JPS6126116A - Positioning equipment - Google Patents

Positioning equipment

Info

Publication number
JPS6126116A
JPS6126116A JP14718384A JP14718384A JPS6126116A JP S6126116 A JPS6126116 A JP S6126116A JP 14718384 A JP14718384 A JP 14718384A JP 14718384 A JP14718384 A JP 14718384A JP S6126116 A JPS6126116 A JP S6126116A
Authority
JP
Japan
Prior art keywords
bonding
area
base plate
substrate
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14718384A
Other languages
Japanese (ja)
Inventor
Koichi Chiba
宏一 千葉
Koichi Tamai
玉井　光一
Nobuyuki Fujita
信幸 藤田
Sumio Nagashima
永島　純雄
Mutsumi Suematsu
睦 末松
Katsuhiko Kaneda
兼田　克彦
Toshiya Nemoto
根本　俊哉
Yoshio Terasaka
寺坂　良夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP14718384A priority Critical patent/JPS6126116A/en
Publication of JPS6126116A publication Critical patent/JPS6126116A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/16—Programme controls
    • B25J9/1679—Programme controls characterised by the tasks executed
    • B25J9/1692—Calibration of manipulator
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/1016—Shape being a cuboid
    • H01L2924/10161—Shape being a cuboid with a rectangular active surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
  • Control Of Position Or Direction (AREA)

Abstract

PURPOSE:To perform the bonding of a long base plate automatically and continuously by setting up plural partial areas on the long base board, sending the base plate to the position of a moving head in each partial area and finding out the positional information of the base plate and the moving head to determine a reference position. CONSTITUTION:The partial areas P1-Pm are set up on the base plate 15 and reference points Am, Bm corresponding to the image pickup range of an ITV camera are set up in each area. At first, the base plate 15 is set up on a work feeder. Then, the base plate 15 is positioned so that the area P1 is located within the stroke range of a bonding head 12. When the two reference points are prepared, the pattern of the reference point A is recognized at first, and then that of the reference point B1 is recognized. The positional information of the base plate 15 is found out from the recognized reference point and the reference position is determined from the positional information to execute the bonding in the area P1. After ending the bonding, the base plate 15 is moved to execute the same operation in the area P2 and the same operation is repeated up to the area Pm.

Description

【発明の詳細な説明】 ［発明の技術分野］ 本発明は、特にハイブリッドＩＣの製造においてＩＣチ
ップのボンディングを行なう際に用いられる位置合せ装
置に関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to an alignment device used when bonding IC chips, particularly in the manufacture of hybrid ICs.

［発明の技術的背景とその問題点］ 従来から、集積回路装置の製造において、ＩＣチップの
ワイヤボンディングを行なう際には、第６図に示したよ
うなボンディング装置が用いられている。[Technical Background of the Invention and Problems Therewith] Conventionally, in the manufacture of integrated circuit devices, a bonding apparatus as shown in FIG. 6 has been used to perform wire bonding of IC chips.

このボンディング装置は、Ｘ−Ｙテーブル１上に搭載さ
れたボンディングヘッド２を有し、ＩＴＶカメラ３でワ
ークフィーダ４上に載置された基板５のパターンを認識
しながらＸ方向駆動モータ６、Ｙ方向駆動モータ７、Ｚ
方向駆動モータ８を作動させてボンディングヘッド２を
移動させ、ワイヤ導出部９から導出される金ワイヤでＩ
Ｃチップ１０上のインナーリードポンディングパッドと
基板５上のアウターリードポンディングパッドとを接続
するように構成されている。This bonding apparatus has a bonding head 2 mounted on an X-Y table 1, and while recognizing the pattern of a substrate 5 placed on a work feeder 4 with an ITV camera 3, an X-direction drive motor 6, a Y-direction drive motor 6, Directional drive motor 7, Z
The direction drive motor 8 is operated to move the bonding head 2, and the gold wire led out from the wire lead-out part 9 is
It is configured to connect the inner lead bonding pads on the C chip 10 and the outer lead bonding pads on the substrate 5.

