JPS61269009A - Appearance inspector for electronic component - Google Patents

Abstract

PURPOSE:To inspect abnormality of shape efficiently, by a method wherein a specified portion of a part is irradiated with a linear beam to take the reflected light two-dimensionally and then, the position of a light image is measured two-dimensionally on the basis of the resulting image information. CONSTITUTION:A lead 2 of a part 1 is irradiated with a linear light source 34 using a luminous discharge tube 4 and a cylindrical lens 3 from a specified direction to take 5 the linear reflected light image 7 from the specified portion. The resulting image signal is discriminated in level by a specified threshold and converted 61 into a digital signal to be memorized 62. In a CPU 68, information of the image for the specified portion is extracted from a memory 62 to measure 64, 65 and 66 the position (h) in height, lead width (w) and the lateral position (d) separately, which are compared with expected values to decide 67 on the lead shape. With such an arrangement, appearance inspection can be done efficiently with a simple construction means.

Description

Detailed Description of the Invention [Technical Field] The present invention relates to an external appearance inspection technique and a technique that is particularly effective when applied to an apparatus that automatically inspects the external appearance of a specific part of an electronic component. Equipment for automatically inspecting bent terminal leads of integrated circuit devices
This relates to effective techniques that utilize K.

[Background technology]

For example, how about dual-in-line ICTx 5K?
In an electronic component having a large number of terminal leads processed into a predetermined shape, if the terminal leads have an abnormal shape, problems may occur such as the inability to automatically insert the terminal leads into a printed wiring board. Therefore, in this type of electronic component, it is necessary to inspect the degree of bending of the terminal lead before shipping or before putting it into an automatic component insertion machine.

By the way, IC7J: Which terminal leads are left, right, front and back?
It can bend in either direction, up or down. Therefore, if you want to automatically inspect the terminal lead for bends, you will have to perform so-called three-dimensional pattern recognition processing to detect bends in any of the left/right, front/back, and up/down directions. No.

However, generally known pattern recognition processing for three-dimensional shapes is extremely complex and sophisticated compared to, for example, two-dimensional pattern recognition, and requires a large-scale hardware configuration and processing time. The problem was that it took a very long time. Therefore, visual inspection based on pattern recognition of three-dimensional shapes is not suitable for use in production lines where a large number of electronic components must be inspected in a short period of time. In addition, in irregular offices, the cost of the equipment is too high and the equipment cannot be used.

Note that an outline of pattern recognition is described, for example, in "Nikkei Mechanical: June 21, 1982 issue," published by Nikkei McGraw-Hill, pages 77 to 80 (Sensor Special Feature: Pattern Recognition Edition).

[Purpose of the invention]

The purpose of this invention is to detect three-dimensional bends in terminal leads of electronic components such as ICs, for example, without using complex and advanced three-dimensional shape pattern recognition means in terms of hardware and software. Another object of the present invention is to provide a technique for visually inspecting electronic components that can be efficiently inspected using relatively simple configuration means.

The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.

[Summary of the invention]

A brief description of typical inventions disclosed in this application is as follows.

That is, a specific part of an electronic component, for example, a terminal lead, is irradiated with a linear beam of light, and a linear reflected light image generated by this irradiation is imaged two-dimensionally. By measuring the position of the linear reflected light image two-dimensionally, abnormalities in the shape of the specific area can be efficiently inspected two-dimensionally without relying on three-dimensional pattern recognition processing. It accomplishes its purpose.

〔Example〕

Hereinafter, typical embodiments of the present invention will be described with reference to the drawings.

In the drawings, the same reference numerals indicate the same or corresponding parts.

W, Figure 1 (at (bl) shows an embodiment of the external appearance inspection device for electronic components according to the present invention. show.

First, the appearance inspection apparatus i shown in FIG. It is composed of an image processing device 6 and the like.

The linear light source 34 includes a light source 4 using a light emitting discharge tube, an optical system 3 using a cylindrical lens, and the like. This line light source 34 is connected to the terminal lead 2 of the electronic component l.
A specific portion of the beam is irradiated from a predetermined direction. In this case, the linear beam L1 is transmitted through a large number of terminal I nodes 2
It spreads in the direction of the array. Thereby, a large number of terminal leads 2 lined up on one side are irradiated with the beam at the same time. L2 indicates a portion of the scattered reflected light from each terminal lead 2. Further, ■ indicates the power source of the light source 4.

The imaging device fIt5 is a so-called normal raster scanning type two-dimensional imaging device, for example, a CCD (charge transfer device).
It is composed of an image sensor such as the one shown in FIG. This imaging device 5 captures a linear reflected light image 7 (see FIG. 3) from a specific portion of the terminal lead 2 from one predetermined direction.

