JPS6127479B2 - - Google Patents

Info

Publication number
JPS6127479B2
JPS6127479B2 JP15339181A JP15339181A JPS6127479B2 JP S6127479 B2 JPS6127479 B2 JP S6127479B2 JP 15339181 A JP15339181 A JP 15339181A JP 15339181 A JP15339181 A JP 15339181A JP S6127479 B2 JPS6127479 B2 JP S6127479B2
Authority
JP
Japan
Prior art keywords
power supply
carrier beam
contact
carrier
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP15339181A
Other languages
Japanese (ja)
Other versions
JPS5855596A (en
Inventor
Fumio Minoda
Kanji Komori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Light Metal Co Ltd
Original Assignee
Nippon Light Metal Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Light Metal Co Ltd filed Critical Nippon Light Metal Co Ltd
Priority to JP15339181A priority Critical patent/JPS5855596A/en
Publication of JPS5855596A publication Critical patent/JPS5855596A/en
Publication of JPS6127479B2 publication Critical patent/JPS6127479B2/ja
Granted legal-status Critical Current

Links

Description

【発明の詳細な説明】 本願発明は、アルミニウム等の金属材料のメツ
キ処理、陽極酸化処理、着色電解処理、樹脂塗装
処理等の表面処理装置において、被処理材料を吊
支したキヤリアビームを着脱自在に支持して給電
を行う給電機構に関する。
Detailed Description of the Invention The present invention provides a surface treatment apparatus for plating, anodizing, coloring electrolytic treatment, resin painting, etc. of metal materials such as aluminum, in which a carrier beam that suspends the material to be treated can be attached and detached. The present invention relates to a power supply mechanism that supports and supplies power to a user.

従来、例えば、アルミニウム形材の表面処理工
程として脱脂、エツチング、陽極酸化又は着色電
解、水洗、封孔処理、樹脂塗装、焼付処理等の各
処理槽を配置し、処理すべき多数本のアルミニウ
ム形材を吊るしたキヤリアビームの多数本を一定
の搬送ラインで順次各処理槽に送つて各形材の処
理を行つていく表面処理ラインが採用されてお
り、そのうちの例えば着色電解処理槽におけるキ
ヤリアビームへの給電機構は、処理槽の相対する
側壁の上端面に互に相対して対をなす受台を提数
対固定すると共に一方の受台の上面に給電銅板を
取付け、そして処理すべきアルミニウム形材の多
数本がそれぞれ吊り下げられた複数本のキヤリア
ビームを上記の給電銅板上にビーム一端部で直接
接触により支持させるように構成されている。こ
のような構成の給電機構においては、キヤリアビ
ームをクレーンで吊つて受台の給電銅板にキヤリ
アビームの一端に設けた接触片をうまく接触させ
るべく下降させる訳であるが、被加工物の重量並
びに揺動等の影響で相当の熱源を必要とすると共
に、その接触の際のシヨツクと被加工物の揺動等
のため通電の接触面に変形を与え、通電に支障を
来たす欠点があり、そのため電解槽の上端部に一
対の支持棒を配置し、該支持棒を互に近接又は離
隔せしめる直線駆動装置を設け、該支持棒のそれ
ぞれに電源に接続された集電子を設けて該支持棒
が近接したときに上記集電子と接触し被加工物に
通電せしめるハンガー装置を具備したものが開発
された(実開昭50−88516号)が、これとて一対
の支持棒の移動機構が大型となり、ハンガー装置
をクレーンで吊り下げて下し、上記支持棒に接触
せしめる際シヨツクがあり、これが集電子の接触
面に変形を与え、通電に支障を来す欠点が未だ解
決されず、しかも高重量のハンガーをクレーンで
降下せるものであるから、降下速度を制御するこ
とが容易でない等の欠点がある。
Conventionally, for example, treatment tanks for degreasing, etching, anodic oxidation or coloring electrolysis, washing with water, sealing, resin painting, baking, etc. are arranged as surface treatment processes for aluminum shapes, and a large number of aluminum shapes to be treated are processed. A surface treatment line is used in which a large number of carrier beams with hanging materials are sequentially sent to each treatment tank on a fixed conveyance line to process each shape. The power supply mechanism consists of fixing a pair of pedestals facing each other to the upper end surfaces of opposing side walls of the processing tank, and attaching a power supply copper plate to the top surface of one of the pedestals. A plurality of carrier beams each having a large number of suspended shapes are supported on the power supply copper plate by direct contact at one end of the beam. In a power supply mechanism with such a configuration, the carrier beam is lifted by a crane and lowered to bring the contact piece provided at one end of the carrier beam into good contact with the power supply copper plate of the pedestal, but the weight of the workpiece and It requires a considerable heat source due to the effects of rocking, etc., and also has the drawback that the rocking of the shock and workpiece during contact deforms the energizing contact surface, which hinders energization. A pair of support rods is arranged at the upper end of the electrolytic cell, a linear drive device is provided for moving the support rods closer to each other or farther apart, and a current collector connected to a power source is provided for each of the support rods, so that the support rods A device equipped with a hanger device that contacts the current collector and energizes the workpiece when it comes into contact with the current collector was developed (Utility Model Application No. 88516/1989), but this required a large moving mechanism for the pair of support rods. However, when the hanger device is lowered by a crane and brought into contact with the support rod, there is a shock, which deforms the contact surface of the current collector, which hinders the conduction of electricity. Since the hanger is lowered by a crane, there are drawbacks such as the difficulty in controlling the lowering speed.

