JPS6127335U - Reactive sputter etching equipment - Google Patents
Reactive sputter etching equipmentInfo
- Publication number
- JPS6127335U JPS6127335U JP11087184U JP11087184U JPS6127335U JP S6127335 U JPS6127335 U JP S6127335U JP 11087184 U JP11087184 U JP 11087184U JP 11087184 U JP11087184 U JP 11087184U JP S6127335 U JPS6127335 U JP S6127335U
- Authority
- JP
- Japan
- Prior art keywords
- sputter etching
- reactive sputter
- etching equipment
- reactive
- sample stand
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Physical Vapour Deposition (AREA)
- ing And Chemical Polishing (AREA)
- Drying Of Semiconductors (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は本考案の実施例を示す断面図、第２図は乎面区
、第３図はエッチング装置の断面図、第４図は従来装置
の電界モデル図、第５図は従来と本考案とのエッチング
状態を示す説明図である。
４・・・試料台、９・・・補助基板。Fig. 1 is a sectional view showing an embodiment of the present invention, Fig. 2 is a cross-sectional view of the etching device, Fig. 3 is a sectional view of the etching device, Fig. 4 is an electric field model diagram of the conventional device, and Fig. 5 is the conventional and the etching device. It is an explanatory view showing an etching state with the invention. 4... Sample stand, 9... Auxiliary board.
Claims (1)
パツターエッチング装置において、スパツターエッチン
グされる半導体ウエノ＼一の外周を取り囲むリング状補
助基板を前記試料台に設けたことを特徴とする反応性ス
パツターエッチング装置。A reactive sputter etching apparatus equipped with a sample stand on which a plurality of semiconductor wafers are lined up, characterized in that the sample stand is provided with a ring-shaped auxiliary substrate that surrounds the outer periphery of the semiconductor wafer to be sputter etched. Reactive sputter etching equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11087184U JPS6127335U (en) | 1984-07-21 | 1984-07-21 | Reactive sputter etching equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11087184U JPS6127335U (en) | 1984-07-21 | 1984-07-21 | Reactive sputter etching equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6127335U true JPS6127335U (en) | 1986-02-18 |
Family
ID=30669988
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11087184U Pending JPS6127335U (en) | 1984-07-21 | 1984-07-21 | Reactive sputter etching equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6127335U (en) |
-
1984
- 1984-07-21 JP JP11087184U patent/JPS6127335U/en active Pending
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