The image processing device 6 has a two-dimensional pattern processing function. The image processing device 6 is configured using a microcomputer, etc., and the details will be described later, and the image processing device 6 is configured using a microcomputer or the like, and
a measuring means for measuring the position of the linear reflected light image 7 in the two-dimensional space based on the two-dimensional image information taken by the above-mentioned 41 based on the measurement result of the measuring means;
and determining means for determining the presence or absence of a defective shape in the 1F leg portion.
, 6°2. ,,Yoi! e[;43
4□Yo. □, 5゜7.゛) It is arranged on the same side (on the right side in the figure) with respect to the electronic component 1 that is the test object.

FIG. 2 (at(b)) shows the electronic component l which is the object to be inspected.
The external shape is shown. The electronic component 1 shown in the figure is a dual-in-line type IC, and has a large number of terminal leads 2 arranged on both sides of its badge. In the same figure,
(al indicates the front side of the electronic component, (bl indicates the side surface), and 2a indicates the front-back direction (Z direction) and the vertical direction (
2. Remove the terminal lead that is abnormally bent in the Y direction).
b shows terminal leads that are abnormally bent and stuck in the left-right direction (X direction).

FIG. 3 shows an example of an image captured by the imaging device 5. As shown in FIG. The image shown in the figure is a two-dimensional planar image, and only one side surface of the electronic component l shown in FIG. 2 is captured. The figure shows the entire side of one side of the electronic component 1, but in reality, each terminal lead 2, 2a is shown by darkening the background.

Linear reflected light image 7.7a from a specific portion of 2b.

Only 7b is imaged particularly brightly.

FIG. 4 shows a specific example of the configuration of the image processing device 6. As shown in FIG. The image processing device 6 shown in the figure includes an A-D converter 61, an R
It is composed of an image memory 62 based on AM, a micro-imviewer (ccPU) 68 formed into a semiconductor integrated circuit, and the like.

The A-D converter 61 converts the image signal output from the imaging device 5 into digital data represented by "1" and "O" by performing level discrimination (level slicing) using a sufficient threshold value. The image memory 62 stores digitized image data in a readable manner in a bitmap format.

Further, the micro computer 68 includes an image extraction means 63, a height Y direction rotation measurement means 64, a lateral X direction rotation width W measurement means 65, a lateral X direction position d measurement means 66, a determination means 67, etc. It is configured by software.

Here, the image extracting means 63 extracts partial image data of the special image area in the image memory 62 by so-called window processing. Based on this extracted portion 1ALIJ image data, the height Y7j same figure means 64, the width X
The directional width W measuring means 65 and the lateral X direction -d measuring means 66 each perform a measuring operation.

The measurement results of the measuring means 64, 65, and 66 are each compared with a predetermined expected value by the determining means 67. Based on the comparison result, it is determined whether the shape of the terminal lead in the portion corresponding to the partial image data is normal or not. In this case, the image extracting means 63 , cut out image data of a portion including only one terminal lead.

Then, when the measuring means 64, 65, 66 and the determining means 67 complete the processing for the cut out partial image data, the cutting position is repeatedly moved to the next terminal lead portion.

FIG. 5 (at(bl) shows a partial image cut out by the image extracting means 63. In the same figure, teacher 1 shows the image when level discrimination is not performed. The images are shown below.Level discrimination was performed (Image C of BL, only the above reflected light image 70 part was extracted and had a brightness level of "1" above a certain level, and the background part other than the background part had a brightness level of "1") is held down to '0''.The measuring means 64, 65, and 66 perform respective measurement processes based on the data of the level-discriminated image of the latter (bl).

In addition, FIG. 6 (at (bl) shows the state of change in the brightness level when the partial image shown in FIG. 5 is scanned in the vertical and X directions. Corresponds to (bl K in FIG. 5, and shows the change state of the brightness level when level discrimination is not performed. In addition, (bl corresponds to (blK) in FIG. In (al) of the figure, THI indicates a threshold value (slice level) serving as a reference for level discrimination.

Similarly, FIG. 7(al) shows the change state of the brightness level when the partial image shown in FIG. 5 is scanned in the left and right X directions. It corresponds to the image and shows the change state of the brightness level when level discrimination is not performed. Also, (bl is (blVC vs. E
This shows how the brightness level changes when level discrimination is performed. In (bl) of FIG. 6, TH2 indicates a threshold value (slice level) serving as a reference for level discrimination.

Here, the above height in the Y direction f! The Lh measuring means 64 measures the position [h on the Y-axis where the luminance level becomes high in FIG. 6 (bl). Above and below optical image 7 (Y direction)
It corresponds to the height of @It.

Further, the above-mentioned horizontal and vertical width W measuring means 65 is shown in FIG.
, the width W of a portion with high luminance drop, that is, the width WV of the section from when the luminance level rises to when it falls on the X-axis is measured. This measurement width W is shown in Figure K5 (
As shown in correspondence with blK, it corresponds to the width W in the left-right direction (X direction) of the reflected light @7.

Similarly, the horizontal X direction same position td measurement means 66 measures the position d of the reflected light image 7 in the left and right direction (X direction). This measurement process is shown in Figure 7 (bl), for example, the reference position This is done by measuring the difference d.