また、アルミニウム形材の表面処理ラインにお
いては、通常は一つの処理槽に送られる複数のキ
ヤリアビームに等しい時間通電を行つて各キヤリ
アビームに吊るされた形材に等しい表面状態を与
えることが、処理ラインの流れを維持するために
行われている。しかし、ユーザーの要望により、
異る表面状態の少量の形材を至急必要とする場合
があり、このような場合、それに必要に形材を他
の形材の処理ラインの中に割りこませることにな
るが、そのようにすると一つの処理ラインの中に
所要通電時間の相異する形材が吊るされることに
なる。これを着色電解処理についてみれば、例え
ば、一定時間の着色電解処理を施すべき形材の処
理ラインの中に着色電解処理を施さない形材(白
材)を割りこませる場合である。この場合、従来
は、着色電解処理槽に送られるキヤリアビームに
白材用形材を吊るさないで空ビームとする方法が
あるが、生産性が低下する欠点があり、又他の方
法として、白材用形材を吊つたキヤリアビームを
上記給電機構の給電銅板上に支持させる際キヤリ
アビームと給電銅板との間に電気絶縁板をはさみ
こんで電流を遮断する方法が行われているが、作
業がはん雑となり、処理ラインの流れに支障を来
す結果となつていた。
In addition, in a surface treatment line for aluminum profiles, it is common practice to energize multiple carrier beams sent to one treatment tank for equal lengths of time to give the same surface condition to the profiles suspended from each carrier beam. This is done to keep the processing line flowing. However, due to user requests,
There may be cases where a small number of sections with different surface conditions is needed urgently, which may require inserting the section into the processing line for other sections; As a result, shapes with different required energization times are suspended in one processing line. Regarding electrolytic coloring, for example, a profile (white material) that is not subjected to electrolytic coloring is inserted into a processing line for a profile that is to be electrolytically colored for a certain period of time. In this case, conventionally there is a method of creating an empty beam by not suspending the white material profile from the carrier beam sent to the coloring electrolytic treatment tank, but this method has the disadvantage of reducing productivity. When supporting a carrier beam with hanging timber profiles on the power supply copper plate of the power supply mechanism, a method is used to interrupt the current by inserting an electrical insulating plate between the carrier beam and the power supply copper plate. This resulted in clutter and disruption to the flow of the processing line.

本発明は、キヤリアビームを受支しつつ該キヤ
リアビームへの通電時間を自由に変更することが
でき、それにより従来の問題点を解決することが
できる表面処理装置の給電機構を提供することを
目的とし、その特徴は、受台と給電板とを分離
し、一方の受台をキヤリアビームを受支すべき位
置に設置すると共に、他方の給電板を進退駆動手
段により上記キヤリアビームに接離できるように
構成したところにある。
An object of the present invention is to provide a power supply mechanism for a surface treatment apparatus that can receive and support a carrier beam and freely change the energization time to the carrier beam, thereby solving the conventional problems. The purpose is to separate the pedestal and the feed plate, one pedestal is installed at the position where the carrier beam should be supported, and the other feed plate is moved toward and away from the carrier beam by means of advancing and retracting drive means. It is configured so that it can be done.

