JPS61273568A - Hologram transfer foil - Google Patents

Abstract

PURPOSE:To produce transfer foil for a hologram by an embossment molding system in high yield and to improve the moldability by providing a separation layer to the transfer foil and incorporating a specific amount of a vinyl acetate component and a specific amount of oxide as copolymerizing components of a resin layer. CONSTITUTION:A hologram formation resin layer 3 is formed on the substrate film 1 of the base part of hologram formation transfer foil across a separation varnish layer 2. Further, a surface relief type hologram stamper 4 is fixed on the upper surface plate 5 of a press machine and the substrate 1 where the resin layer 3 is formed is fixed on the lower surface plate 6 on the press machine. A heating mechanism necessary for embossing is provided to the surface plate 5 and the resin layer 3 is heated for a specific time and pressed between the surface plates 5 and 6. This resin layer 3 contains the 3-15wt% acetate component and 1-6wt% acid value compound as copolymerizing components to obtain vinyl chloride resin whose degree of polymerization is 400-800, producing the hologram transfer foil in high yield by the embossment forming system.

Description

[Detailed Description of the Invention] <Industrial Application Field> In the publishing and printing industry, holograms are used as covers and illustrations of books and magazines, as gifts and novelties, and as prevention for counterfeiting of securities, credit cards, and ID cards. is being used. Additionally, holograms are used in the fields of advertising and displays due to their iridescent decorative properties and unexpected three-dimensional effect.

The present invention relates to such holograms, and more particularly.

The present invention relates to a hologram transfer foil that is formed by molding a surface relief type hologram using an embossing molding technique and is intended to transfer the hologram to an object to be transferred.

<Conventional technology> The conventional method for replicating and mounting holograms is to perform emboss molding on a resin layer coated on a base material using a stamper on which a surface relief hologram is formed. A surface relief type hologram is formed, aluminum is vapor-deposited on the surface, a heat-sensitive adhesive is applied, and a hot stamp is used to transfer the hologram to an object to be transferred, and a hologram transfer foil is used for this purpose. This method reproduces holograms mechanically rather than optically, making it suitable for mass production at low cost.Since this method uses a transfer method different from the sticker format, it can be mounted in a way where the thickness of the hologram is hardly felt. Ru.

<Problems to be solved by the invention> With hologram transfer foil, the hologram is embossed in the first step, and then transferred by hot stamping in the second step. Seemingly contradictory performances are required, such as adhesion with resin and removability during transfer. With conventional transfer foils, embossing is possible, but the transferability is extremely poor, and although the peelability during transfer is good, the resin tends to peel off from the base material during embossing. Furthermore, some transfer foils that can be used for emboss transfer have poor hologram formability (reproduced images become dark) due to the increased temperature resistance of the resin.

Since hot stamping is performed, there is a limit to the thickness of the base material, and a thin base material of about 20 to 30 μm must be used.There is a problem that press unevenness tends to occur during embossing molding, and the quality of the appearance deteriorates.

Further, there were also problems such as whitening of the resin due to aluminum vapor deposition performed for use as a single reflection type hologram and weak adhesion between the aluminum and the resin.

Additionally, there was another problem in that the resin was damaged by the heat-sensitive adhesive used for hot stamping. Furthermore, there were other problems such as the resin being altered by the heat during hot stamping, blisters occurring during transfer, and many flakes.

<Means for Solving the Problems> The present invention was obtained as a result of various studies in view of the above circumstances.

That is, in the present invention, a hologram is formed on the surface of a resin layer provided on one side of a base film by heating and pressurizing with a surface relief type hologram stamper, and then a metal reflective layer and a heat-sensitive adhesive layer are sequentially formed by vapor deposition. In the stacked transfer foil, the resin structure consists of a two-layer structure consisting of a release varnish layer and a hologram-forming resin layer from the base film side, and the hologram-forming resin layer contains at least 3 to 15% by weight of a copolymer component. By using a vinyl chloride resin containing a vinyl acetate component and a compound having an acid value of 1 to 6 weight by weight, and having a degree of polymerization in the range of 400 to 800, a hologram with excellent moldability and transferability during embossing. It has been found that a transfer foil can be obtained.

The present invention will be explained in detail below using the drawings.

