JPS61283453A - Inspection method for joining part of plate like joining member - Google Patents

Abstract

PURPOSE:To enable to surely inspect the quality of the joining state by giving a thermal stress by heating the surface of one part side simultaneously with cooling the other part side for the soldered plate like joining member and by observing the joining state of a joining part. CONSTITUTION:The target for spattering consisting of a target member 1 and packing plate 2 is set by a bolt 4 to a water cooling jacket 3. The bottom face of the plate 2 is cooled with the circulation feeding of a cooling water to the water cooling jacket 3 and on the other hand a TIG welding torch 5 is arranged eccentrically on the upper part of the target member 1. A thermal stress is given by heating the surface of the target member 1 by generating an arc on the torch 5 and by its rotation. The separation state of the joining part is inspected by visual observation on the target for spattering of this consequence.

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention is directed to a method for inspecting the joint status of a joint part of a plate-shaped joint member that has been brazed or soldered (hereinafter simply referred to as soldering). It is something.

[Conventional technology]

In general, a sputtering target made of a target member 7a/soldered to a backing plate is known as, for example, a plate-like bonding member.

Usually, the bonding condition of the bonded portion of plate-like bonding members such as these sputtering targets is inspected by X-ray transmission method or ultrasonic flaw detection method.

[9 Problems to be Solved by the Invention] However, with the former X-ray transmission method, what appears on the photographed film are changes in the thickness of the solder material at the joint, blowholes, etc. It is impossible to judge the degree of soldering, only the presence or absence of defects.
The plate-shaped joining member is a sputtering target,
If the target member constituting this unit has a high specific gravity, for example, a W-Ti alloy, or if one or both of the plate-shaped joint members are thick, it is difficult for X-rays to pass through. There are problems such as testing being difficult or impossible.

In addition, in the latter ultrasonic flaw detection method, when the plate-like bonding member is, for example, a sputtering target and the target member is made of pure Al with a very large crystal grain size, the crystal grains of the ultrasonic Since it is difficult to ignore the reflection from the field, it is practically difficult to accurately judge whether the joint is good or bad.

Furthermore, in any of the above methods, it is impossible to predict the occurrence of bonding defects during use of the plate-shaped bonding member.

If there is a bonding defect in the joint of a plate-shaped bonding member, for example, if the lower backing plate is a sputtering target that is forcibly cooled during use, the cooling of the defective bond during sputtering will be slow. Therefore, if the VC is used for a long time, the solder material in this part may melt and the target member may fall off the backing plate, or the temperature of the target member may rise. Since the temperature is abnormally high, the sputtering speed becomes excessive, and troubles such as the inability to control the film thickness cannot be avoided.

[Means for solving problems]

Therefore, from the above-mentioned viewpoint, the present inventors evaluated the quality of the joint of the joint of the soldered plate-like joint member.
As a result of our research to develop a method that can reliably inspect the occurrence of peeling during use, including the prediction of the occurrence of peeling,
When a thermal stress is applied to a soldered plate-shaped joining member by heating the surface of one side member and cooling the surface of the other side member at the same time, the joint part of the plate-shaped joining member If there is a defective bond, the thermal stress causes peeling at the defective bond, and this peeling can be detected by (υ visual inspection of the outer periphery of the joint, ■ measurement of the floating amount of the heating side member, (■ heating during application of thermal stress) Measuring the temperature change of the side member may be confirmed by at least one of the means (1) to (3) above.In this case, the dimensions and shape of the plate-shaped joint member, and It is not affected by the materials of the constituent members, and furthermore, if the plate-shaped bonding member is, for example, a sputtering target, the above thermal stress corresponds to the usage conditions of the sputtering target. We have obtained the knowledge that if there is no peeling at the joint due to the application of this thermal stress, it can be predicted that no peeling will occur at the joint during use.

This invention has been made based on the above findings, and includes inspection of the joint status at the joint portion of plate-shaped joint members.
A thermal stress is applied to the soldered plate-shaped joint member by heating the surface of one side member and simultaneously cooling the surface of the other side member. This method is characterized in that it is carried out by observing the bonding condition of the bonded portions of the plate-like bonded members after stress has been applied.

〔Example〕

Next, the method of the present invention will be specifically explained using examples.

Example 1 As a plate-like joining member, diameter: 240m x thickness: 20n+
Dimensions and AA! A target member having a composition of -1% Si was placed on an oxygen-free copper backing plate having dimensions of diameter: 320 mm x thickness: 15 nm.
Thickness: 0.3 having a composition of %Ag Sputtering target made by soldering in a vacuum at a temperature of 235°C for 5 minutes using a dragon foil solder: 20
I prepared a piece.

