JPS6128807Y2 - - Google Patents

Info

Publication number
JPS6128807Y2
JPS6128807Y2 JP8960580U JP8960580U JPS6128807Y2 JP S6128807 Y2 JPS6128807 Y2 JP S6128807Y2 JP 8960580 U JP8960580 U JP 8960580U JP 8960580 U JP8960580 U JP 8960580U JP S6128807 Y2 JPS6128807 Y2 JP S6128807Y2
Authority
JP
Japan
Prior art keywords
heat insulating
adhesive
hole
insulating material
backing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP8960580U
Other languages
Japanese (ja)
Other versions
JPS5716516U (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8960580U priority Critical patent/JPS6128807Y2/ja
Publication of JPS5716516U publication Critical patent/JPS5716516U/ja
Application granted granted Critical
Publication of JPS6128807Y2 publication Critical patent/JPS6128807Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Building Environments (AREA)
  • Load-Bearing And Curtain Walls (AREA)

Description

【考案の詳細な説明】 こ考案は断熱壁構造に関し、結露発生のない良
好な断熱壁構造を得ようとしている。
[Detailed description of the invention] This invention relates to a heat insulating wall structure, and attempts to obtain a good heat insulating wall structure without condensation.

従来における断熱壁構造については、躯体とな
る施工下地面に団子状をなすよう接着剤を盛り付
け、これに合板、無機質板、その他内壁板となり
得る表面材を押し付けて接合した構造または表面
材に発泡ポリスチレンボード等の裏当断熱材を付
けたものを裏当断熱材側を団子状の接着剤に押し
付けて接合した構造のものであり、 何れの場合も団子状の接着剤のない隙間部分に内
外温度差により結露が発生し易いためその改良が
要望されていた。
Conventional insulating wall structures have a structure in which adhesive is applied in a dumpling shape to the construction base that forms the framework, and plywood, inorganic boards, or other surface materials that can be used as interior wall panels are pressed and bonded to this, or foam is added to the surface material. It has a structure in which a backing insulation material such as a polystyrene board is attached, and the backing insulation material side is pressed against a dumpling-shaped adhesive. Since dew condensation tends to occur due to temperature differences, improvements have been desired.

そこで、この考案においては上記従来の結露発
生を解消できるようにした断熱壁構造を提供しよ
うとしており、その構造としては、コンクリート
或はその他の躯体に対し隣接させた合成樹脂発泡
体からなる断熱材には接着剤用の貫通孔が形成さ
れてあり、該貫通孔に団子状にした接着剤が挿入
されていて、貫通孔の一方側に露出した接着剤部
分を躯体と接合することにより躯体と断熱材とを
接合し、さらに貫通孔の他方側に露出した接着剤
部分を表面材と直接或は表面材の裏当断熱材を接
合することによりこれらが躯体と接合されてなる
ことを特徴としている。
Therefore, in this invention, we are trying to provide a heat insulating wall structure that can eliminate the conventional dew condensation, and the structure consists of a heat insulating material made of synthetic resin foam adjacent to concrete or other building blocks. A through-hole for adhesive is formed in the through-hole, and a ball-shaped adhesive is inserted into the through-hole, and the adhesive portion exposed on one side of the through-hole is joined to the building frame, thereby attaching it to the building frame. The adhesive part exposed on the other side of the through hole is bonded to the building frame either directly with the surface material or by bonding the backing insulation material of the surface material. There is.

次いで、この考案の実施態様について図を参照
しながら以下に例示する。
Next, embodiments of this invention will be illustrated below with reference to the drawings.