このようなボンディング装置では、Ｘ−Ｙテーブル１の
移動スミ−口一りが比較的小さく、ワイヤボンディング
を行なうことのできる範囲が限定されており、Ｘ−Ｙテ
ーブル１の移動ストロークよりも寸法の大きな基板に対
しては、一度にすべてのワイヤボンディングを行なうこ
とはできない。In such a bonding device, the movement of the X-Y table 1 is relatively small, and the range in which wire bonding can be performed is limited. For large boards, it is not possible to perform all wire bonding at once.

ところで、昨今の電子機器の性能の向上に伴って、集積
回路装置の多様化が進んでおり、１つの基板上に多数の
ＩＣチップや受動素子チップを実装したハイブリッドＩ
Ｃが数多く開発されている。By the way, with the recent improvement in the performance of electronic devices, the diversification of integrated circuit devices is progressing, and hybrid IC devices, in which many IC chips and passive element chips are mounted on one substrate, are becoming increasingly diverse.
Many C's have been developed.

そして寸法の大きな基板を有するハイブリッドＩＣの製
造におけるワイヤボンディングも高能率化が要求されて
いるが、上述したように従来のボンディング装置では、
Ｘ−Ｙテーブルのストロークを越えてボンディングを行
なうことはできないので、寸法の大きな基板に対して一
度にすべてのボンディングを行なうには、結局のところ
Ｘ−Ｙテーブル１のストロークを大きくしなければなら
なかった。High efficiency is also required for wire bonding in the manufacture of hybrid ICs with large substrates, but as mentioned above, conventional bonding equipment
Since it is not possible to perform bonding beyond the stroke of the X-Y table, in order to perform all the bonding at once on a large board, the stroke of the X-Y table 1 must be increased. There wasn't.

しかしながら、Ｘ−Ｙテーブル１のストロークを大きく
すると、その駆動機構部分がそれ以上に大型化するので
、装置のコストが著しく上昇してしまう。また組立袋、
置内にボンディング装置を組込みたい場合、装置の大型
化はレイアウト上の障害になってしまう。However, if the stroke of the X-Y table 1 is increased, the drive mechanism becomes even larger, resulting in a significant increase in the cost of the apparatus. Also an assembly bag,
When it is desired to incorporate a bonding device into a device, increasing the size of the device becomes an obstacle in terms of layout.

しかして、従来のボンディング装置では、長尺の基、板
をボンディングする場合には、基板を複数の領域に分割
し、領域毎にワイヤボンディングを行なっているが、こ
の場合、ボンディングヘッドと基板との基準位置合せを
分割領域毎にマニュアルで行なわなくてはならないとい
う問題があった。However, in conventional bonding equipment, when bonding a long substrate or board, the substrate is divided into multiple regions and wire bonding is performed for each region. There was a problem in that reference positioning had to be manually performed for each divided area.

［発明の目的］ 本発明はこのような問題点を解消すべくなされたもので
、Ｘ−Ｙテーブルのストロークが小さくても、長尺の基
板のボンディング等の作業を自動的に連続して行なうこ
とができる位置合せ装置の提供を目的としている。[Object of the Invention] The present invention has been made to solve these problems, and even if the stroke of the X-Y table is small, work such as bonding of long substrates can be automatically and continuously carried out. The purpose is to provide an alignment device that can perform the following tasks.

「発明の概要」 すなわち本発明の位置合せ装置は、特定の作業を行なう
移動ヘッドの移動領域を越える寸法をもつ対象上に複数
の部分領域を設定し、前記対象を１つの部分領域が前記
移動ヘッドの移動領域内に配置されるよう順次変位せし
め、変位せしめる毎に前記１つの部分領域内のパターン
を認識して、前記１つの部分領域と前記移動ヘッドの移
動領域との相対位置関係を測定し、その測定結果を前記
特定の作業の基準位置決定情報とするよう構成されてい
ることを特徴としている。``Summary of the Invention'' That is, the alignment device of the present invention sets a plurality of partial areas on an object whose dimensions exceed the movement area of a moving head that performs a specific operation, and one partial area moves the object. The head is sequentially displaced so as to be placed within the movement area of the head, each time the head is displaced, a pattern within the one partial area is recognized, and the relative positional relationship between the one partial area and the movement area of the moving head is measured. However, it is characterized in that it is configured to use the measurement results as reference position determination information for the specific work.

［発明の実施例］ 以下本発明の詳細を図面に示す実施例に基づいて説明す
る。[Embodiments of the Invention] Details of the present invention will be described below based on embodiments shown in the drawings.