The values measured for each of the above 5K (h.

w, d) are given to the judgment means 67 as judgment hexagonal data 7j.

Now, if the terminal leads are shaped as expected,
The above turbidity values (h, w, d) are all within the expected standard value range. However, if the terminal lead is abnormally bent in the front-rear direction (Z direction) and the vertical direction (Y direction), for example, as in the terminal lead 2a shown in FIG. 5, the image position of the reflected light image 7a of the terminal lead 2a will deviate from the reference position indicated by the dotted line in the figure either up or down.As a result, the measurement position will also deviate from the expected position. Therefore, the abnormal bending can be detected from the measurement value of the height Y direction position measuring means 64.

In addition, if the terminal lead is abnormally bent in the left-right direction (X direction) as shown in FIG. 2 (bl), the terminal lead 2b as shown in FIG.
The image position of the reflected light image 7b of b is shifted to the left or right from the reference position indicated by the dotted line in the figure. Along with this, the above-mentioned difference d also increases. Therefore, from the measurement value of the lateral X-direction position d measuring means 65, it is possible to detect the abnormal bending.Furthermore, although not shown, if the terminal lead is torsionally deformed, The width W of the reflected light image 7 is observed to be narrower than the expected width. Therefore, the above horizontal
The measurement value (wl) of the directional width W measuring means 66 can also be used to determine the shape defect due to the twist.

As described above, the terminal lead 2.2a of the electronic component 1.

a line light source 34 that irradiates the beam 2b from one predetermined direction;
Linear reflected light image 7 from the terminal leads 2.2a and 2b
．． 7a and 7b from a predetermined direction, and the position of the linear reflected light image in the two-dimensional space is measured based on the two-dimensional image information captured by the imaging device f15. The measuring means 64, 65, and 66 are used to inspect the three-dimensional bending of the terminal lead using a complex and advanced three-dimensional method in terms of both hardware and software.
Dimensional shape pattern &l! The line Tx 5 can be efficiently carried out with a relatively simple construction means without relying on the line light source 34 and the imaging device, as shown in FIG. The device 5 can be placed on the same side as the electronic component 1 to be inspected.This makes it possible to further improve efficiency on a mass production line without interfering with the flow of electronic components in the slightest. A good visual inspection can be performed.

〔effect〕

(1) When a linear beam of light is irradiated onto a physical part of an electronic component, such as a terminal lead, a linear reflected light image generated by this irradiation is captured two-dimensionally, and the captured image information is By measuring the position of the linear reflected light image two-dimensionally based on the above-mentioned method, abnormalities in the shape of the object foot partial pressure can be detected two-dimensionally without relying on three-dimensional pattern gwt processing. This provides the effect of being able to perform inspections efficiently.

Although the invention made by the present inventor has been specifically explained above based on Examples, it goes without saying that this invention is not limited to the above Examples and can be modified in various ways without departing from the gist thereof. Nor. For example, the linear light source 3
4 may be a scanning light source using a flying spot method.

[Application field]

The above description has been made of a case in which the invention T and F by the present inventor is applied to the technology for inspecting bending of terminal leads of electronic components, which is the background field of application, but the present invention is not limited to this, and for example, It can also be applied to visual inspection techniques that target parts other than terminal leads.

[Brief explanation of the drawing]

Figure 1 (at, (bl) is a diagram showing an example of an electronic component appearance inspection apparatus according to the present invention, Figure 2 (al, (bl is a diagram showing an example of an electronic component as an object to be inspected), Figure 3 The figure shows the entire captured image, and Figure 4 shows the first image.
A block diagram showing a part of the inspection device shown in the figure in detail; Figure 5 (at, (b) is a diagram showing a partially cut out partial image; Figure 6 (at, (bl) is a diagram showing a partially cut out partial image. A diagram showing how the brightness level changes in the vertical Y direction. Fig. 7 (at (bl is a diagram showing how the brightness level changes in the left and right X directions in the partial image.・Terminal lead, 34... Line light source, 5... Two-dimensional imaging device, 6... Two-dimensional image processing device, 7... Reflected light image, 64, 65. 66... Measuring means, 67 ...determination means. Fig. 1 2rIA (=Ln
(/-)Figure 3

Claims (1)

[Scope of Claims] 1. An inspection device for detecting external shape defects in a specific portion of an electronic component, which comprises: a line light source that irradiates a beam onto the specific portion of the electronic component from one predetermined direction; a two-dimensional image capturing device that captures a linear reflected light image from one predetermined direction; and a two-dimensional space image of the linear reflected light image based on two-dimensional image information captured by the imaging device. 1. An external appearance inspection apparatus for an electronic component, comprising: a measuring means for measuring the position of the electronic component; and a determining means for determining the presence or absence of a shape defect in the specific portion based on the measurement result of the measuring means. 2. The external appearance inspection apparatus for electronic components according to claim 1, wherein the linear light source and the imaging device are disposed on the same side with respect to the electronic component to be inspected.