10はコンクリート等の躯体、20は躯体10
に隣接させた発泡ポリスチレンボード等の合成樹
脂発泡体による断熱材であり、この断熱材20に
は接着剤用の貫通孔21が適数形成されている。
30は上記貫通孔20に挿入されている団子状に
した接着剤(例えばGLボンド)であり、貫通孔
20の一方側に露出した接着剤部分を躯体10と
接合しており、この接合にて断熱材20を躯体1
0と接合していることになる。さらに第1図の4
0は内壁板となる表面材、第2図の40′は発泡
ポリスチレンボード等の合成樹脂発泡体による裏
当断熱材50を事前或は事後的に接着した表面材
である。そして上記断熱材20における貫通孔2
1の他方側に露出した接着剤部分を表面材40と
直接(第1図参照)か、表面材40′の裏当断熱
材50と接合することにより、これらが躯体10
と接合されていることになる。また団子状の接着
剤30が上記のように貫通孔21に挿入されて露
出両面から接合作用させることにより断熱材20
が躯体10と表面材40の間または躯体10と裏
当断熱材50の間に挾持された状態の一体化され
た断熱壁となる。
10 is a frame made of concrete, etc., 20 is the frame 10
This is a heat insulating material made of a synthetic resin foam such as a foamed polystyrene board adjacent to the heat insulating material 20, and an appropriate number of through holes 21 for adhesive are formed in this heat insulating material 20.
Reference numeral 30 denotes a lump-shaped adhesive (for example, GL bond) inserted into the through hole 20, and the adhesive portion exposed on one side of the through hole 20 is joined to the frame 10, and this joining The insulation material 20 is attached to the frame 1
This means that it is connected to 0. Furthermore, 4 in Figure 1
0 is a surface material that will become an inner wall board, and 40' in FIG. 2 is a surface material to which a backing heat insulating material 50 made of a synthetic resin foam such as expanded polystyrene board is adhered before or afterward. And the through hole 2 in the heat insulating material 20
By joining the adhesive portion exposed on the other side of the surface material 10 directly to the surface material 40 (see FIG. 1) or to the backing insulation material 50 of the surface material 40', these are bonded to the frame 10.
This means that it is connected to In addition, the ball-shaped adhesive 30 is inserted into the through hole 21 as described above and bonded from both exposed surfaces, so that the heat insulating material 20
becomes an integrated heat insulating wall sandwiched between the frame 10 and the surface material 40 or between the frame 10 and the backing insulation material 50.

実施上、躯体10と断熱材20、断熱材20と
表面材40さらには断熱材20と裏当断熱材50
とは互の隣接面についての接着を併用してもよ
い。
In practice, the frame 10 and the heat insulating material 20, the heat insulating material 20 and the surface material 40, and the heat insulating material 20 and the backing heat insulating material 50
Adhesion of adjacent surfaces to each other may also be used.

なお、躯体10としてはコンクリート地のほ
か、PC板その他の躯体についても実施可能であ
り、断熱材20および裏当断熱材50としては上
記した発泡ポリスチレンボード以外の合成樹脂発
泡体を用いることもでき、さらに内壁板となる表
面材40,40′としては、合板等木質材のほ
か、各種石膏系のプラスターボード、石綿、珪酸
カルシウムボード等を例示できる。
In addition, as the frame 10, it is possible to use a PC board or other frame in addition to concrete, and as the heat insulating material 20 and backing heat insulating material 50, a synthetic resin foam other than the above-mentioned expanded polystyrene board can also be used. Furthermore, as the surface material 40, 40' which becomes the inner wall board, in addition to wood materials such as plywood, various types of gypsum plasterboard, asbestos, calcium silicate board, etc. can be exemplified.

この考案による断熱壁構造は上記のごとく構成
されており、団子状にした接着剤30は合成樹脂
発泡体からなる断熱材20に形成した接着材用の
貫通孔21に挿入されているもので、当該接着剤
30の使用にて従来のように躯体と断熱材間に隙
間を残存させるようなものではなくなり、躯体1
0の内側に結露を生じるおそれは解消されること
になる。しかも貫通孔21内に挿入した団子状の
接着剤30にて躯体10側と表面材40,40′
側とを無理なく接合できることになり、貫通孔2
1部分で接着剤30と接合されている断熱材20
が躯体10側と表面材40,40′側との間に挾
持され、断熱壁全体の一体性強化の点でも優れた
ものとなるほか、団子状の接着剤を有効適切に使
用した施工が実現できる。
The heat insulating wall structure according to this invention is constructed as described above, and the ball-shaped adhesive 30 is inserted into the adhesive through-hole 21 formed in the heat insulating material 20 made of synthetic resin foam. By using the adhesive 30, there is no longer a gap between the building block and the insulation material as in the past, and the building block 1
This eliminates the possibility of condensation forming inside the 0. Moreover, a ball-shaped adhesive 30 inserted into the through hole 21 connects the body 10 side to the surface materials 40, 40'.
This means that the sides can be joined without difficulty, and the through hole 2
Insulating material 20 joined in one section with adhesive 30
is sandwiched between the frame 10 side and the facing material 40, 40' side, which not only enhances the integrity of the entire insulation wall, but also enables construction using adhesive in the form of balls effectively and appropriately. can.

以上のように、この考案による断熱壁構造は内
部結露の発生を防止するのに好適であると共に一
体性の強化された優れた実用的効果を発揮でき
る。
As described above, the heat insulating wall structure according to the present invention is suitable for preventing internal condensation, and can exhibit excellent practical effects with enhanced integrity.

