JPS61265852A - Carrier tape - Google Patents
Carrier tapeInfo
- Publication number
- JPS61265852A JPS61265852A JP10860885A JP10860885A JPS61265852A JP S61265852 A JPS61265852 A JP S61265852A JP 10860885 A JP10860885 A JP 10860885A JP 10860885 A JP10860885 A JP 10860885A JP S61265852 A JPS61265852 A JP S61265852A
- Authority
- JP
- Japan
- Prior art keywords
- insulating film
- carrier tape
- sprocket
- film
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は半導体装置の組立用テープに関し、特に、テー
プ・キャリア方式で使用されるテープに関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a tape for assembling semiconductor devices, and particularly to a tape used in a tape carrier system.
従来、半導体装置の組立方法の１つにテープ・キャリア
方式がある。これについて図面を用いて説明する。Conventionally, one of the methods for assembling semiconductor devices is a tape carrier method. This will be explained using drawings.
第３図はテープ・キャリア方式で使用されるテープの平
面図を示したものである。ポリイミド樹脂等でできた絶
縁物で可撓性を有するフィルム１上に導電物のリード３
が密着されている。長尺状の絶縁物フィルム１の両側に
テープ送り用穴としてスプロケット穴２が等間隔に開孔
され、中央部には半導体装置（チップ）を入れるデバイ
ス穴４が開孔されている。デバイス穴４に対応して長尺
状のフィルム１に同一のリード・パターンが連続して多
数形成されている。また、第３図のＢ−Ｂ線断面図を第
４図に示したが、第４図から明らかなように絶縁物フィ
ルムの膜厚は均一のものを便用している。FIG. 3 shows a plan view of the tape used in the tape carrier method. A conductive lead 3 is placed on a flexible insulating film 1 made of polyimide resin or the like.
is closely attached. Sprocket holes 2 are formed at equal intervals on both sides of a long insulating film 1 as tape feeding holes, and a device hole 4 for inserting a semiconductor device (chip) is formed in the center. A large number of identical lead patterns are successively formed on the long film 1 in correspondence with the device holes 4. Further, a sectional view taken along the line B--B in FIG. 3 is shown in FIG. 4, and as is clear from FIG. 4, the thickness of the insulating film is uniform.
上述したキャリア・テープのスズロケット穴２のピッチ
と同じ間隔の突起を有する歯車等によりスプロケット穴
を使ってキャリア・テープを次々と送り、半導体装置５
に設けられた突起電極とり伐
一ドの先端部３＃とを熱圧着し、連続して自動的に組立
作業を行なう。The carrier tape is successively fed through the sprocket holes by a gear or the like having protrusions at the same pitch as the pitch of the tin rocket holes 2 of the carrier tape, and the semiconductor device 5 is
The protruding electrode provided on the electrode and the tip 3# of the cutting lead are bonded together by thermocompression, and the assembly work is continuously and automatically performed.
上述した従来のキャリア・テープは、絶縁物フィルム１
の膜厚が薄いので、複数回の歯車との接触ないし少々の
機械的応力によってスプロケット穴２の形状が変形した
り、亀裂等により破損しピッチズレが生ずる。このため
自動送りによる作業がしばしば困難なものとなり作業能
ｗＡを低下させていた。The conventional carrier tape described above has an insulating film 1
Since the film thickness of the sprocket hole 2 is thin, the shape of the sprocket hole 2 may be deformed due to multiple contact with the gear or a small amount of mechanical stress, or may be damaged due to cracks or the like, resulting in pitch deviation. For this reason, work using automatic feeding was often difficult, reducing work efficiency wA.
また、テープ・キャリア方式では半導体装置は、通常１
個毎リードが切断されボード上に実装されるが、実装す
る際にスズロケット穴を位置ぎめ用の支点として用いる
ため、スプロケット穴が破損や変形していると実装の位
置ぎめが困難となるばかシでなく、位置ぎめ精度が得ら
れない。このため製造上の歩留を極端に低下させると共
に、実装後の製品の品質も低下させていた。In addition, in the tape carrier method, semiconductor devices are usually
Individual leads are cut and mounted on the board, but since the tin rocket hole is used as a fulcrum for positioning during mounting, if the sprocket hole is damaged or deformed, it will be difficult to position the mounting. positioning accuracy cannot be obtained. For this reason, the manufacturing yield is extremely reduced, and the quality of the product after mounting is also reduced.
本発明の組立用テープは、長尺状の絶縁性フィルムに電
極用リード・パターンが形成され、前記フィルムの両縁
部に送り用穴を有するキャリア・テープにおいて、前記
送り用穴の周囲のフィルム膜厚が他の領域よりも厚いこ
とを特徴としている。The assembly tape of the present invention is a carrier tape in which an electrode lead pattern is formed on a long insulating film, and has feeding holes on both edges of the film, and the film around the feeding holes. It is characterized by a film thickness that is thicker than other regions.
