JPS61281894A - Plating device for terminal of printed circuit board - Google Patents

Plating device for terminal of printed circuit board

Info

Publication number
JPS61281894A
JPS61281894A JP12350585A JP12350585A JPS61281894A JP S61281894 A JPS61281894 A JP S61281894A JP 12350585 A JP12350585 A JP 12350585A JP 12350585 A JP12350585 A JP 12350585A JP S61281894 A JPS61281894 A JP S61281894A
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
plating
terminals
terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12350585A
Other languages
Japanese (ja)
Other versions
JPH0121875B2 (en
Inventor
Junichi Tezuka
純一 手塚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EEJA Ltd
Original Assignee
Electroplating Engineers of Japan Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electroplating Engineers of Japan Ltd filed Critical Electroplating Engineers of Japan Ltd
Priority to JP12350585A priority Critical patent/JPS61281894A/en
Publication of JPS61281894A publication Critical patent/JPS61281894A/en
Publication of JPH0121875B2 publication Critical patent/JPH0121875B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/24Reinforcing the conductive pattern
    • H05K3/241Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

PURPOSE:To suppress the generation of the variance in plating thickness and to approximate the same to an average thickness by controlling discretely currents to divided anodes in the stage of arranging the plural divided anodes, passing the terminals of a printed circuit board therebetween and injecting a plating liquid thereto. CONSTITUTION:The plural divided anodes 5 are connected to respectively discrete power feed circuits 12 and are made independent. The printed circuit board 1 having the terminals 2 is moved toward an arrow along a moving line A and the plating liquid 6 is ejected from plural nozzles 9 for each of block areas 10 so that each of the terminals 2 positioned in the corresponding positions is subjected to a plating treatment. A current detector 16 detects constantly the current flowing to the circuits 12 and changes over a change-over switch 15 to a resistance circuit 14 side when the current flowing therein attains a set value or above. The switch 15 is again connected to the circuits 14 by a timer 15 upon lapse of the set time. The terminals are plated to the uniform thickness by controlling discretely the plating treatment in the above-mentioned manner.

Description

【発明の詳細な説明】 〈産業上の利用分野〉 この発明はプリント基板端子のメッキ装置に関する。[Detailed description of the invention] <Industrial application field> The present invention relates to a plating apparatus for printed circuit board terminals.

〈従来の技術〉 分割アノードを使用し、各分割アノードに流す電流を個
別に制御してはメッキ付着量の均一化を図る技術が既に
知られている(例えば、特開昭59−59895号公報
に開示のメッキ方法)。
<Prior art> A technique is already known in which split anodes are used and the current applied to each split anode is individually controlled to make the amount of plating uniform. plating method disclosed in ).

〈解決しようとする問題点〉 しかしながら上記の如き従来技術はストリップを対象と
したものであり、プリント基板端子を対象としてはいな
い。一般に知られる如くプリント基板端子はストリップ
と違って、多種のパターンで端子が配列されており各端
子を均一なメッキ厚にメッキすることが非常に困難であ
る。
<Problems to be Solved> However, the above-mentioned conventional techniques are aimed at strips, not printed circuit board terminals. As is generally known, unlike strips, printed circuit board terminals are arranged in various patterns, and it is extremely difficult to plate each terminal with a uniform plating thickness.

プリント基板端子のメッキ(例えばNiメッキ、Auメ
ッキ)では通常液面制御(浸漬法)、液吹付け(ジェッ
ト法)等の方法が採用されているが、いずれの場合もメ
ッキ厚にバラツキが発生し易く、例えば第5図及び第6
図で示すようにプリント基板1の端子2が集合していた
り又離れていたりすると、メッキ厚(μ)は中央の端子
群(2a)よりも端に位置する端子群(2b)の方が厚
くなりがちでメッキ厚(μ)にバラツキが生じる。この
ためNiメッキでは平均値の3〜4倍程度、そしてAu
メッキでは2倍程度端の端子群(2b)に多く付いてし
まうことが知られている。更に、最大電流密度が両端の
厚い所(2C)で断限されてしまいそれが上限値とされ
てしまうためにそれ以上に電流密度を上げることができ
ずメッキ処理上もロスの大きいものであった。
For plating printed circuit board terminals (for example, Ni plating, Au plating), methods such as liquid level control (immersion method) and liquid spraying (jet method) are usually used, but in either case, variations occur in the plating thickness. For example, Figures 5 and 6
As shown in the figure, when the terminals 2 of the printed circuit board 1 are grouped together or separated, the plating thickness (μ) is thicker for the terminal group located at the edge (2b) than for the center terminal group (2a). This tends to cause variations in plating thickness (μ). For this reason, Ni plating is about 3 to 4 times the average value, and Au
It is known that in plating, about twice as much of the metal is attached to the terminal group (2b) at the end. Furthermore, the maximum current density is limited at the thick points (2C) at both ends, and this is taken as the upper limit, so it is impossible to increase the current density any further, and there is a large loss in the plating process. Ta.