【図面の簡単な説明】[Brief explanation of the drawing]

図はこの考案の実施態様を例示するものであ
り、第1図は一部の断面図、第2図は変更例の断
面図、第3図は構造中の貫通孔付断熱材を例示し
た斜視図である。 10……躯体、20……合成樹脂発泡体からな
る断熱材、21……断熱材の貫通孔、30……団
子状にした接着剤、40,40′……内壁板とな
る表面材、50……裏当断熱材。
The figures illustrate the embodiment of this invention; Fig. 1 is a partial sectional view, Fig. 2 is a sectional view of a modified example, and Fig. 3 is a perspective view illustrating a heat insulating material with through holes in the structure. It is a diagram. DESCRIPTION OF SYMBOLS 10...Structure, 20...Insulating material made of synthetic resin foam, 21...Through hole in heat insulating material, 30...Adhesive ball-shaped, 40, 40'...Surfacing material to become inner wall plate, 50 ...Backing insulation material.

Claims (1)

【実用新案登録請求の範囲】 1 コンクリート或はその他の躯体に対し隣接さ
せた合成樹脂発泡体からなる断熱材には接着剤
用の貫通孔が形成されてあり、該貫通孔に団子
状にした接着剤が挿入されていて、貫通孔の一
方側に露出した接着剤部分を躯体と接合するこ
とにより躯体と断熱材とを接合し、さらに貫通
孔の他方側に露出しした接着剤部分を表面材と
直接或は表面材の裏当断熱材と接合することに
よりこれらが躯体と接合されてなることを特徴
とする断熱壁構造。 2 断熱材がポリスチレン発泡体からなる上記実
用新案登録請求の範囲第1項記載の断熱壁構
造。 3 裏当断熱材がポリスチレン発泡体からなる上
記実用新案登録請求の範囲第1項記載の断熱壁
構造。
[Scope of Claim for Utility Model Registration] 1. A through hole for adhesive is formed in a heat insulating material made of a synthetic resin foam adjacent to a concrete or other building frame, and a ball-shaped adhesive is formed in the through hole. The adhesive is inserted, and the adhesive part exposed on one side of the through hole is bonded to the building frame, thereby joining the building body and the insulation material, and the adhesive part exposed on the other side of the through hole is bonded to the surface. A heat insulating wall structure characterized in that these are joined to a framework either directly or by joining to a backing insulating material of a surface material. 2. The heat insulating wall structure according to claim 1, wherein the heat insulating material is made of polystyrene foam. 3. The heat insulating wall structure according to claim 1, wherein the backing heat insulating material is made of polystyrene foam.
JP8960580U 1980-06-25 1980-06-25 Expired JPS6128807Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8960580U JPS6128807Y2 (en) 1980-06-25 1980-06-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8960580U JPS6128807Y2 (en) 1980-06-25 1980-06-25

Publications (2)

Publication Number Publication Date
JPS5716516U JPS5716516U (en) 1982-01-28
JPS6128807Y2 true JPS6128807Y2 (en) 1986-08-26

Family

ID=29451632

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8960580U Expired JPS6128807Y2 (en) 1980-06-25 1980-06-25

Country Status (1)

Country Link
JP (1) JPS6128807Y2 (en)

Also Published As

Publication number Publication date
JPS5716516U (en) 1982-01-28

Similar Documents

Publication Publication Date Title
JPS6128808Y2 (en)
JPS6128807Y2 (en)
JPS625443Y2 (en)
JPS6350331Y2 (en)
JPS6160935B2 (en)
JP2729399B2 (en) True wall insulation
JPH047948Y2 (en)
KR0134302Y1 (en) Sound absorbing panel
JPS6126041Y2 (en)
JPH10317635A (en) Insulation attaching piece for architectural inferior finish board
JP2555259Y2 (en) Interior wall panels
JPS5916437Y2 (en) architectural panels
JPS6236884Y2 (en)
JPS6336096Y2 (en)
JP2729398B2 (en) True wall ventilation system
JPS6328740Y2 (en)
JPH0680255B2 (en) How to build an outer insulation wall
JPH1171834A (en) Member for building structure, and method for realizing airtight building
JPS629701B2 (en)
JPH0629311Y2 (en) Building panel
JPH1046696A (en) Component for structure
JPH0727284Y2 (en) Insulation wall panels
JPH0327129Y2 (en)
JPH0541872Y2 (en)
JPH11131619A (en) Heat insulating wall complementing member