以下着色電解処理槽の給電機構に実施した図面
を参照して本願発明の実施例を説明する。
Embodiments of the present invention will be described below with reference to drawings showing a power supply mechanism of a coloring electrolytic treatment tank.

第1,2図において、処理槽1の相対する側壁
2,2の上端面に、複数本のキヤリアビーム3,
3(図では2本)を支持すべき位置に受台4及び
進退自在型給電装置5をそれぞれ固定し、これら
相対する受台4,4…上にキヤリアビーム3,3
の両端部を受支させてある。6…はキヤリアビー
ム3,3に吊り下げられたアルミニウム形材、7
…は対極ビーム3…に吊り下げられた対極であ
る。
In FIGS. 1 and 2, a plurality of carrier beams 3,
3 (two in the figure), the pedestal 4 and the movable power supply device 5 are respectively fixed at the positions where the carrier beams 3, 3 are to be supported.
Both ends are supported. 6... is an aluminum profile suspended from carrier beams 3, 3, 7
... is a counter electrode suspended from the counter electrode beam 3....

上記受台4及び給電装置5は互に適宜間隔をあ
けて並設され、受け台4はその本体の上面に電気
絶縁材9を設け、該絶縁材9面でキヤリアビーム
3を受支している。
The pedestal 4 and the power supply device 5 are arranged in parallel with each other at appropriate intervals, and the pedestal 4 has an electrical insulating material 9 on the upper surface of its main body, and supports the carrier beam 3 on the surface of the insulating material 9. There is.

上記進退自在型給電装置5の構成は次のようで
ある。処理槽側壁2の上面に固定した台板10上
に給電板進退駆動手段としてベローズ形のエアバ
ネ11の一端を取付け、該エアバネは圧縮空気の
給排により膨縮して上方へ進退するものであり、
このエアバネ11の上端面に銅製給電板12を水
平に取付けてある。上記給電板は12は、第5図
示のようにその左右両端部を、台板10上に垂直
に起立した案内柱13,13に摺動自在に被嵌し
て支持されると共に、案内柱13,13の上端に
取付けられたバネ受け14,14と給電板12と
の間に介装したコイルバネ15,15により常時
下方へ弾発されている。従つて、今エアバネ11
内に圧縮空気を送つてこれを上方へ膨張変位させ
ると、給電板12が上記エアバネ11に押され、
バネ15,15に抗しつつ案内柱13,13に沿
つて上昇し、それによりキヤリアビーム3と接触
可能の位置に至り、又エアバネ11内の空気を排
出して下方へ収縮変位させると、給電板12がバ
ネ15,15に押されて降下し、キヤリアビーム
3と離間する位置に至ることとなる。16は給電
板12の端部に接続された給電用ケーブルである 上記エアバネ11には、該エアバネの駆動及び
上記給電板12のキヤリアビーム3への接触圧調
整を行うためのエア回路が接続されており、該エ
ア回路は、第5図示のように圧縮エア源17に接
続した管18を、調整バルブ19及び圧力計20
を含むレギユレータ21、及び3方向切換バルブ
22を介して上記エアバネ11に接続した構成で
ある。
The configuration of the retractable power supply device 5 is as follows. One end of a bellows-shaped air spring 11 is mounted on a base plate 10 fixed to the upper surface of the processing tank side wall 2 as means for driving the power supply plate forward and backward, and the air spring expands and contracts when compressed air is supplied and discharged, and moves upward and backward. ,
A copper power supply plate 12 is horizontally attached to the upper end surface of this air spring 11. As shown in FIG. , 13 are constantly urged downward by coil springs 15, 15 interposed between the power supply plate 12 and spring receivers 14, 14 attached to the upper ends of the power supply plates 12. Therefore, now air spring 11
When compressed air is sent inside to expand and displace it upward, the power supply plate 12 is pushed by the air spring 11,
It rises along the guide columns 13, 13 while resisting the springs 15, 15, thereby reaching a position where it can come into contact with the carrier beam 3, and when the air inside the air spring 11 is discharged and contracted downward, the electric power is supplied. The plate 12 is pushed down by the springs 15, 15 and reaches a position where it is separated from the carrier beam 3. 16 is a power supply cable connected to the end of the power supply plate 12. An air circuit is connected to the air spring 11 to drive the air spring and adjust the contact pressure of the power supply plate 12 to the carrier beam 3. The air circuit includes a pipe 18 connected to a compressed air source 17 as shown in FIG.
The air spring 11 is connected to the air spring 11 via a regulator 21 including a three-way switching valve 22 and a three-way switching valve 22.

