JPS61288093A - Anode structure of plating apparatus - Google Patents

Anode structure of plating apparatus

Info

Publication number
JPS61288093A
JPS61288093A JP13061685A JP13061685A JPS61288093A JP S61288093 A JPS61288093 A JP S61288093A JP 13061685 A JP13061685 A JP 13061685A JP 13061685 A JP13061685 A JP 13061685A JP S61288093 A JPS61288093 A JP S61288093A
Authority
JP
Japan
Prior art keywords
plating
anode
lead frame
spot
platinum wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13061685A
Other languages
Japanese (ja)
Inventor
Katsuto Tani
谷　克人
Akira Okamoto
岡本　曉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to JP13061685A priority Critical patent/JPS61288093A/en
Publication of JPS61288093A publication Critical patent/JPS61288093A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To enable uniform plating in a stage for spot-plating a lead frame by placing a platinum wire anode having a spiral structure at a position at which the anode does not hinder the flow of a plating soln. CONSTITUTION:The anode of this plating apparatus is made of a platinum wire 2 having a spiral structure and placed at a position at which the anode does not hinder the flow of a soln. in a plating bath. In a stage for spot-plating a lead frame 1, the anode is used as the anode opposite to the lead frame 1 traveling in the plating bath. Uniform plating is carried out, so a thick central part and thin edge parts are not formed.

Description

【発明の詳細な説明】 〈産業上の利用分野〉 この発明はリードフレームのスポットメッキにおいて用
いるメッキ装置の陽極構造に関するものである。DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to an anode structure of a plating apparatus used in spot plating of lead frames.

〈従来の技術とその問題点〉 リードフレームのスポットメッキ方法において使用する
メッキ装置のスポットメッキ部は、液を噴射させるノズ
ル、陽極、マスクゴムなどから構成されている。<Prior art and its problems> A spot plating section of a plating device used in a lead frame spot plating method is composed of a nozzle for spraying a liquid, an anode, a mask rubber, and the like.

このうち、特に陽極構造はメッキの均一性に関与するも
のであり、重要である。Among these, the anode structure is particularly important as it is involved in the uniformity of plating.

この陽極構造としては、これまで、（１）ノズル材質を
ＳＵＳステンレスまたはチタンで作り、それに白金メッ
キを施こしたものをノズル即陽極としたもの。（２）メ
ッキ浴中でリードフレームに平行に１本または数本の白
金線を配設したもの。Up until now, the anode structure has been as follows: (1) The nozzle material is made of SUS stainless steel or titanium, and the nozzle is plated with platinum and used as an anode immediately at the nozzle. (2) One or more platinum wires are placed parallel to the lead frame in a plating bath.

などが行なわれているが、（１）の方法では白金メッキ
がある期間で剥れてくること、また（２）の方法は配設
した１本または数本の白金線に噴射流が当って噴射流を
阻害すること、従ってメッキの均一性が悪いなどの欠点
があった。However, in method (1), the platinum plating will peel off after a certain period of time, and in method (2), the platinum plating will peel off after a certain period of time, and in method (2), the jet stream will hit one or several platinum wires. This method has drawbacks such as blocking the jet flow and resulting in poor plating uniformity.

く問題点を解決するための手段〉 この発明は上記に鑑みて、リードフレームのスポットメ
ッキ工程において、寿命が永久的でしかもメッキ液の噴
射流を阻害せず、均一なメッキが得られる陽極構造を見
出したものである。Means for Solving the Problems> In view of the above, the present invention provides an anode structure that has a permanent life, does not impede the jet flow of the plating solution, and can provide uniform plating in the spot plating process of lead frames. This is what we discovered.

即ち、この発明はリードフレームのスポットメッキ工程
において、メッキ浴中を走行するリードフレームに対す
る陽極としてラセン構造の白金線をメッキ浴中の液流を
阻害しない位置に設けたことを特徴とするメッキ装置の
陽極構造を提供するものである。That is, the present invention provides a plating apparatus in which a platinum wire with a helical structure is provided as an anode for a lead frame running in a plating bath at a position that does not obstruct the liquid flow in the plating bath in a lead frame spot plating process. This provides an anode structure.

