JPS6127867U - 容器 - Google Patents
容器Info
- Publication number
- JPS6127867U JPS6127867U JP11385984U JP11385984U JPS6127867U JP S6127867 U JPS6127867 U JP S6127867U JP 11385984 U JP11385984 U JP 11385984U JP 11385984 U JP11385984 U JP 11385984U JP S6127867 U JPS6127867 U JP S6127867U
- Authority
- JP
- Japan
- Prior art keywords
- locking
- wall
- frame
- short cylindrical
- cylindrical wall
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Packging For Living Organisms, Food Or Medicinal Products That Are Sensitive To Environmental Conditiond (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11385984U JPS6127867U (ja) | 1984-07-26 | 1984-07-26 | 容器 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11385984U JPS6127867U (ja) | 1984-07-26 | 1984-07-26 | 容器 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6127867U true JPS6127867U (ja) | 1986-02-19 |
| JPS641269Y2 JPS641269Y2 (cg-RX-API-DMAC7.html) | 1989-01-12 |
Family
ID=30672885
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11385984U Granted JPS6127867U (ja) | 1984-07-26 | 1984-07-26 | 容器 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6127867U (cg-RX-API-DMAC7.html) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02198605A (ja) * | 1989-01-26 | 1990-08-07 | Takeo Mori | 脱水コンベア |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3398721B2 (ja) | 1999-05-20 | 2003-04-21 | アムコー テクノロジー コリア インコーポレーティド | 半導体パッケージ及びその製造方法 |
| JP2001077301A (ja) | 1999-08-24 | 2001-03-23 | Amkor Technology Korea Inc | 半導体パッケージ及びその製造方法 |
| US7633144B1 (en) | 2006-05-24 | 2009-12-15 | Amkor Technology, Inc. | Semiconductor package |
-
1984
- 1984-07-26 JP JP11385984U patent/JPS6127867U/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02198605A (ja) * | 1989-01-26 | 1990-08-07 | Takeo Mori | 脱水コンベア |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS641269Y2 (cg-RX-API-DMAC7.html) | 1989-01-12 |