JPS6127091A - High frequency heater - Google Patents

High frequency heater

Info

Publication number
JPS6127091A
JPS6127091A JP14785384A JP14785384A JPS6127091A JP S6127091 A JPS6127091 A JP S6127091A JP 14785384 A JP14785384 A JP 14785384A JP 14785384 A JP14785384 A JP 14785384A JP S6127091 A JPS6127091 A JP S6127091A
Authority
JP
Japan
Prior art keywords
frequency
solid
heating chamber
frequency heating
frequency generator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14785384A
Other languages
Japanese (ja)
Inventor
等隆 信江
楠木 慈
公明 山口
松本 孝広
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP14785384A priority Critical patent/JPS6127091A/en
Publication of JPS6127091A publication Critical patent/JPS6127091A/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 産業上の利用分野 本発明は、食品などを高周波電波を用いて、高周波加熱
調理する高周波加熱装置に関する。
DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a high-frequency heating device for high-frequency heating and cooking of foods and the like using high-frequency radio waves.

従来例の構成とその問題点 従来のこの種の加熱装置は、そのほとんどが高周波加熱
熱源にマグネトロンを用いていた。このマグネトロンは
、駆動電源に数千ボルトの高圧を必要とするため、高圧
発生用の大型で重量のある昇圧トランスや高圧コンデン
サなどの高圧部品が必要であ石、装置の軽量化・小型化
をはかる上で大きなネックであった。
Construction of conventional examples and their problems Most conventional heating devices of this type have used a magnetron as a high-frequency heating heat source. This magnetron requires a high voltage of several thousand volts as a drive power source, so it requires high-voltage parts such as a large and heavy step-up transformer and high-voltage capacitor to generate high voltage. This was a major bottleneck in measurement.

また、マグネトロンは、電子管式発振器であるため、そ
の寿命は、数千時間が一般的な目安であった。
Furthermore, since the magnetron is an electron tube type oscillator, its lifespan was generally estimated to be several thousand hours.

これに対して、近年の著しい半導体業界の進歩に伴い、
マイクロ波領域においても、半導体素子1石が取扱うこ
とができる電力量は飛躍的に進歩し、数百の素子を用い
て、高周波加熱熱源を構成することが可能になった。
In contrast, with the remarkable progress of the semiconductor industry in recent years,
Even in the microwave region, the amount of power that a single semiconductor element can handle has progressed dramatically, and it has become possible to construct a high-frequency heating heat source using hundreds of elements.

この半導体素子は、100v以下の低電圧駆動が可能な
こと、半永久的な寿命を持っていることなど従来のマグ
ネトロンでは得られない特長を持っている反面、熱的に
弱い欠点を有する。
Although this semiconductor element has features not available in conventional magnetrons, such as being able to be driven at a low voltage of 100 V or less and having a semi-permanent life, it has the disadvantage of being thermally weak.

高周波加熱熱源を固体化するためには、その出力に数百
ワットの絶対ペワーを発生させることに加えて、この出
力を得るだめに生ずる損失熱を効率よく放熱して半導体
素子の熱的破壊を未然に防止する機構設計開発が重要な
課題である。
In order to solidify a high-frequency heating heat source, in addition to generating an absolute power of several hundred watts, it is also necessary to efficiently dissipate the heat loss that occurs in order to obtain this output to prevent thermal destruction of semiconductor elements. Developing a mechanism design to prevent this from happening is an important issue.

発明の目的 本発明は、この点に鑑みてなされたものであり、高周波
加熱装置に搭載する固体化された高周波加熱熱源の放熱
機構に工夫を凝らし、コンノくクトで信頼性の高い高周
波加熱装置を提供するものである。
Purpose of the Invention The present invention has been made in view of this point, and has devised a heat dissipation mechanism of a solidified high-frequency heating heat source installed in a high-frequency heating device, thereby providing a compact and highly reliable high-frequency heating device. It provides:

発明の構成 上記目的に対し、本発明は、高周波加熱熱源である固体
高周波発生部に装着した放熱手段であるところの放熱フ
ィン全域;に、直接冷却風を吹きつける様に放熱フィン
と冷却ファンを配置構成して達成している。
Structure of the Invention To achieve the above-mentioned object, the present invention provides a method of installing a heat dissipation fin and a cooling fan so as to directly blow cooling air over the entire area of the heat dissipation fin, which is a heat dissipation means attached to a solid high frequency generation unit that is a high frequency heating heat source. This has been achieved by configuring the layout.

実施例の説明 以下、不発′男を図面を参照して説明す地。Description of examples Below, I will explain the misfired man with reference to the drawings.

第1図は、本発明の一実施例を示す高周波加熱装置の正
面断面図である。
FIG. 1 is a front sectional view of a high-frequency heating device showing an embodiment of the present invention.

