-surface to be measured, 2-heat flow meter, 3-cover, 4-surrounding object, 5-thermal resistor, 6-temperature element, 7-heating/cooling element, 8
- temperature yJWI device, 9 - device of the present invention, 10 - display meter, 1
1-Radiation fin, 12-Thermomobile, 13-7" recut circuit, 14-Arithmetic circuit, 15-Capillary material. 6', 61'-Differential connection element, 51-Dummy material 61-Temperature measuring element, 71- heater

Claims (7)

[Claims] (1) Consists of a heat flow meter and a flat thermal resistor having a predetermined thermal resistance value, with a heating and cooling element on one surface of the thermal resistor and a temperature measuring element inside the thermal resistor on or near the surface. A dissipated heat amount measuring device characterized by the following. (2) The dissipated heat amount measuring device according to claim 1, further comprising a temperature controller connected to the temperature measuring element and the heating/cooling element. (3) The dissipated heat amount measuring device according to claim 1, wherein the thermal resistor is made of a foamed material. (4) Thermoelectric elements, heaters, hot and cold water as heating and cooling elements,
The dissipated heat quantity measuring device according to claim 1, characterized in that hot and cold air is used. (5) The heat flow meter uses a covering material that causes capillary action,
2. The dissipated heat quantity measuring device according to claim 1, wherein the dissipated heat quantity measuring device is surrounded by a surrounding area, and a part of the covering material is arranged so as to be in contact with the outside air. (6) A flat heat flow meter having a predetermined thermal resistance value, a heating and cooling element on one side of the heat flow meter, and a temperature measuring element inside the thermal resistor on or near the surface. Dissipated heat measurement device. (7) A flat thermal resistor having a predetermined thermal resistance value has a temperature measuring element and a heating/cooling element on one side, and a different temperature measuring element inside the thermal resistor on or near the other side. A dissipated heat amount measuring device characterized by the following.