く問題点を解決するための手段〉 そこで、この発明では、従来ストリップのメッキで知ら
れている分割アノードの技術をプリント基板端子のメッ
キに合わせて改良したものである。
Means for Solving the Problems> Accordingly, in the present invention, the split anode technology conventionally known for plating strips is improved to suit the plating of printed circuit board terminals.

そして具体的には、この発明に係るプリント基板端子の
メッキ装置では、複数の分割7ノードはこのプリント基
板端子の移動ラインに沿って配され且つ隔壁で各端子の
幅サイズにほぼ相応する間隔毎にそれぞれ区画されると
共に、各区画域内にはその前方を移動するプリント基板
端子めがけてメッキ液を施すノズルが組合わされ、各分
割アノードに電流を流すべく接続された整流器付きの給
電回路には、電流を流しづらくする抵抗付きの抵抗回路
が切替スイッチを介して並列接続され、そして給電回路
を流れる電流が設定値以上多く流れた場合にそれを検知
して切替スイッチを抵抗回路側へ接続せしめる電流検知
器を切替スイッチに組合わせてあることを要旨としてい
る。
Specifically, in the printed circuit board terminal plating apparatus according to the present invention, the plurality of divided seven nodes are arranged along the movement line of the printed circuit board terminal, and are arranged at intervals approximately corresponding to the width size of each terminal by the partition wall. Each divided area is combined with a nozzle that applies plating solution to the printed circuit board terminal moving in front of the divided area, and a power supply circuit with a rectifier connected to flow current to each divided anode has a A resistance circuit with a resistance that makes it difficult for current to flow is connected in parallel via a changeover switch, and when the current flowing through the power supply circuit exceeds a set value, it is detected and the changeover switch is connected to the resistance circuit side. The gist is that the detector is combined with a changeover switch.

〈作 用〉 プリント基板がパスラインに沿って移動すると、プリン
ト基板端子は隔壁で区画された区画前方を移動すること
になり順次移動方向の各区画前方を通過する。各区画で
はノズルからメッキ液が、そこを通過してゆくプリント
基板端子めがけて吹付けられることになるが、この時「
端の端子群」に相当する成る端子と対応する成る分割ア
ノードでは給電回路に多くの電流が流れ、「中央の端子
群」に相当する別の端子と対応する別の分割アノードで
は電流が先の成る分割アノード程多くは流れない。予め
メッキ対象物とするプリント基板の全端子面積に対する
電流量から1つの端子当りに流す最大電流値を「設定値
」として決めておけば、成る分割アノードで流れる電流
値が「設定値」を越えると電流検知器がそれを検知して
、切替スイッチを抵抗回路側に切替え電流を少なく流す
ようにし、更に任意時間後(タイマーで任意に設定可能
)元の給電回路に切替スイッチを戻すものである。
<Function> When the printed circuit board moves along the path line, the printed circuit board terminals move in front of the sections partitioned by partition walls and sequentially pass in front of each section in the moving direction. In each section, the plating solution is sprayed from the nozzle toward the printed circuit board terminals passing through it.
A large amount of current flows in the power supply circuit through the terminals corresponding to the "end terminal group" and the corresponding split anodes, while the current flows through another split anode corresponding to the other terminals corresponding to the "center terminal group". It does not flow as much as a split anode. If you decide in advance the maximum current value to flow per terminal as the "set value" based on the amount of current for the total terminal area of the printed circuit board to be plated, the current value flowing through the divided anode will exceed the "set value". The current detector detects this, switches the changeover switch to the resistance circuit side, allows less current to flow, and then returns the changeover switch to the original power supply circuit after an arbitrary period of time (can be set arbitrarily with a timer). .

