JPS6127660U - polishing equipment - Google Patents
polishing equipmentInfo
- Publication number
- JPS6127660U JPS6127660U JP1984112612U JP11261284U JPS6127660U JP S6127660 U JPS6127660 U JP S6127660U JP 1984112612 U JP1984112612 U JP 1984112612U JP 11261284 U JP11261284 U JP 11261284U JP S6127660 U JPS6127660 U JP S6127660U
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- holder
- polishing equipment
- rotating
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は本考案の研摩装置に用いバ研摩ホルダ及びその
保持部分の構造を示す図である。
第2図は従来用いられている研摩装置の一例を示す図で
ある。
図において1は研摩皿、2は研摩ク0ス、3は研摩ホル
ダ、4は半導体基板、5はおさえ板、6は保持棒、7は
ガイド、8はピン、9はおもり円板、10はアーム、1
1は横棒、12は支柱、13は接触子、14はおもり、
15は本体、16は研摩皿、17は研摩クロス、18は
研摩ホルタ、19は半導体基板、20は保持棒、21は
アーム、22は研摩液タンク、23は研摩液、24は管
をそれぞれ示す。FIG. 1 is a diagram showing the structure of a polishing holder and its holding portion used in the polishing apparatus of the present invention. FIG. 2 is a diagram showing an example of a conventionally used polishing device. In the figure, 1 is a polishing plate, 2 is a polishing cloth, 3 is a polishing holder, 4 is a semiconductor substrate, 5 is a holding plate, 6 is a holding rod, 7 is a guide, 8 is a pin, 9 is a weight disc, and 10 is a Arm, 1
1 is a horizontal bar, 12 is a column, 13 is a contact, 14 is a weight,
15 is the main body, 16 is a polishing plate, 17 is a polishing cloth, 18 is a polishing holder, 19 is a semiconductor substrate, 20 is a holding rod, 21 is an arm, 22 is a polishing liquid tank, 23 is a polishing liquid, and 24 is a tube. .
Claims (1)
ダを保持し、研摩皿と被研摩物の摩擦によって被研摩物
を従動回転させて研摩を行なう研摩装置において、研摩
ホルダとそれを支える保持棒からなる集合体を上方へ持
ち上げて研摩圧力を軽減する機構を有することを特徴と
する研摩装置。In a polishing device that holds a polishing holder to which an object to be polished is attached opposite a rotating polishing plate, and performs polishing by rotating the object due to friction between the polishing plate and the object, the polishing holder and its support are used. A polishing device characterized by having a mechanism for lifting an assembly consisting of holding rods upward to reduce polishing pressure.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1984112612U JPS6127660U (en) | 1984-07-25 | 1984-07-25 | polishing equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1984112612U JPS6127660U (en) | 1984-07-25 | 1984-07-25 | polishing equipment |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6127660U true JPS6127660U (en) | 1986-02-19 |
Family
ID=30671655
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1984112612U Pending JPS6127660U (en) | 1984-07-25 | 1984-07-25 | polishing equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6127660U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH046621U (en) * | 1989-12-30 | 1992-01-22 |
-
1984
- 1984-07-25 JP JP1984112612U patent/JPS6127660U/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH046621U (en) * | 1989-12-30 | 1992-01-22 |
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