次に、給電板12とキヤリアビーム3との接触
部構造について説明する。第4図において、給電
板12の上面に枠形側壁23を突設して上面開放
の外槽24を形成すると共に、該外槽24の内側
に枠形側壁25を同心状に突設して上記外槽24
の内側面と適宜間隔をあけ且外槽24より高さの
低い内槽26を形成し、そして該内槽26の内側
の給電板12面に、平坦上面を有するやや隆起し
た給電板接触部27を形成してある。上記内槽2
6の側壁一側には該内槽内に水を供給する給水管
28が接続されると共に、側壁の他側上端部にオ
ーバーフロー用切込み29を設け、それにより給
水管28から内槽26内に供給された水が上記切
込み29から外槽24内にオーバーフローして内
槽26内の水位を一定に保つようにし、その結果
上記接続部27を常時水中に位置させるようにし
てある。30は給電板12の内、外槽26,24
間部分に設けた排水口、31は排水管である。
Next, the structure of the contact portion between the power supply plate 12 and the carrier beam 3 will be explained. In FIG. 4, a frame-shaped side wall 23 is protruded from the upper surface of the power supply plate 12 to form an open top outer tank 24, and a frame-shaped side wall 25 is concentrically protruded from the inside of the outer tank 24. The above outer tank 24
An inner tank 26 is formed with an appropriate distance from the inner surface of the tank and has a lower height than the outer tank 24, and a slightly raised power supply plate contact portion 27 with a flat upper surface is formed on the power supply plate 12 surface inside the inner tank 26. has been formed. Above inner tank 2
A water supply pipe 28 for supplying water into the inner tank is connected to one side of the side wall of 6, and an overflow notch 29 is provided at the upper end of the other side of the side wall. The supplied water overflows into the outer tank 24 through the notch 29 to keep the water level in the inner tank 26 constant, so that the connecting portion 27 is always located underwater. 30 is the inner and outer tanks 26 and 24 of the power supply plate 12
A drain port 31 provided in the middle is a drain pipe.

なお、キヤリアビーム3の上記給電板がわ接触
部27に対応する位置に、平坦下面を有するフロ
ツク状キヤリアビームがわ接触部32を突設して
ある。
A flock-like carrier beam contact portion 32 having a flat lower surface is protruded at a position corresponding to the power supply plate contact portion 27 of the carrier beam 3.

上記給電機構の作用を次に説明する。第1,2
図における一方のキヤリアビーム3に着色電解処
理用形材6…を、他方のキヤリアビーム3に白材
用形材をそれぞれ吊り下げ、両ビーム3,3を着
色電解処理1に搬送してそれぞれ受け台4,4…
に受支させ、各形材6…を処理液中に浸漬する。
The operation of the above power feeding mechanism will be explained next. 1st, 2nd
In the figure, a colored electrolytic treatment profile 6 is suspended from one carrier beam 3, and a white material profile is suspended from the other carrier beam 3, and both beams 3, 3 are transported to the colored electrolytic treatment 1 and received. Table 4, 4...
Each section 6 is immersed in the treatment liquid.

次に、着色電解処理用形材を吊つたキヤリアビ
ーム3について、給電装置5のエア回路における
切換バルブ22を操作してエア源17からエアを
エアバネ11内に圧送し、該エアバネ11を上方
へ進出させて給電板12の接触部27をキヤリア
ビーム3の接触部32に接触させる。この場合、
接触によるシヨツクがなく、したがつて接触面を
荒すことなく、また上記一対の接触部27,32
の接触圧を所望圧に調整変更する必要があるとき
は、上記エア回路において圧力計20に基づいて
調整バルブ19を操作する。次に、給水管28か
ら内槽26内に給水し、該水中に上記相接する一
対の接触部27,32を浸す。
Next, regarding the carrier beam 3 suspending the shaped material for colored electrolytic treatment, the switching valve 22 in the air circuit of the power supply device 5 is operated to forcefully feed air from the air source 17 into the air spring 11, and the air spring 11 is moved upward. The contact portion 27 of the power supply plate 12 is brought into contact with the contact portion 32 of the carrier beam 3 by advancing. in this case,
There is no shock due to contact, so the contact surface is not roughened, and the pair of contact portions 27, 32
When it is necessary to adjust the contact pressure to a desired pressure, the adjustment valve 19 is operated in the air circuit based on the pressure gauge 20. Next, water is supplied from the water supply pipe 28 into the inner tank 26, and the pair of contact portions 27, 32 are immersed in the water.