このようにして成る分割アノードで成る端子に対して過
電流が流れぬように制御しつつ、個々の分割アノードご
とに個別の制御を行なえば、メッキ厚のバラツキが発生
せず、個々の端子のメッキ厚を平均厚さに近づけること
ができ、最大電流密度を大きく採れることになる。
By controlling the terminals made of split anodes in this manner so that overcurrent does not flow, and by individually controlling each split anode, variations in plating thickness will not occur, and the The plating thickness can be brought close to the average thickness, and the maximum current density can be increased.

〈実施例〉 次に図面(第1図〜第4図)を参照しつつこのメッキ装
置の一実施例を説明する。尚、従来と共通部分は、同一
符号を以って示す。
<Example> Next, an example of this plating apparatus will be described with reference to the drawings (FIGS. 1 to 4). Incidentally, parts common to the conventional one are indicated by the same reference numerals.

プリント基板1ばメッキ対象物としてのプリント基板端
子2〔以下単に「端子」と称す〕をその両側面に備えて
おり、端子2は移動ライン(A)に沿って第2図矢示方
向へ移動自在としである。
A printed circuit board 1 is provided with printed circuit board terminals 2 (hereinafter simply referred to as "terminals") as objects to be plated on both sides thereof, and the terminals 2 move in the direction of the arrow in FIG. 2 along the movement line (A). It is free.

3はメッキ装置の要部で、隔壁4にて各々区画された複
数の分割アノード5が移動ライン(A)に沿って両側に
各々配されている0分割アノード5は移動ライン(A)
方向で分割されているだけでなく、端子2の上下方向(
第2図矢示方向)でも2分割されている。このうよな分
割7ノード5は、それぞれメッキ液6の噴射ボックス7
の前面部8に取付けられており、且つそこにはノズル9
が複数組合わされている。前面部8は上部より下部が端
子2に対して遠くなる状態に傾斜せしめてあり、端子2
の下部(2d)が上(2e)よりメッキが厚く付かない
よう配慮しである。又、前記の如く、ノズル9を複数、
独立的にしであるのは(第1図参照)、端子2の上部(
2e)や下部(2d)を問わず各部位に当たるメッキ液
の量を増加せしめるためである。そして隔壁4で区画さ
れた区画域10ではその前方を移動する端子2めがけて
メッキ液6が噴射して施せるようになるが、各区画域1
0の幅サイズは予め各端子2の個々の幅サイズに大体相
応する間隔としである。
3 is the main part of the plating apparatus, in which a plurality of divided anodes 5 each partitioned by a partition wall 4 are arranged on both sides along the moving line (A).The 0 divided anode 5 is along the moving line (A).
Not only is it divided in the direction, but also in the vertical direction of terminal 2 (
It is also divided into two parts (in the direction of the arrow in Fig. 2). Each of these 7 divided nodes 5 has an injection box 7 for plating solution 6.
The nozzle 9 is attached to the front part 8 of the
are combined in multiple ways. The front part 8 is inclined so that the lower part is farther from the terminal 2 than the upper part, and the lower part is farther from the terminal 2 than the upper part.
Care was taken to ensure that the plating was not thicker on the lower part (2d) than on the upper part (2e). Moreover, as mentioned above, a plurality of nozzles 9,
What is independent of this (see Figure 1) is the upper part of terminal 2 (see Figure 1).
This is to increase the amount of plating solution that hits each part, regardless of whether it is 2e) or the lower part (2d). In the divided areas 10 divided by the partition walls 4, the plating solution 6 can be sprayed onto the terminals 2 moving in front of the divided areas 10.
The width size 0 is predetermined at intervals roughly corresponding to the individual width sizes of each terminal 2.

このように隔壁4で、隣り合う分割アノード5同士はそ
れぞれが移動ライン(A)方向で区切られており、各分
割アノード5は独立化されている。
In this way, adjacent divided anodes 5 are separated from each other in the movement line (A) direction by the partition wall 4, and each divided anode 5 is made independent.