固体高周波発生部1が発生する高周波大・ぐワーは、同
軸伝送線路2を伝送して、被加熱物(図示していない)
を収容する加熱室3内の上壁面4の所定位置に配設され
た給電アンテナ5により加熱室へ給電され、被加熱物を
高周波加熱するものである。
A large high-frequency wave generated by the solid-state high-frequency generator 1 is transmitted through a coaxial transmission line 2 to a heated object (not shown).
Electric power is supplied to the heating chamber by a power feeding antenna 5 disposed at a predetermined position on the upper wall surface 4 of the heating chamber 3 housing the heating chamber 3, and the object to be heated is heated by high frequency.

ここで固体高周波発生部1の下部には、固体高周波発生
部の構成要素部品が生ずる損失熱が伝熱される放熱フィ
ン6が装着されている。
Here, a radiation fin 6 is attached to the lower part of the solid-state high-frequency generator 1 to which heat loss generated by the component parts of the solid-state high-frequency generator is transferred.

この放熱フィンは、加熱室上壁面4に略平行に配設され
、加熱室上壁面と本体ボディ7とがつくる空間に固体高
周波発生部を配設させている。一方、放熱フィンは、加
熱室上壁面延長部より下方にそのフィン部が配置されて
いる。またフィン部下方にはこの放熱フィン全域に直接
冷却風を吹きつけるように配置された冷却ファン8が設
けられている。零却風の吸排気路を矢印で示している。
The radiation fins are disposed substantially parallel to the upper wall surface 4 of the heating chamber, and a solid high frequency generating section is disposed in the space created by the upper wall surface of the heating chamber and the main body 7. On the other hand, the fin portion of the radiation fin is disposed below the extension of the upper wall of the heating chamber. Further, a cooling fan 8 is provided below the fins so as to blow cooling air directly over the entire area of the radiation fins. The arrows indicate the intake and exhaust passages for the overflow air.

第2図は、第」図の右側面断面図である。第1図と同一
部品は同一番号で示す。また冷却風の吸排気路を矢印で
示す。
FIG. 2 is a right side sectional view of FIG. Parts that are the same as in FIG. 1 are designated by the same numbers. In addition, the cooling air intake and exhaust passages are indicated by arrows.

本発明の一実施例は、冷却ファンとしてプロペラファン
を2台並列配置して、放熱フィン6全域に冷却風を吹き
つける構成としている。
An embodiment of the present invention has a configuration in which two propeller fans are arranged in parallel as cooling fans to blow cooling air over the entire area of the radiation fins 6.

また、吸排気路は、冷却ファンを固定する固定板9を利
用して分離させている。そして、この吸気路に固体高周
波発生部1の駆動電源トランス10を配置している。1
1は、加熱室内に被加熱物を出入れする時((用いる加
熱室の一壁面を構成する出入れ扉である。
Further, the intake and exhaust passages are separated using a fixing plate 9 that fixes the cooling fan. A drive power transformer 10 of the solid-state high frequency generator 1 is arranged in this intake passage. 1
Reference numeral 1 denotes an access door that constitutes one wall of the heating chamber used when the object to be heated is taken in and out of the heating chamber.

第3図は、本発明の他の実施例を示す高周波加熱装置の
側面断面図である。
FIG. 3 is a side sectional view of a high frequency heating device showing another embodiment of the present invention.

第2図と同一部品は同一番号で示す。Parts that are the same as in FIG. 2 are designated by the same numbers.

この構成にお1/′1ては、クロスフローファン12を
冷却ファンとして用いている。
In this configuration, a cross flow fan 12 is used as a cooling fan.

クロスフローファンを放熱フィンの冷却に用いる場合、
放熱フィンの側面方向から冷却風を吹きつける構成が一
般的である。しかし、高周波加熱熱源のような大パワー
を出力させる熱源の放熱系を構成する場合、放熱量が大
きいことからプロペラファンと同様の配置構成、すなわ
ち、放熱フィン全域に直接冷却風を吹きつける本発明の
配置構成が、放熱効率が良く、さらには、装置内の空間
を有効に活用でき装置のコン・々クト化に寄与できる。
When using a crossflow fan to cool radiating fins,
A configuration in which cooling air is blown from the side of the radiation fins is common. However, when configuring a heat dissipation system for a heat source that outputs high power, such as a high-frequency heating heat source, the heat dissipation is large, so the arrangement is similar to that of a propeller fan, that is, the present invention blows cooling air directly over the entire area of the heat dissipation fins. This arrangement has good heat dissipation efficiency, and furthermore, the space inside the device can be used effectively, contributing to the compactness of the device.

発明の効果 以上、本発明は高周波加熱熱源である固体高周波発生部
に装着された放熱フィンのフィン部全域に冷却風を直接
吹きつける様に放熱フィンと冷却ファンとを配置構成し
た高周波加熱装置を提供するものであり、以下の効果を
奏する。
In addition to the effects of the invention, the present invention provides a high-frequency heating device in which radiation fins and a cooling fan are arranged so as to directly blow cooling air over the entire fin portion of the radiation fins attached to a solid-state high-frequency generator that is a high-frequency heating heat source. It provides the following effects.

