JPS61277424A - Covering method for film - Google Patents

Abstract

PURPOSE:To cover a substrate with the titled film smooth without hanging an end of said film on the substrate, by covering the substrate with the said film in a state that the said film has been inflated by sending air into a baggy heat-shrinkable film. CONSTITUTION:A film covering upper jig 3 is set up on the upper part of a substrate 2 and the substrate 2 is covered with a baggy heat-shrinkable film 1 under a state wherein the film 1 has been inflated by sending air into the same through a gas sending-in pipe 5. Said film may be inflated by depressurizing the outside of the same in place of sending air into the baggy film. The titled method is suitable for covering a cylindrical cylinder constituted by applying a light conductive layer to a photosensitive drum composed of an electrophotography photosensitive member with the heat-shrinkable film. As covering of the substrate is performed under a state wherein the film is inflated it does not happen that the film is hung on the substrate.

Description

DETAILED DESCRIPTION OF THE INVENTION C. Industrial Application Field The present invention relates to a method for coating a substrate with a heat-shrinkable film.

[Prior Art] A method of coating a heat-shrinkable film on a substrate as described above is as follows:
It is used in various fields, and for example, it is also used to coat the photoconductive layer of a photosensitive drum of an electrophotographic photosensitive member.

Conventionally, in such cases, the general method was to cover the photoconductive layer coated on a cylindrical cylinder base with a heat shrink film, and then place the base in a heating furnace or heated solution to heat shrink and complete the process. Met.

However, this method is very difficult when covering a cylindrical cylinder coated with a photoconductive layer with a heat-shrinkable film because there is almost no difference between the width of the film and the size of the cylinder, and it is difficult to apply the film. However, there was a drawback that the photoconductive layer could be scratched at the leading edge of the film.

[Object of the Invention] In view of the above-mentioned problems of the prior art, the present invention has been made to provide a cylindrical cylinder substrate coated with a photoconductive layer, when covering the substrate with a heat-shrinkable film having a small diameter difference. It is an object of the present invention to provide a method for smoothly coating a photoconductive layer without getting it caught, and without damaging the photoconductive layer applied to the surface of a cylindrical cylinder due to contact with the film.

[Summary of the Invention] The above object is to apply heat to the substrate under the pressure condition of Pin>Pout when the pressure on the inside of the film is Pin and the pressure on the outside of the film is Pout. This is achieved by covering with shrink film.

[Example] Hereinafter, an example of the present invention will be described with reference to the drawings.

1 to 3 are schematic diagrams for explaining the film coating method of the present invention. Figure 1 shows the state before the heat-shrinkable film 1 is inserted into a cylindrical cylinder 2 coated with a photoconductive layer. In the lower jig, 5 is a gas feed pipe, 6 is a substrate mount, and 7 is a gas feed conduit.

In FIG. 1, the film 1 is deflated and does not cover the cylindrical cylinder base 2, but the pressure inside the film 1 is P in and the pressure outside the film 1 is P o
If the pressure condition is P in > P out, the film l will expand into a cylindrical shape with a regular diameter as shown in FIG. 2, making it easier to cover.

Such a pressure adjustment method can be achieved by blowing gas (air, etc.) through the gas feed pipe 5.

Figure 3 shows how the film l is applied to the cylinder base 2 using the above method.
It is a diagram showing the place where it is pushed into.

The present invention is not limited to the above-described embodiments, and can be implemented with various modifications, for example,
Instead of feeding gas from the gas feed pipe 5 to achieve the pressure condition of P in > P out, the pressure around the cylinder base body 2 (Pout) may be reduced.

Further, in the above embodiments, the base body is cylindrical and the heat shrinkable film is also cylindrical. However, it is clear that the shape of the base body is not limited to the cylindrical shape, but can also be applied to other shapes. be.

[Effects of the Invention] As explained above, according to the present invention, the pressure condition is
By keeping the film in > P out, the film can be coated smoothly without getting the edge of the film caught on the substrate, and also prevents damage to weak films such as photoconductive layers coated on the surface of the substrate due to contact with the film. Nokai Fullum tightening W is -r & layer Sue

[Brief explanation of drawings]

FIGS. 1 to 3 are schematic diagrams for explaining the film coating method of the present invention. l: Heat shrink film 2: Cylindrical cylinder base 3: Upper jig for film covering 4: Lower jig for film covering 5: Gas feed pipe 6: Substrate stand 7: Percentage body feed conduit agent Patent attorney Minoru Yamashita Figure 3

Claims (3)

[Claims] (1) When covering a substrate with a heat-shrinkable film, the pressure on the inside of the film is Pin, and the pressure on the outside of the film is Pout.
A method of coating a substrate with a heat-shrinkable film under the pressure condition of Pin>Pout. (2) The film coating method according to claim 1, characterized in that the substrate is coated with the heat-shrinkable film while sealing one end of the heat-shrinkable film and blowing gas from the other end. (3) The film coating method according to claim 1, wherein the substrate is cylindrical and the heat-shrinkable film is also cylindrical.