そして分割アノード5はそれぞれが、定電圧整流器11
付きの給電回路12に接続され、各給電回路12には抵
抗13付きの抵抗回路14が切替スイッチ15を介して
並列接続されている。16は電流検知器で、給電回路1
2に流れる電流値が「設定値」を越えれば切替スイッチ
15に信号を匿して、常時給電回路12側をON状態に
している切替スイッチ15を介して抵抗回路14側に切
替え給電回路12をOFF、抵抗回路14をONの状態
にできるようにしである。
Each of the divided anodes 5 is connected to a constant voltage rectifier 11.
A resistor circuit 14 having a resistor 13 is connected in parallel to each power supply circuit 12 via a changeover switch 15. 16 is a current detector, and the power supply circuit 1
If the current value flowing through 2 exceeds the "set value", a signal is hidden in the changeover switch 15, and the power supply circuit 12 is switched to the resistance circuit 14 side via the changeover switch 15, which always keeps the power supply circuit 12 side in the ON state. OFF, and the resistance circuit 14 can be turned ON.

尚、抵抗13として図示の例では可変抵抗が使用しであ
る。又、抵抗回路14側を切替・接続した切替スイッチ
15は、タイマー17を介して設定時間(T)経過後天
の給電回路12側に復帰するようにしてあり、設定時間
(T)は端子2の移動速度に合わせて便宜調整可能とし
である。
In the illustrated example, a variable resistor is used as the resistor 13. In addition, the changeover switch 15 that switches and connects the resistance circuit 14 side is configured to return to the power supply circuit 12 side after a set time (T) has elapsed via a timer 17, and the set time (T) is determined by the terminal 2. It can be conveniently adjusted according to the movement speed.

かかるメッキ装置の使用状態を次に説明する。The state of use of such a plating apparatus will be explained next.

今、仮りに1つのプリント基板1の片側の全端子数を1
00ビンとし、端子面積計を0.ldmχ、電流密度を
2OA/dm”として電流量を2Aにすれば、1つ当た
りの端子2には2A/100ビンなので0.02Aの電
流が流れることになり、これに合わせて電流検知器16
の「設定値」を0.02Aより若干大きい0.022A
としておく。
Now, suppose that the total number of terminals on one side of one printed circuit board 1 is 1.
00 bin, and the terminal area meter is 0. If the current density is 2OA/dm" and the current amount is 2A, a current of 0.02A will flow through each terminal 2 since it is 2A/100 bins. Accordingly, the current detector 16
Set the “setting value” to 0.022A, which is slightly larger than 0.02A.
I'll leave it as that.

