JPS61271862A - ヒ−トパイプ式半導体冷却器 - Google Patents

ヒ−トパイプ式半導体冷却器

Info

Publication number
JPS61271862A
JPS61271862A JP60113220A JP11322085A JPS61271862A JP S61271862 A JPS61271862 A JP S61271862A JP 60113220 A JP60113220 A JP 60113220A JP 11322085 A JP11322085 A JP 11322085A JP S61271862 A JPS61271862 A JP S61271862A
Authority
JP
Japan
Prior art keywords
block
heat pipe
laminated
laminated block
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60113220A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0337311B2 (enExample
Inventor
Takashi Murase
孝志 村瀬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Priority to JP60113220A priority Critical patent/JPS61271862A/ja
Publication of JPS61271862A publication Critical patent/JPS61271862A/ja
Publication of JPH0337311B2 publication Critical patent/JPH0337311B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP60113220A 1985-05-28 1985-05-28 ヒ−トパイプ式半導体冷却器 Granted JPS61271862A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60113220A JPS61271862A (ja) 1985-05-28 1985-05-28 ヒ−トパイプ式半導体冷却器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60113220A JPS61271862A (ja) 1985-05-28 1985-05-28 ヒ−トパイプ式半導体冷却器

Publications (2)

Publication Number Publication Date
JPS61271862A true JPS61271862A (ja) 1986-12-02
JPH0337311B2 JPH0337311B2 (enExample) 1991-06-05

Family

ID=14606615

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60113220A Granted JPS61271862A (ja) 1985-05-28 1985-05-28 ヒ−トパイプ式半導体冷却器

Country Status (1)

Country Link
JP (1) JPS61271862A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04343254A (ja) * 1991-05-20 1992-11-30 Mitsubishi Cable Ind Ltd ヒートパイプ式冷却器
CN112091532A (zh) * 2020-07-31 2020-12-18 中国电子科技集团公司第十四研究所 一种内置热管的导热板和制备方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04343254A (ja) * 1991-05-20 1992-11-30 Mitsubishi Cable Ind Ltd ヒートパイプ式冷却器
CN112091532A (zh) * 2020-07-31 2020-12-18 中国电子科技集团公司第十四研究所 一种内置热管的导热板和制备方法

Also Published As

Publication number Publication date
JPH0337311B2 (enExample) 1991-06-05

Similar Documents

Publication Publication Date Title
CN100447521C (zh) 热管式散热器及其制造方法
KR950004846B1 (ko) 방열기 및 그 제작방법
US6637109B2 (en) Method for manufacturing a heat sink
EP0338704A1 (en) Heat exchanger core
JP2003336976A (ja) ヒートシンクおよびその実装構造
KR930005490B1 (ko) 히트 파이프식 반도체 냉각기의 제조방법
CN107210276B (zh) 传热片
US6861293B2 (en) Stacked fin heat sink and method of making
JPS61271862A (ja) ヒ−トパイプ式半導体冷却器
JPH1117080A (ja) 放熱器
JPS57122551A (en) Manufacture of heat sink for semiconductor device
JP2001102786A (ja) 電子部品の放熱器およびその製造方法
JP2008294128A (ja) 液冷式冷却器とその製造方法
JPH037956Y2 (enExample)
JPS60257157A (ja) 放熱器
JPH04225791A (ja) ヒートパイプ式放熱器およびその製造方法
JPS5846660A (ja) ヒ−トシンクの製造法
JPH02166798A (ja) 通信機ケースの放熱構造
JPS6123349A (ja) 放熱器
JP2001324286A (ja) プレート型ヒートパイプ及びその製造方法
JPH1117078A (ja) 放熱器
JPS6347741Y2 (enExample)
JPS6322681Y2 (enExample)
JPH0727159U (ja) ヒートシンク用構成単位体
JPS6126787Y2 (enExample)