FIGS. 1 to 3 clearly illustrate the state of the hologram transfer foil according to the present invention when the surface is embossed with a leaf-type stamper.

That is, in FIG. 1, (1) indicates the base film, and (
2) shows a release varnish layer, (3) shows a hologram forming resin layer, (11 to (3) are the basic structure of the hologram transfer foil of the present invention, and (4) shows a surface relief type hologram stamper. , is fixed to the press upper surface plate (5).

The upper surface plate of the press has a built-in heating mechanism necessary for embossing. (6) shows the press lower surface plate, press surface plate +51. (The relief pattern of the hologram stamper is embossed on the hologram forming layer by heating and pressurizing the foil for a certain period of time using step 61.) Figure 2 shows the basic part of the hologram transfer foil after it has been embossed in this way. The resin layer (7) shows the state after the hologram is embossed on the hologram-forming resin layer (3).Furthermore, FIG. 6 is a conceptual cross-sectional view showing the overall image of the hologram transfer foil of the present invention. Resin layer after embossed hologram (7)
A vapor-deposited metal reflective layer is shown applied thereon, and (9) shows a heat-sensitive adhesive layer provided on top of said vapor-deposited metal reflective layer (8).

The base film +11 described in the present invention had heat resistance. Polyester film, polypropylene film, polycarbonate film, cellophane, etc. can be used, and those having a thickness of about 10 to 100 μm are preferable.

Among them, polyester film has high heat resistance, physical strength,
The best results are obtained in terms of smoothness and fewer fish eyes.

The release varnish layer (2) described in the present invention is provided to more effectively transfer the hologram-forming resin layer (3) to the transfer target, and is essential for increasing production efficiency. There are thermoplastic acrylic resins, chlorinated rubber resins, and resins that can be used in combination with these resins, such as nitrocellulose,
Acetylcellulose, acetate butyrate, polystyrene, vinyl chloride, salt-vinyl acetate resin, etc. can be used. Furthermore, melamine resin, alkyd resin, epoxy resin,
Thermosetting resins such as urea resins and acrylic resins can be used alone or in combination, and silicone resins, paraffin wax, reactive fluororesins, etc. can also be used.

As a resin suitable for the hologram-forming resin layer (3) described in the present invention, very good results can be obtained by using a certain type of vinyl chloride resin. That is, such a hologram-forming resin layer contains at least 3 as copolymer components.
By using a vinyl chloride resin containing ~15% by weight of vinyl acetate component and a compound having an acid value of 1~6% by weight, and having a degree of polymerization in the range of 400~800, it has good embossing moldability and eliminates uneven printing. It is difficult to produce a bright reproduced image, and in addition, it has good adhesion to the base material during embossing molding (,
It was discovered that the adhesion to the metal reflective layer was good and the peelability when transferring to a transfer object was extremely good.

Among them, by using maleic acid as a compound having an acid value, particularly good results can be obtained in adhesion to a metal reflective layer such as aluminum.

As a method for coating such a hologram-forming resin layer, a resin in the form of a paint may be coated by a method such as roll coating or blade coating, and dried to form a film thickness of 0.5 to 5 μm.

The hologram-forming resin layer thus obtained adheres appropriately to the base film coated with the release varnish layer, has excellent moldability when heated and pressurized during embossing, and has nickel and gold on the surface. It does not adhere to stampers plated with chrome, etc., and also exhibits good adhesion to metal reflective layers, and the film cuts well. Furthermore, it enables reliable transfer without peeling defects of the metal reflective layer during hot stamping, transfer unevenness, flakes, or blisters, and improves the reliability of the vapor deposition process.

There is no visible quality deterioration such as cracking, whitening, or destruction of the hologram pattern due to shrinkage caused by the heat during hot stamping.

Embossing is performed by superimposing the relief hologram pattern of the hologram forming resin layer (3) and the stamper (4) using a press machine (upper surface plate (5) and lower surface plate (6)).
After heating and pressurizing under conditions of 0°C to 150°C.

By cooling, a hologram pattern is formed on the surface of the resin layer (3).