そして、端子2が移動ライン(A)に沿って第2図矢示
方向へ移動すると、各端子2は順次分割アノード5の前
方、即ち区画域10の前方、を一定速度で移動してゆく
ことになり、成る区画域10にさしかかった成る端子2
が「端の端子群」 (2b) に相当する場合、給電回路12を介してその成る区画域
10内の成る分割アノード5には電流が大(流れ易く、
その流れを電流検知器16で常時検知し、電流値が第4
図で示す如<0.022Aのラインを越えれば0点で切
替スイッチ15を抵抗回路14側に切替えさせ抵抗回路
14側をONにして電流が流れづらくする〔第4図Xゾ
ーン〕、そして設定時間(T)の経過後、切替スイッチ
15を復帰せしめて元の給電回路12側をONにするも
のである。そして別の区画域10と別の分割アノード5
に対して、「中央の端子群J  (2a)に相当する別
の端子2がさしかかって、その前方を移動する場合、別
の分割アノード5に流れる電流は0.02Aより多くは
流れず、従って切替スイッチ15は給電回路12側をO
N状態に保つ〔第4図Yゾーン〕、このような電流の流
し方が個々の分割アノード5に対して個別的に行われつ
つ、カソード化した端子2めがけてメッキ液6を各区画
域10ごとの複数のノズル9から噴射し、各区画域10
ごとにそこへ移動しつつ対応位置決めされてくる各端子
2ごとに〔各ピンごとに〕、独立化したメッキ処理を行
なうことになる。そして、かかるメッキ処理を、図示の
例では両側〔第1図の左右側〕ごとにそれぞれ個別に制
御して行うことになるが、プリント基板1の種類によっ
ては片側のみ用いることも可能であり、又両側のメッキ
装置の片方を移動ライン(A)に沿って位置的にズラし
て、両側のメッキ装置を対向配置せぬようにすることも
可能である。
When the terminals 2 move along the movement line (A) in the direction of the arrow in FIG. Terminal 2 approaching the partition area 10 becomes
corresponds to the "terminal group at the end" (2b), a large current (flows easily,
The flow is constantly detected by the current detector 16, and the current value is the fourth
As shown in the figure, if the line of <0.022A is exceeded, the selector switch 15 is switched to the resistor circuit 14 side at the 0 point, the resistor circuit 14 side is turned on, and the current is made difficult to flow [Zone X in Figure 4], and the settings are made. After the time (T) has elapsed, the selector switch 15 is reset to turn on the original power supply circuit 12 side. and another compartment 10 and another split anode 5
``If another terminal 2 corresponding to the central terminal group J (2a) approaches and moves in front of it, the current flowing through another divided anode 5 will not be more than 0.02A, so The changeover switch 15 sets the power supply circuit 12 side to O.
While maintaining the N state (Y zone in FIG. 4), the current is applied to each divided anode 5 individually, and the plating solution 6 is applied to each divided area 10 toward the cathode terminal 2. Each compartment 10 is injected from a plurality of nozzles 9
An independent plating process is performed for each terminal 2 (for each pin), which is moved and positioned accordingly. In the illustrated example, the plating process is individually controlled and performed on both sides (the left and right sides in FIG. 1), but depending on the type of printed circuit board 1, it is also possible to use only one side. It is also possible to shift one of the plating devices on both sides along the movement line (A) so that the plating devices on both sides are not disposed facing each other.

く効 果〉 この発明に係るプリント基板端子のメッキ装置は、以上
説明して来た如き内容のものなので、多くの秀れた効果
があり、その内の主なるものを列挙すれば以下の通りで
ある。
Effects> The plating apparatus for printed circuit board terminals according to the present invention has many excellent effects as described above, and the main ones are listed below. It is.

(イ)個々の端子ごとに(ピッごとに)メッキが厚く付
くのを制御でき、 (ロ)より一層平均厚さに近づけるてことが可能で、 (ハ)それにより最大電流密度を高く (約2〜3倍)
とることができ、そして (ニ)それに応じてメッキ処理時間を短縮できる。
(b) It is possible to control the thick plating on each individual terminal (for each pin), (b) it is possible to get closer to the average thickness, and (c) this allows the maximum current density to be increased (approx. 2-3 times)
and (d) the plating process time can be shortened accordingly.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図はメッキ装置の要部断面図、 第2図はメッキ装置の要部斜視図、 第3図は分割アノードに接続された回路図、第4図は端
子(ビン)に応じた電流の流れ方を示すグラフ、そして 第5図及び第6図は、各々、プリント基板端子のパター
ンを示すプリント基板の正面図である。 第1図 第3図 第4図 第5図       第6図 手菊誹甫正書(自発)      補 昭和60年12月248   。 特許庁長官殿                   
            (2)と 26発明の名称 プリント基板端子のメッキ装置 3、補正をする者 羽生との麺 特許出願人 〒105 住所東京都港区虎ノ門2−7−9第1岡名ビル正の内容
(特願昭60−123505号)明細書の第6頁第12
行目に「このうよな」あるを、「このような」と補正す
る。 明細書の第6頁第17行目に「上(26)Jあるを、「
上部(2e)Jと補正する。 図面中筒3図を別紙に示す第3図の如く補正る。
Figure 1 is a sectional view of the main parts of the plating equipment, Figure 2 is a perspective view of the main parts of the plating equipment, Figure 3 is a circuit diagram connected to the split anode, and Figure 4 shows the current flow depending on the terminal (bin). The graph showing the flow direction and FIGS. 5 and 6 are front views of the printed circuit board showing the pattern of the printed circuit board terminals, respectively. Fig. 1 Fig. 3 Fig. 4 Fig. 5 Fig. 6 Tekikugefu Seisho (self-published) Supplementary December 1985 248. Commissioner of the Patent Office
(2) and 26 Name of the invention Printed circuit board terminal plating device 3, Noodles with Hanyu who makes the correction Patent applicant 105 Address No. 1 Okana Building, 2-7-9 Toranomon, Minato-ku, Tokyo Contents (special Application No. 60-123505) Page 6, No. 12 of the specification
Correct ``kono yona'' in the first line to ``kono yona''. In the 17th line of page 6 of the specification, it says ``Upper (26) J is''.
Upper part (2e) Correct as J. Figure 3 of the cylinder in the drawing is corrected as shown in Figure 3 shown in the attached sheet.