他方の白材用形材を吊つたキヤリアビーム3に
ついては、エア回路の切換バルブ22の操作によ
りエアバネ11内のエアを大気中に開き、それに
より給電板12をバネ15,15により降下さ
せ、その接触部27,32を離間させると共に、
接触部32を水中から離脱させる。
Regarding the carrier beam 3 on which the other white material profile is hung, the air in the air spring 11 is opened to the atmosphere by operating the switching valve 22 of the air circuit, and the power supply plate 12 is thereby lowered by the springs 15, 15. While separating the contact portions 27 and 32,
The contact portion 32 is removed from the water.

次に、各給電板12…に給電ケーブル16…に
より通電すると、着色用形材を吊つたキヤリアビ
ーム3については、相接する両接触部27,32
から該ビーム3に給電され、該ビーム3に吊つた
各形材6…に着色電解処理を施す。他方のキヤリ
アビーム3については、両接触部27,32が離
れて該ビーム3への給電を遮断し、それにより該
ビーム3に吊つた各形材6…に着色電解処理を行
わず、白材とする。
Next, when each power supply plate 12... is energized by the power supply cable 16..., the carrier beam 3 on which the coloring profile is suspended will be connected to both contact portions 27, 32 which are in contact with each other.
Electricity is supplied to the beam 3 from the beam 3, and each section 6 suspended from the beam 3 is subjected to a coloring electrolytic treatment. Regarding the other carrier beam 3, both the contact parts 27 and 32 are separated and the power supply to the beam 3 is cut off, so that the colored electrolytic treatment is not performed on each of the sections 6 suspended on the beam 3, and the white material is removed. shall be.

上記相接する両接触部27,32の通電におい
て、内槽26内の水が両接触部の接触面における
接触電気抵抗を減少させると共に接触部を冷却
し、有効な通電を確保する。また内槽26に給水
及びオーバーフローを継続することにより、一定
水温を保持できると共に、給水量が変化しても一
定水量を維持できる。
When the contact parts 27 and 32 are energized, the water in the inner tank 26 reduces the electrical contact resistance at the contact surfaces of the two contact parts and cools the contact parts, thereby ensuring effective energization. Further, by continuing to supply water and overflow to the inner tank 26, a constant water temperature can be maintained, and even if the amount of water supplied changes, a constant amount of water can be maintained.

本願発明における給電装置5の給電板進退駆動
手段には、上例のエアバネのほか、流体シリン
ダ、電磁石等により給電板を進退させる機構、あ
るいは給電板に固定したラツクをモータから回転
を受けるピニオンにより進退させる機構、その他
種々の機構が利用される。
In addition to the above-mentioned air spring, the means for driving the power supply plate forward and backward of the power supply device 5 in the present invention includes a mechanism for advancing and retracting the power supply plate using a fluid cylinder, an electromagnet, etc., or a pinion that rotates a rack fixed to the power supply plate from a motor. A mechanism for advancing and retracting, and various other mechanisms are used.

