JPS6127212A - 合成樹脂成形用型 - Google Patents
合成樹脂成形用型Info
- Publication number
- JPS6127212A JPS6127212A JP14859084A JP14859084A JPS6127212A JP S6127212 A JPS6127212 A JP S6127212A JP 14859084 A JP14859084 A JP 14859084A JP 14859084 A JP14859084 A JP 14859084A JP S6127212 A JPS6127212 A JP S6127212A
- Authority
- JP
- Japan
- Prior art keywords
- mold
- synthetic resin
- film
- ethylene
- mold release
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920003002 synthetic resin Polymers 0.000 title claims abstract description 23
- 239000000057 synthetic resin Substances 0.000 title claims abstract description 23
- 238000000034 method Methods 0.000 claims abstract description 10
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims abstract 2
- 229910052731 fluorine Inorganic materials 0.000 claims abstract 2
- 239000011737 fluorine Substances 0.000 claims abstract 2
- 229920000098 polyolefin Polymers 0.000 claims abstract 2
- 238000000465 moulding Methods 0.000 claims description 13
- 238000006116 polymerization reaction Methods 0.000 claims description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
- 239000011521 glass Substances 0.000 abstract description 10
- -1 hexamethylene disiloxane Chemical class 0.000 abstract description 6
- 239000000463 material Substances 0.000 abstract description 6
- 239000000178 monomer Substances 0.000 abstract description 4
- PYVHTIWHNXTVPF-UHFFFAOYSA-N F.F.F.F.C=C Chemical compound F.F.F.F.C=C PYVHTIWHNXTVPF-UHFFFAOYSA-N 0.000 abstract description 3
- 150000002894 organic compounds Chemical class 0.000 abstract description 3
- YWAKXRMUMFPDSH-UHFFFAOYSA-N pentene Chemical compound CCCC=C YWAKXRMUMFPDSH-UHFFFAOYSA-N 0.000 abstract description 3
- WWUVJRULCWHUSA-UHFFFAOYSA-N 2-methyl-1-pentene Chemical compound CCCC(C)=C WWUVJRULCWHUSA-UHFFFAOYSA-N 0.000 abstract description 2
- 239000000919 ceramic Substances 0.000 abstract description 2
- 239000002184 metal Substances 0.000 abstract description 2
- UHUUYVZLXJHWDV-UHFFFAOYSA-N trimethyl(methylsilyloxy)silane Chemical compound C[SiH2]O[Si](C)(C)C UHUUYVZLXJHWDV-UHFFFAOYSA-N 0.000 abstract description 2
- AKFJJVSUDWPDIH-UHFFFAOYSA-N CC=C.C=CCl.F.F.F.F.F.F.F.F.F Chemical compound CC=C.C=CCl.F.F.F.F.F.F.F.F.F AKFJJVSUDWPDIH-UHFFFAOYSA-N 0.000 abstract 1
- 239000003795 chemical substances by application Substances 0.000 abstract 1
- 229920001577 copolymer Polymers 0.000 abstract 1
- 238000007334 copolymerization reaction Methods 0.000 abstract 1
- 238000004132 cross linking Methods 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 239000010409 thin film Substances 0.000 description 9
- 239000010408 film Substances 0.000 description 7
- 230000003287 optical effect Effects 0.000 description 7
- 239000003822 epoxy resin Substances 0.000 description 5
- 239000006082 mold release agent Substances 0.000 description 5
- 229920000647 polyepoxide Polymers 0.000 description 5
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920006337 unsaturated polyester resin Polymers 0.000 description 3
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 2
- 239000005977 Ethylene Substances 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 239000003599 detergent Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- UQEAIHBTYFGYIE-UHFFFAOYSA-N hexamethyldisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)C UQEAIHBTYFGYIE-UHFFFAOYSA-N 0.000 description 2
- 230000002209 hydrophobic effect Effects 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 238000001020 plasma etching Methods 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- BQCIDUSAKPWEOX-UHFFFAOYSA-N 1,1-Difluoroethene Chemical compound FC(F)=C BQCIDUSAKPWEOX-UHFFFAOYSA-N 0.000 description 1
- JMMZCWZIJXAGKW-UHFFFAOYSA-N 2-methylpent-2-ene Chemical compound CCC=C(C)C JMMZCWZIJXAGKW-UHFFFAOYSA-N 0.000 description 1
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- HCDGVLDPFQMKDK-UHFFFAOYSA-N hexafluoropropylene Chemical compound FC(F)=C(F)C(F)(F)F HCDGVLDPFQMKDK-UHFFFAOYSA-N 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 229920005573 silicon-containing polymer Polymers 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Chemical Vapour Deposition (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14859084A JPS6127212A (ja) | 1984-07-19 | 1984-07-19 | 合成樹脂成形用型 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14859084A JPS6127212A (ja) | 1984-07-19 | 1984-07-19 | 合成樹脂成形用型 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6127212A true JPS6127212A (ja) | 1986-02-06 |
| JPH0430891B2 JPH0430891B2 (enrdf_load_stackoverflow) | 1992-05-25 |
Family
ID=15456149