〈実施例〉 以下、図面によりこの発明を説明する。<Example> The present invention will be explained below with reference to the drawings.

第１図において、１はその表面にメッキを施こすリード
フレームである。In FIG. 1, 1 is a lead frame whose surface is plated.

そして２がマスクゴム３を介してエツジ部に装着した白
金線陽極である。2 is a platinum wire anode attached to the edge portion through a mask rubber 3.

この白金線陽極は第２図に示すように白金線をラセン状
に巻回した構造としたものでおる。This platinum wire anode has a structure in which a platinum wire is wound in a helical shape as shown in FIG.

従来の前述したような白金陽極でメッキ液を噴射流とし
て噴射させてメッキする場合は、メッキ液の当りのよい
中央部のメッキがイオンの拡散がよいため厚くなる傾向
におり、反面液の滞留しやすいエツジ部は薄くなる傾向
にあるが、この発明では陽極を上記のようなラセン構造
の白金線陽極としてエツジ部に装着することによって、
メッキすべきリードフレームに向ってノズル４からメッ
キ液を噴射流として噴射させた場合、エツジ部に陽極が
相対して設置されているため、中央部が厚くなったり、
エツジ部が薄くなったりするおそれがなく、均一なメッ
キを施こすことができるのである。When plating is performed by spraying a plating solution as a jet stream using a conventional platinum anode as described above, the plating tends to be thicker in the central part where the plating solution hits well due to good ion diffusion. Edges that are easy to bend tend to become thinner, but in this invention, by attaching the anode as a platinum wire anode with a helical structure as described above to the edges,
When the plating solution is sprayed from the nozzle 4 toward the lead frame to be plated, the center part becomes thicker because the anodes are placed opposite to each other at the edges.
There is no risk of the edges becoming thinner, and uniform plating can be applied.

そしてこのような陽極構造のメッキ装置はリードフレー
ムのスポットメッキにおいては特に有用である。A plating apparatus having such an anode structure is particularly useful in spot plating of lead frames.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図はこの発明の陽極構造を示すメッキ装置の説明図
、第２図は陽極としての白金線のラセン構造を示す説明
図である。FIG. 1 is an explanatory diagram of a plating apparatus showing an anode structure of the present invention, and FIG. 2 is an explanatory diagram showing a helical structure of a platinum wire as an anode.

Claims (1)

【特許請求の範囲】[Claims] リードフレームのスポットメッキ工程において、メッキ
浴中を走行するリードフレームに対する陽極としてラセ
ン構造の白金線をメッキ浴中の液流を阻害しない位置に
設けたことを特徴とするメッキ装置の陽極構造。An anode structure for a plating apparatus, characterized in that, in a lead frame spot plating process, a helical platinum wire is provided as an anode for a lead frame running in a plating bath at a position that does not obstruct liquid flow in a plating bath.
JP13061685A 1985-06-14 1985-06-14 Anode structure of plating apparatus Pending JPS61288093A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13061685A JPS61288093A (en) 1985-06-14 1985-06-14 Anode structure of plating apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13061685A JPS61288093A (en) 1985-06-14 1985-06-14 Anode structure of plating apparatus

Publications (1)

Publication Number Publication Date
JPS61288093A true JPS61288093A (en) 1986-12-18

Family

ID=15038479

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13061685A Pending JPS61288093A (en) 1985-06-14 1985-06-14 Anode structure of plating apparatus

Country Status (1)

Country Link
JP (1) JPS61288093A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112531182A (en) * 2020-12-05 2021-03-19 重庆大学 Portable cylindrical membraneless fuel cell with large reaction volume ratio

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112531182A (en) * 2020-12-05 2021-03-19 重庆大学 Portable cylindrical membraneless fuel cell with large reaction volume ratio

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