Claims (1)

【特許請求の範囲】  メッキ対象物に対し複数の分割アノードを配して各分
割アノードに流す電流を個別に制御しつつカソード化し
たメッキ対象物にメッキ液を施してメッキするメッキ装
置に於いて、 上記メッキ対象物がプリント基板端子であり、複数の分
割アノードはこのプリント基板端子の移動ラインに沿っ
て配され且つ隔壁で各端子の幅サイズにほぼ相応する間
隔毎にそれぞれ区画されると共に、各区画域内にはその
前方を移動するプリント基板端子めがけてメッキ液を施
すノズルが組合わされ、 各分割アノードに電流を流すべく接続された定電圧整流
器付きの給電回路には、電流を流しづらくする抵抗付き
の抵抗回路が切替スイッチを介して並列接続され、そし
て給電回路を流れる電流が設定値以上多く流れた場合に
それを検知して切替スイッチを抵抗回路側へ接続せしめ
る電流検知器を切替スイッチに組合わせてあることを特
徴とするプリント基板端子のメッキ装置。
[Scope of Claims] A plating apparatus in which a plurality of divided anodes are disposed on an object to be plated, and a plating solution is applied to the object to be cathodized while controlling the current flowing through each divided anode individually. , the object to be plated is a printed circuit board terminal, the plurality of divided anodes are arranged along the movement line of the printed circuit board terminal, and are partitioned by partition walls at intervals approximately corresponding to the width size of each terminal, Each compartment is equipped with a nozzle that applies plating solution to the printed circuit board terminals moving in front of it, making it difficult for current to flow through the power supply circuit with a constant voltage rectifier connected to each divided anode to allow current to flow. Resistance circuits with resistors are connected in parallel via a changeover switch, and a changeover switch is a current detector that detects when the current flowing through the power supply circuit exceeds a set value and connects the changeover switch to the resistance circuit side. A plating device for printed circuit board terminals, characterized in that it is combined with the following.
JP12350585A 1985-06-08 1985-06-08 Plating device for terminal of printed circuit board Granted JPS61281894A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12350585A JPS61281894A (en) 1985-06-08 1985-06-08 Plating device for terminal of printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12350585A JPS61281894A (en) 1985-06-08 1985-06-08 Plating device for terminal of printed circuit board

Publications (2)

Publication Number Publication Date
JPS61281894A true JPS61281894A (en) 1986-12-12
JPH0121875B2 JPH0121875B2 (en) 1989-04-24

Family

ID=14862281

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12350585A Granted JPS61281894A (en) 1985-06-08 1985-06-08 Plating device for terminal of printed circuit board

Country Status (1)

Country Link
JP (1) JPS61281894A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003033774A1 (en) * 2001-10-15 2003-04-24 Marunaka Kogyo Co., Ltd. Submerged transfer plating device with plating fluid jetting tube
JP2004211124A (en) * 2002-12-27 2004-07-29 Saatec Kk Damascene plating method and plating apparatus using this method
US7914657B2 (en) 2005-12-01 2011-03-29 Hitachi Global Storage Technologies, Netherlands B.V. Controlling the thickness of wafers during the electroplating process

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003033774A1 (en) * 2001-10-15 2003-04-24 Marunaka Kogyo Co., Ltd. Submerged transfer plating device with plating fluid jetting tube
JP2004211124A (en) * 2002-12-27 2004-07-29 Saatec Kk Damascene plating method and plating apparatus using this method
US7914657B2 (en) 2005-12-01 2011-03-29 Hitachi Global Storage Technologies, Netherlands B.V. Controlling the thickness of wafers during the electroplating process

Also Published As

Publication number Publication date
JPH0121875B2 (en) 1989-04-24

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