(1)放熱フィン全域に直接冷却風が吹きつけられるた
め、放熱効率を高くでき、信頼性の高い固体周波発生部
が構成できる。
(1) Since cooling air is blown directly over the entire area of the radiation fins, the heat radiation efficiency can be increased and a highly reliable solid-state frequency generator can be configured.

(2)加熱室の一壁面側に、冷却ファンおよび駆動電激
部が集約できるため、装置本体に対する加熱室容積比を
高めることが容易である。換言すれば、加熱室容積に対
して装置本体をコンパクトに構成できる。
(2) Since the cooling fan and the driving electric unit can be integrated on one wall side of the heating chamber, it is easy to increase the volume ratio of the heating chamber to the main body of the apparatus. In other words, the main body of the apparatus can be configured compactly with respect to the volume of the heating chamber.

【図面の簡単な説明】 第1図は本発明の一実施例を示す高周波加熱装置の正面
断面図、第2図は第1図の右側面断面図、第3図は本発
明他の実施例を示す高周波加熱装置の側面断面図である
。 1・・・・・・固体高周波発生部、3・・・・・・加熱
室、4・・・・・・加熱室上壁面、6・・・・・放熱フ
ィン(放熱手段)、8.12・・・・・冷却ファン。
[Brief Description of the Drawings] Fig. 1 is a front cross-sectional view of a high-frequency heating device showing one embodiment of the present invention, Fig. 2 is a right side cross-sectional view of Fig. 1, and Fig. 3 is another embodiment of the present invention. FIG. 2 is a side cross-sectional view of the high-frequency heating device. 1...Solid high frequency generation part, 3...Heating chamber, 4...Top wall surface of heating chamber, 6...Radiating fin (heat radiating means), 8.12 ·····cooling fan.

Claims (1)

【特許請求の範囲】[Claims] 被加熱物が収容される加熱室と、高周波加熱熱源である
固体高周波発生部と、前記加熱室の上壁面に対して略平
行に置かれ、前記固体高周波発生部に装置された前記固
体高周波発生部の損失熱を放熱する放熱手段と、前記放
熱手段の下方に配設された前記放熱手段を冷却する冷却
ファンとからなる高周波加熱装置。
a heating chamber in which an object to be heated is accommodated; a solid-state high-frequency generator that is a high-frequency heating heat source; and a solid-state high-frequency generator placed approximately parallel to the upper wall surface of the heating chamber and installed in the solid-state high-frequency generator. 1. A high-frequency heating device comprising: a heat radiating means for dissipating heat loss from a part of the body; and a cooling fan disposed below the heat radiating means for cooling the heat radiating means.
JP14785384A 1984-07-17 1984-07-17 High frequency heater Pending JPS6127091A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14785384A JPS6127091A (en) 1984-07-17 1984-07-17 High frequency heater

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14785384A JPS6127091A (en) 1984-07-17 1984-07-17 High frequency heater

Publications (1)

Publication Number Publication Date
JPS6127091A true JPS6127091A (en) 1986-02-06

Family

ID=15439733

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14785384A Pending JPS6127091A (en) 1984-07-17 1984-07-17 High frequency heater

Country Status (1)

Country Link
JP (1) JPS6127091A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01299607A (en) * 1988-05-27 1989-12-04 Ngk Insulators Ltd Inorganic porous membrane
JPH0243928A (en) * 1988-08-01 1990-02-14 Ngk Insulators Ltd Inorganic porous membrane
US4929406A (en) * 1988-05-27 1990-05-29 Ngk Insulators, Ltd. Process for producing an inorganic porous membrane
JPH02165792A (en) * 1988-12-20 1990-06-26 Sharp Corp Picture processor
JPH07163848A (en) * 1994-08-04 1995-06-27 Ngk Insulators Ltd Production of inorganic porous membrane

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5284544A (en) * 1976-01-07 1977-07-14 Hitachi Ltd High frequency heating apparatus

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5284544A (en) * 1976-01-07 1977-07-14 Hitachi Ltd High frequency heating apparatus

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01299607A (en) * 1988-05-27 1989-12-04 Ngk Insulators Ltd Inorganic porous membrane
US4929406A (en) * 1988-05-27 1990-05-29 Ngk Insulators, Ltd. Process for producing an inorganic porous membrane
JPH0457373B2 (en) * 1988-05-27 1992-09-11 Ngk Insulators Ltd
EP0692303A2 (en) 1988-05-27 1996-01-17 Ngk Insulators, Ltd. Inorganic porous membrane
JPH0243928A (en) * 1988-08-01 1990-02-14 Ngk Insulators Ltd Inorganic porous membrane
JPH0561969B2 (en) * 1988-08-01 1993-09-07 Ngk Insulators Ltd
JPH02165792A (en) * 1988-12-20 1990-06-26 Sharp Corp Picture processor
JPH07163848A (en) * 1994-08-04 1995-06-27 Ngk Insulators Ltd Production of inorganic porous membrane

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