The metal reflective layer (8) described in the present invention, that is, the metal vapor deposition layer, is preferably a metal with a high surface reflectance, and specifically, aluminum, gold, silver, copper, etc., and alloys containing these metals can be used. It can be provided by a conventional method such as a vacuum evaporation method, a sputtering method, or an ion blating method.The thickness is 100A.
A range of 10.00OA to 10.00OA is appropriate.

The heat-sensitive adhesive layer (9) described in the present invention includes polyester resin, acrylic resin, vinyl chloride resin, polyamide resin, polyvinyl acetate, rubber resin, ethylene-vinyl acetate copolymer resin, vinyl chloride-vinyl acetate copolymer resin, etc. Any thermoplastic resin can be used, and any resin is selected in consideration of its adhesion to the metal reflective layer and the material to be transferred, and the resin is made into a face using an appropriate solvent, and then coated with gravure coating or roll coating. .

The coating is formed by coating using a known method such as a plate coating method, and the film thickness is preferably from 1 μm to 20 μm.

Figure 4 shows the hologram transfer foil obtained in this way.

It is easy to understand the state when transferring to any transfer material aω such as paper, PVC sheet, polyester sheet, etc. 11) From the side, heat and pressurize (
After adhering the heat-sensitive adhesive layer (9) to the object αω by hot stamping, the base film (1) is peeled off to complete the transfer. When peeling off the base film (1), the following two cases can be considered depending on the type of resin used for the release varnish layer (21).
As shown in Figure (A), the release varnish layer (2) peels off while adhering to the base film side during peeling, and as shown in Figure (B), the release varnish layer (2) peels off the hologram-forming resin layer (2) during peeling.
3) There is a possibility that the adhesive may peel off while remaining adhered to the side. Specifically, when a resin with good adhesion is used for the base film, such as a thermoplastic acrylic resin or a chlorinated rubber polyester film, as the resin used for the release varnish layer, the former release state shown in (a) will occur. When using thermosetting melamine resin, alkyd resin, epoxy resin, urea resin, etc. alone or in combination, or when using silicone resin, paraffin wax, reactive fluororesin, etc.,
The adhesion force to the base film such as polyester film is low, and it easily peels off from the base film when peeling.
The peeling state of the latter is shown in .

In either case, as mentioned above, the release varnish layer (
2) is provided so that the hologram forming resin layer (31) can be more effectively transferred to the transfer target (IG).

The coating amount may be small, and especially in the case of a structure in which the release varnish layer remains on the hologram-forming resin layer as shown in (1), it is not preferable that the coating amount be so large as to adversely affect the hologram.

As described above, by using the hologram transfer foil described in the present invention, it was possible to solve the problems that conventional hologram transfer foils had.

The present invention will be explained in more detail below using examples.

<Example> (Example 1) The following composition (a
Coat with a roll coater using a t-face, and coat with a coating of about 0.
In addition to providing a 5 μm peelable resin layer, the following composition fb
A resin layer of approximately 1 μm was provided at 60'C,
After curing for 72 hours, the resin layer and the hologram forming surface of the stamper were overlapped using a press machine.

Embossing was performed at 130° C. under heating and pressure conditions of 40 to 51/cy+1 to form a hologram on the resin surface.

Next, aluminum was vapor-deposited to a thickness of about 50 OA on the surface of the resin layer, and a face of the following composition (cl) was coated with a roll coater.
A hologram transfer foil was obtained by applying the adhesive to form a heat-sensitive adhesive layer of about 3 μm.

(al varnish (bl varnish (cl varnish 1 tlO,0)) Next, transfer the obtained transfer foil to 157 g/d art paper [120
By hot pressing under the conditions of ℃, 0.5 seconds,
When the hologram was transferred, it turned white.

A faithfully reproduced holographic transfer was obtained without defects such as cracks and blisters.

Furthermore, in embossing the resin layer, there was no problem of adhesion to the stamper, and the processability was excellent.

(Example 2) The following composition (a
Apply with a roll coater using a T face.

In addition to providing a release resin layer of approximately 0.5 μm, the following (e
A resin layer of approximately 1°5 μm was provided using a face using the various vinyl chloride/vinyl acetate copolymer resins shown in 1.

After curing under the same conditions at 60°C for 72 hours.