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14859084A Granted JPS6127212A (ja) | 1984-07-19 | 1984-07-19 | 合成樹脂成形用型 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6127212A (enrdf_load_stackoverflow) |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0841140A3 (en) * | 1996-11-12 | 2000-02-23 | Bae Hyeock Chun | Method of enhancing releasing effect of mould using low temperature plasma processes |
| WO2000044544A1 (fr) * | 1999-01-29 | 2000-08-03 | Daikin Industries, Ltd. | Moulages en elastomere contenant du fluor et procede de preparation associe |
| WO2002005972A3 (de) * | 2000-07-17 | 2002-09-26 | Acmos Chemie Gmbh & Co | Verfahren zur herstellung einer permanenten entformungsschicht durch plasmapolymerisation auf der oberfläche eines formteilwerkzeugs |
| JP2010253775A (ja) * | 2009-04-23 | 2010-11-11 | Towa Corp | 成形装置及び成形方法 |
| JP2010537867A (ja) * | 2007-09-06 | 2010-12-09 | スリーエム イノベイティブ プロパティズ カンパニー | 型を形成する方法及びかかる型を使用して物品を成形する方法 |
| US20170225364A1 (en) * | 2015-07-30 | 2017-08-10 | Tanazawa Hakkosha Co., Ltd. | Resin molding mold |
| US11130701B2 (en) | 2016-09-30 | 2021-09-28 | Corning Incorporated | Apparatuses and methods for laser processing transparent workpieces using non-axisymmetric beam spots |
| US11148225B2 (en) | 2013-12-17 | 2021-10-19 | Corning Incorporated | Method for rapid laser drilling of holes in glass and products made therefrom |
| US11542190B2 (en) | 2016-10-24 | 2023-01-03 | Corning Incorporated | Substrate processing station for laser-based machining of sheet-like glass substrates |
| US11556039B2 (en) | 2013-12-17 | 2023-01-17 | Corning Incorporated | Electrochromic coated glass articles and methods for laser processing the same |
| US11648623B2 (en) | 2014-07-14 | 2023-05-16 | Corning Incorporated | Systems and methods for processing transparent materials using adjustable laser beam focal lines |
| US11697178B2 (en) | 2014-07-08 | 2023-07-11 | Corning Incorporated | Methods and apparatuses for laser processing materials |
| US11713271B2 (en) | 2013-03-21 | 2023-08-01 | Corning Laser Technologies GmbH | Device and method for cutting out contours from planar substrates by means of laser |
| US11773004B2 (en) | 2015-03-24 | 2023-10-03 | Corning Incorporated | Laser cutting and processing of display glass compositions |
-
1984
- 1984-07-19 JP JP14859084A patent/JPS6127212A/ja active Granted
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0841140A3 (en) * | 1996-11-12 | 2000-02-23 | Bae Hyeock Chun | Method of enhancing releasing effect of mould using low temperature plasma processes |
| WO2000044544A1 (fr) * | 1999-01-29 | 2000-08-03 | Daikin Industries, Ltd. | Moulages en elastomere contenant du fluor et procede de preparation associe |
| WO2002005972A3 (de) * | 2000-07-17 | 2002-09-26 | Acmos Chemie Gmbh & Co | Verfahren zur herstellung einer permanenten entformungsschicht durch plasmapolymerisation auf der oberfläche eines formteilwerkzeugs |
| US6949272B2 (en) | 2000-07-17 | 2005-09-27 | Acmos Chemie Gmbh & Co. | Method for producing a permanent demoulding layer by plasma polymerization on the surface of a moulded-part tool, a moulded-part tool produced by said method and the use thereof |
| JP2010537867A (ja) * | 2007-09-06 | 2010-12-09 | スリーエム イノベイティブ プロパティズ カンパニー | 型を形成する方法及びかかる型を使用して物品を成形する方法 |
| JP2010253775A (ja) * | 2009-04-23 | 2010-11-11 | Towa Corp | 成形装置及び成形方法 |
| US11713271B2 (en) | 2013-03-21 | 2023-08-01 | Corning Laser Technologies GmbH | Device and method for cutting out contours from planar substrates by means of laser |
| US11556039B2 (en) | 2013-12-17 | 2023-01-17 | Corning Incorporated | Electrochromic coated glass articles and methods for laser processing the same |
| US11148225B2 (en) | 2013-12-17 | 2021-10-19 | Corning Incorporated | Method for rapid laser drilling of holes in glass and products made therefrom |
| US11697178B2 (en) | 2014-07-08 | 2023-07-11 | Corning Incorporated | Methods and apparatuses for laser processing materials |
| US11648623B2 (en) | 2014-07-14 | 2023-05-16 | Corning Incorporated | Systems and methods for processing transparent materials using adjustable laser beam focal lines |
| US11773004B2 (en) | 2015-03-24 | 2023-10-03 | Corning Incorporated | Laser cutting and processing of display glass compositions |
| US10773426B2 (en) * | 2015-07-30 | 2020-09-15 | Tanazawa Hakkosha Co., Ltd. | Resin molding mold |
| US20170225364A1 (en) * | 2015-07-30 | 2017-08-10 | Tanazawa Hakkosha Co., Ltd. | Resin molding mold |
| US11130701B2 (en) | 2016-09-30 | 2021-09-28 | Corning Incorporated | Apparatuses and methods for laser processing transparent workpieces using non-axisymmetric beam spots |
| US11542190B2 (en) | 2016-10-24 | 2023-01-03 | Corning Incorporated | Substrate processing station for laser-based machining of sheet-like glass substrates |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0430891B2 (enrdf_load_stackoverflow) | 1992-05-25 |
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