本発明の表面処理装置の給電機構によれば、キ
ヤリアビームに給電装置の給電板を接触せしめる
構成であるから、その接触によるシヨツクがな
く、したがつて接触面を荒して変形するようなこ
とがないので通電に支障を来たさず、構成も極め
て簡単であり、また1つの処理槽に複数のキヤリ
アビームを受支しつつ各キヤリアビームへ互に独
立に任意時間通電を行うことでき、従つて、多数
本の被処理材を吊るされた多数本のキヤリアビー
ムを一定の搬送ラインで順次各表面処理槽に送つ
て処理を行う表面処理ラインにおいて処理槽のキ
ヤリアビーム給電機構に本発明を使用すると、ユ
ーザーの要望により異る表面状態の少量の表面処
理製品を至急必要とする場合、それに必要な被処
理材を他の被処理材の処理ラインに繰り入れ、他
の被処理材と同様に順次処理槽に送り、そして所
定処理槽において必要被処理材に本発明給電機構
により他の被処理材と異る時間通電を行つて所期
の表面状態を得ることができ、それにより従来の
生産性の低下、作業のはん雑等の欠点を除くこと
ができるのである。
According to the power supply mechanism of the surface treatment apparatus of the present invention, since the power supply plate of the power supply device is brought into contact with the carrier beam, there is no shock caused by the contact, and therefore the contact surface is not roughened and deformed. Since there is no power supply, there is no problem with energization, and the configuration is extremely simple.Also, it is possible to support multiple carrier beams in one processing tank and energize each carrier beam independently for any time. Therefore, the present invention can be used in the carrier beam power supply mechanism of a processing tank in a surface treatment line in which a large number of carrier beams with a large number of workpieces suspended thereon are sequentially sent to each surface treatment tank through a fixed conveyance line for treatment. Then, if a small amount of surface-treated products with different surface conditions is urgently required according to the user's request, the necessary treated materials are transferred to the processing line for other treated materials and processed one after another in the same way as other treated materials. It is possible to obtain the desired surface condition by supplying electricity to the required material to be processed in a predetermined processing tank for a time different from that for other materials to be processed using the power supply mechanism of the present invention, thereby improving productivity compared to conventional methods. This eliminates drawbacks such as decreased performance and tedious work.

【図面の簡単な説明】[Brief explanation of the drawing]

図面は本願発明の実施例を示し、第1図は着色
電解処理槽の縦断正面図、第2図は同上縦断側面
図、第3図は第1図における給電装置部分の一部
切欠拡大図、第4図は給電板部分の拡大縦断面
図、第5図は第3図の―線一部切欠断面図及
びエア回路図である。 3…キヤリアビーム、4…受台、5…給電装
置、11…エアバネ、12…給電板。
The drawings show an embodiment of the present invention, and FIG. 1 is a longitudinal sectional front view of the colored electrolytic treatment tank, FIG. 2 is a longitudinal sectional side view of the same, and FIG. FIG. 4 is an enlarged vertical sectional view of the power supply plate portion, and FIG. 5 is a partially cutaway sectional view taken along the line -- in FIG. 3 and an air circuit diagram. 3... Carrier beam, 4... pedestal, 5... Power supply device, 11... Air spring, 12... Power supply plate.

Claims (1)

【特許請求の範囲】 1 被処理材を吊支させたキヤリアビームを支持
すべき位置に受台を設置すると共に、上記キヤリ
アビームが受台に受支されたときに該キヤリアビ
ームに給電し得る対向位置に給電装置を設置し、 上記給電装置は、上記キヤリアビームに接触し
て給電を行うべき給電板と、上記給電板を上記受
台に受支されたキヤリアビームに接離されるべく
進退させる進退駆動手段とを含む、 表面処理装置の給電機構。
[Scope of Claims] 1. A pedestal is installed at a position to support a carrier beam on which a material to be treated is suspended, and power can be supplied to the carrier beam when the carrier beam is supported on the pedestal. A power supply device is installed at an opposing position, and the power supply device moves a power supply plate that should contact the carrier beam to supply power, and moves the power supply plate back and forth so that it approaches and separates from the carrier beam supported on the pedestal. A power supply mechanism for a surface treatment apparatus, including a forward and backward drive means.
JP15339181A 1981-09-28 1981-09-28 Current supply mechanism of surface treating apparatus Granted JPS5855596A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15339181A JPS5855596A (en) 1981-09-28 1981-09-28 Current supply mechanism of surface treating apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15339181A JPS5855596A (en) 1981-09-28 1981-09-28 Current supply mechanism of surface treating apparatus

Publications (2)

Publication Number Publication Date
JPS5855596A JPS5855596A (en) 1983-04-01
JPS6127479B2 true JPS6127479B2 (en) 1986-06-25

Family

ID=15561456

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15339181A Granted JPS5855596A (en) 1981-09-28 1981-09-28 Current supply mechanism of surface treating apparatus

Country Status (1)

Country Link
JP (1) JPS5855596A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0275592U (en) * 1988-11-28 1990-06-08

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2515714Y2 (en) * 1989-08-21 1996-10-30 トリニティ工業株式会社 Batch type electrodeposition coating equipment

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0275592U (en) * 1988-11-28 1990-06-08

Also Published As

Publication number Publication date
JPS5855596A (en) 1983-04-01

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