The resin layer and the hologram forming surface of the stamper were placed on top of each other using a press machine, and embossing was performed at 130°C.

A hologram was formed on the resin surface by heating and pressurizing the resin at a temperature of 40 mm and 5'/d. Next, as in Example 1, aluminum was vapor-deposited to a thickness of about 50 OA on the surface of the resin layer, and a face of the following composition (fl) was applied using a roll coater.
A heat-sensitive adhesive layer of approximately 3 μm was formed to obtain various hologram transfer foils.

Next, the thus obtained transfer foil was heated and pressed onto 157 g/m art paper at 120' (:, 0.5 seconds) to compare the transfer suitability.

As a result, as shown in the results column (when using a vinyl chloride resin in which the copolymerization ratio (tt%) of the vinyl acetate component is outside the range of 5 to 15 weight percent and the degree of polymerization is outside the range of 400 to 800) In both cases, unsatisfactory results were obtained in terms of embossing suitability, transferability, and image reproducibility.In addition, when a compound having an acid value such as maleic acid was contained as a copolymer component by 1 to 6% by weight, , the adhesion between the aluminum vapor deposited layer and the hologram forming layer was poor (unsatisfactory results were obtained).

[DL fest (peel fest) 100.0// LEL varnish ■～■ (hologram pattern forming resin layer)*
The presence or absence of vinyl acetate component and maleic acid in the vinyl chloride resin component and the average molecular weight of the vinyl chloride resin (fl varnish (
Heat-sensitive adhesive layer) 100.0// <Effects of the Invention> The hologram transfer foil according to the present invention is provided with a release layer and has a hologram forming layer of I11*f31.

1 surface relief by using a vinyl chloride resin containing as a copolymerization component at least 2 to 15% by weight of a vinyl acetate component and a compound having 1 to 6% by weight oxidation and having a degree of polymerization in the range of 400 to 800. It has become possible to produce high-yield products using the emboss molding method using holograms as transfer foil, and improved moldability allows for bright reproduced images, and metal vapor deposition properties.

Improvements in transferability, etc. using the Honto Stamp have been achieved.

In view of the above, the present invention is effective in improving the quality, processability, and economic efficiency of hologram transfer foils, and is useful for books, book covers, illustrations, and gifts.

It can be said that the present invention is industrially effective, as it facilitates the use of hologram transfer foil in novelty packages and the like, and prevents counterfeiting.

[Brief explanation of drawings]

The drawings show embodiments of the present invention, and Figures 1, 2, and 3 are explanatory diagrams in cross section showing the state in which the hologram transfer foil is embossed with a relief type stamper on one surface, and Figure 4
The figure is an explanatory diagram showing a cross-sectional view showing a state in which the peeling varnish layer is difficult to peel. (1) Base film (2) Release varnish layer (3) Hologram forming resin layer (4) Surface relief hologram stamper (5)
...Press machine upper surface plate (6) ... Press machine lower surface plate (7) ... Resin layer after hologram embossing (8) ...
・Metal reflective layer (9)...Heat-sensitive adhesive layer aα...Transferred object

Claims (1)

[Claims] 1) After forming a hologram on the surface of the resin layer provided on one side of the base film by heating and pressurizing with a surface relief type hologram stamper, a metal reflective layer and a heat-sensitive adhesive layer are formed by vapor deposition. In the transfer foil formed by sequentially stacking the above, the resin layer has a two-layer structure consisting of a release varnish layer and a hologram-forming resin layer from the base film side, and the hologram-forming resin layer contains at least 2 to A hologram transfer foil characterized in that it is a vinyl chloride resin containing 15% by weight of a vinyl acetate component and a compound having an acid value of 1 to 6% by weight, and having a degree of polymerization in the range of 400 to 800. 2) The hologram transfer foil according to claim 1, wherein the compound having an acid value is maleic acid. 3) The hologram transfer foil according to claims 1) and 2), wherein the resin used for the release varnish layer is one of thermoplastic acrylic resin or chlorinated rubber resin, and a mixture thereof. . 4) The hologram transfer foil according to claims 1) and 2), wherein the resin used for the release varnish layer is a thermosetting resin. 5) The hologram transfer foil according to claims 1), 2), 3), and 4), wherein the base film is a polyester film.