次に、本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第１図は本発明のキャリア・テープの一実施例の平面図
でるる。ポリイミド樹脂等でできた絶縁物で可撓性を有
するフィルム１上に導電物のリード３が密着されている
。長尺状の絶縁物フィルム１の両側に他の領域よりも絶
縁物フィルム１の膜厚が厚いスプロケット部フィルム６
が設けられており、スプロケット部フィルム６にスプロ
ケット穴２が等間隔に開孔されている。また、絶縁物フ
ィルムｌの中央部にデバイス穴４が開孔されている。デ
バイス穴４に対応して長尺状のフィルム１に同一のリー
ド・パターンが連続して多数形成されている。また、第
１図のＡ−Ａ線断面図を第２図に示したが、第２図から
明らかなように絶縁物フィルム１の両側には、絶縁膜フ
ィルム１の中央部よりも上下方向に膜厚が増加したスプ
ロケット部フィルム６がおる。FIG. 1 is a plan view of one embodiment of the carrier tape of the present invention. A conductive lead 3 is closely attached to a flexible insulating film 1 made of polyimide resin or the like. On both sides of the long insulating film 1, there is a sprocket film 6 in which the insulating film 1 is thicker than in other areas.
are provided, and sprocket holes 2 are opened at equal intervals in the sprocket portion film 6. Further, a device hole 4 is formed in the center of the insulating film l. A large number of identical lead patterns are successively formed on the long film 1 in correspondence with the device holes 4. Furthermore, although the sectional view taken along the line A-A in FIG. 1 is shown in FIG. 2, it is clear from FIG. There is a sprocket portion film 6 with increased film thickness.
上述した本発明のキャリア・テープを従来と同様に開用
することにより、半導体装［５に設けられた突起電極と
リード３とを熱圧着し、連続して自動的に組立作業を行
なう。By using the above-described carrier tape of the present invention in the same manner as before, the protruding electrodes provided on the semiconductor device [5] and the leads 3 are bonded by thermocompression, and the assembly work is performed continuously and automatically.
なお、膜厚の厚いスプロケット部フィルム６は第１図の
ように絶縁物フィルムｌの両側のすべての領域に設けず
にスズロケット穴５の周囲にのみ個々に設けることもで
きる。Incidentally, the thick sprocket portion film 6 may be individually provided only around the tin rocket hole 5 instead of being provided in all regions on both sides of the insulating film 1 as shown in FIG.
更に、膜厚の厚いスプロケット部フィルム６は第２図の
ように絶縁膜フィルムｌの中央部に対して上下方向にそ
れぞれ膜厚を増加させずにいずれか一万にのみ膜厚を増
加させてもよい。Furthermore, as shown in FIG. 2, the thick sprocket film 6 is made by increasing the film thickness only by 10,000 points without increasing the film thickness in the vertical direction with respect to the central part of the insulating film l. Good too.
以上説明したように本発明は、キャリア・テープの長尺
方向の両側に設けられているスプロケット穴を含む領域
の絶縁物フィルムの膜厚を他の領域よシも厚くしている
ので、スプロケット穴が機械的応力によって変形しない
。このため自動機械１［用した場合のスプロケット穴の
破損ないしは変形等によるピッチズレを皆無とすること
ができ、作業の容易性ならびに製品の歩留りを同上する
ことができる。As explained above, in the present invention, the thickness of the insulating film in the area including the sprocket holes provided on both sides of the carrier tape in the longitudinal direction is made thicker than in other areas. is not deformed by mechanical stress. Therefore, when the automatic machine 1 is used, pitch deviation due to damage or deformation of the sprocket hole can be completely eliminated, and work efficiency and product yield can be improved.
第１図は本発明の一実施例のキャリア・テープの平面図
、第２図は第１図のＡ−Ａ線断面図、第３図は従来のキ
ャリア・テープの平面図、第４図は第３図のＢ−Ｂ線断
面図である。
１・・・・・・絶縁物フィルム、２・・・・・・スプロ
ケット穴、３・・・・・・リード、３ａ・・・・・・リ
ードの先端、４・・・・・・デバイス穴、５・・・・・
・半導体装置、６・・・・・・スプロケット部フィルム
。
ｂ スフ′ＯケッＦ普μフンｌレム
第４図FIG. 1 is a plan view of a carrier tape according to an embodiment of the present invention, FIG. 2 is a sectional view taken along line A-A in FIG. 1, FIG. 3 is a plan view of a conventional carrier tape, and FIG. FIG. 4 is a sectional view taken along line BB in FIG. 3; 1...Insulator film, 2...Sprocket hole, 3...Lead, 3a...Lead tip, 4...Device hole , 5...
- Semiconductor device, 6...Sprocket part film. b.
Claims (1)
形成され、前記フィルムの両縁部に送り用穴を有するキ
ャリア・テープにおいて、前記送り用穴の周囲のフィル
ム膜厚が他の領域よりも厚いことを特徴とするキャリア
・テープ。In a carrier tape in which an electrode lead pattern is formed on a long insulating film and has feeding holes on both edges of the film, the film thickness around the feeding holes is thicker than in other areas. A carrier tape characterized by its thickness.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10860885A JPS61265852A (en) | 1985-05-20 | 1985-05-20 | Carrier tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10860885A JPS61265852A (en) | 1985-05-20 | 1985-05-20 | Carrier tape |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61265852A true JPS61265852A (en) | 1986-11-25 |
Family
ID=14489110
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10860885A Pending JPS61265852A (en) | 1985-05-20 | 1985-05-20 | Carrier tape |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61265852A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20120186862A1 (en) * | 2010-10-01 | 2012-07-26 | Lg Innotek Co., Ltd. | Carrier tape for tab-package and manufacturing method thereof |
-
1985
- 1985-05-20 JP JP10860885A patent/JPS61265852A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20120186862A1 (en) * | 2010-10-01 | 2012-07-26 | Lg Innotek Co., Ltd. | Carrier tape for tab-package and manufacturing method thereof |
| US9480152B2 (en) * | 2010-10-01 | 2016-10-25 | Lg Innotek Co., Ltd. | Carrier tape for tab-package and manufacturing method thereof |
| US9648731B2 (en) | 2010-10-01 | 2017-05-09 | Lg Innotek Co., Ltd. | Carrier tape for tab-package and manufacturing method thereof |
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