Next, as shown in the schematic diagram in FIG. Cooling water is circulated and supplied to cool the bottom surface of the backing plate 2. A TIG welding torch 5 is eccentrically arranged above the target member 1, and an arc current of 100 A is applied to the torch 5. An arc was generated at a voltage of 30 V, and the arc was rotated at a speed of 200 crn/ml to apply thermal stress by heating the surface of the target member 1 for 5 minutes. In addition, in the figure, 6 is a TIG welding power source.

When the resulting sputtering targets were visually inspected for peeling of the joints, peeling was observed in five targets. Furthermore, we measured the solder joint area for those without peeling and those with peeling.

All of them had a bonding area of 90% or more, whereas all of the samples with peeling had a bonding area of 20% or less.

Example 2 Similarly, 20 sputtering targets were prepared as plate-shaped bonding members under the same conditions as in Example 1 except that the thickness of the target member was set to Low.

Next, thermal stress was applied to each of these sputtering targets in the state shown in FIG. 1 and under the same conditions as in Example 1, and the target member in the sputtering target after applying the thermal stress was The amount of floating was measured.

Note that the flying height is expressed as the difference in height of the sputtering target before and after applying thermal stress.

As a result, 18 of the 20 sputtering targets have a flying height of 0.05 m or less, while the remaining 2 have a flying height of 0.1 tm or less.
It was more than that.

Furthermore, we measured the joint area of these solders and found that the former solder with a small floating amount had a joint area of over 90%, while the latter with a large floating amount had a joint area of 20%. Only the following bonding area is shown, and it is clear that the quality of soldering can be reliably inspected as in the case of Example 1.

Example 3 As a plate-like bonding member, a target member having dimensions of diameter: 240 m x thickness: 5'' and a composition of W-10% Ti was used as an oxygen-free copper backing plate having dimensions of diameter: 320 m x thickness: 15 nm. In this process, In foil having a thickness of 0.3 m was used as the solder material, and the temperature was 1 in a vacuum.
Twenty sputtering targets were prepared by soldering at 70°C for 5 minutes.

Next, thermal stress was applied to each of these sputtering targets in the state shown in FIG. 1 and under the same conditions as in Example 1, and during the application of this thermal stress. Thermal changes at three equally spaced locations near the outer periphery of the upper surface of the target member were measured and recorded using a thermocouple and a pen recorder.

As a result, out of the 20 sputtering targets mentioned above, 17 showed the thermal change in the pattern shown in Figure 2, and the remaining 3 showed the thermal change in the pattern shown in Figure 3. Ta.

However, when we measured the solder joint area of 7 of these sputtering targets, we found that the thermal change curve in Figure 2 had a joint area of over 90%, whereas the thermal change curve in Figure 3 had a joint area of over 90%. The change curve shows that the joint area is less than 20%, and from these results, it can be seen that in the former sputtering target with a high joint area, there is no peeling at the joint, so it is difficult to apply thermal stress. In the second case, the surface temperature of the target member is kept almost constant, and in the second case, in sputtering targets with a small bonding area, peeling occurs at the bonding part, and the surface temperature of the target member is It can be seen that the temperature gradually increases over time.

[Overall effect]

As described above, according to the method of the present invention, the welding condition of the welded portion can be controlled without being influenced in any way by the dimensions and shape of the soldered plate-like joining member, or the materials of the members constituting it. It is possible to reliably inspect the quality of the product, including predicting whether or not peeling will occur during use.

[Brief explanation of drawings]

FIG. 1 is a schematic explanatory diagram showing a thermal stress application mode in an embodiment of the method of this invention, and FIGS. 2 and 3 are diagrams showing thermal change curves of the surface temperature of a target member in an embodiment of the method of this invention. It is. DESCRIPTION OF SYMBOLS 1... Target member, 2... Backing plate, 3... Water cooling jacket, 4... Bolt, 5...
・TIG welding torch, 6...TIG welding power source.

Claims (2)

[Claims] (1) Applying thermal stress to a brazed or soldered plate-shaped joint member by heating the surface of one side member and simultaneously cooling the surface of the other side member, and A method for inspecting a joint of a plate-shaped joint member that is brazed or soldered, the method comprising observing the joint status of the plate-shaped joint member during or after applying thermal stress. (2) The plate-shaped joining member is a sputtering target in which one side member is a target member and the other side member is a backing plate. ) Method for inspecting joints of plate-like joint members that are brazed or soldered.