第１図は本発明の位置合せ装置の一実施例を示す斜視図
である。FIG. 1 is a perspective view showing an embodiment of the alignment device of the present invention.

同図において１１はＸ−Ｙテーブル、１２はＸ−Ｙテー
ブル１０上に搭載されたボンディングヘッド、１３はＩ
ＴＶカメラ、１４は長尺の基板１５が載置されるととも
に、この基板１５の送り出しを行なうワークフィーダを
示している。In the figure, 11 is an X-Y table, 12 is a bonding head mounted on the X-Y table 10, and 13 is an I
A TV camera 14 indicates a work feeder on which a long substrate 15 is placed and which feeds the substrate 15.

また、１６はＸ−Ｙテーブル１１をＸ方向に移動させる
Ｘ方向駆動モータ、１７はＸ−Ｙテーブル１１をＹ方向
に移動させるＹ方向駆動モータ、１８はボンディングヘ
ッド１２を７方向に移動させるＺ方向駆動モータ、１９
は金ワイヤが導出されるワイヤ導出部、２ｏは基板１５
上のＩＣチップ、２１は基板１５が載置されるパレット
、２２はパレット２１を移動させるための送り穴を示し
ている。Further, 16 is an X-direction drive motor that moves the X-Y table 11 in the X direction, 17 is a Y-direction drive motor that moves the X-Y table 11 in the Y direction, and 18 is a Z-direction drive motor that moves the bonding head 12 in seven directions. directional drive motor, 19
2o is the wire lead-out part from which the gold wire is led out, and 2o is the substrate 15.
In the upper IC chip, 21 indicates a pallet on which the substrate 15 is placed, and 22 indicates a feed hole for moving the pallet 21.

第２図は本発明の位置合せ装置の主要部分を示すブロッ
ク図である。FIG. 2 is a block diagram showing the main parts of the alignment device of the present invention.

同図において２３は先に述べた基板１５上のパターンを
予め記憶しているＲＯＭあるいはＲＡＭからなる基準パ
ターン記憶部、２４は後述するパターン認識部、２５は
Ｘ方向駆動モータ１６およびＹ方向駆動モータ１７を制
御するＸ１Ｙ方向駆動制御部、２６はＺ方向駆動モータ
１８を制御するＺ方向駆動制御部、２７はワークフィー
ダ１４を制御する基板送り制御部、２８はＩＴＶカメラ
１３を制御するＩＴＶカメラ制御部、２９は以上の各部
に制御信号を出力する演算処理部である。In the figure, 23 is a reference pattern storage section consisting of a ROM or RAM that stores the pattern on the substrate 15 described above in advance, 24 is a pattern recognition section that will be described later, and 25 is an X-direction drive motor 16 and a Y-direction drive motor. 26 is a Z-direction drive control unit that controls the Z-direction drive motor 18 , 27 is a substrate feed control unit that controls the work feeder 14 , and 28 is an ITV camera control unit that controls the ITV camera 13 Section 29 is an arithmetic processing section that outputs control signals to each of the above sections.

第３図は本発明の位置合せ装置を用いてボンディングが
行なわれる長尺の基板１５を示す斜視図である。FIG. 3 is a perspective view showing a long substrate 15 to which bonding is performed using the alignment apparatus of the present invention.

この基板１５上には導体パターン１５ａが形成されてお
り、所定位置に複数のＩＣチップ２０がダイボンドされ
ている。そして基板１５上にｍ個の部分領域Ｐｎ（１≦
ｎ≦ｍ：ｎ、ｍは整数）が設定される。この領域の設定
はワークフィーダ１４による基板１５の送り出しピッチ
の調節により行なわれる。なお各部分領域ｐｎはＸ−Ｙ
テーブル１１のストロークを越えない範囲で設定される
。A conductor pattern 15a is formed on this substrate 15, and a plurality of IC chips 20 are die-bonded at predetermined positions. Then, m partial regions Pn (1≦
n≦m: n and m are integers) is set. Setting of this area is performed by adjusting the feeding pitch of the substrates 15 by the work feeder 14. Note that each partial area pn is X-Y
It is set within a range that does not exceed the stroke of table 11.

矢印は基板１５の送り方向を示している。The arrow indicates the direction in which the substrate 15 is fed.

本発明の位置合せ装置では、基板１５上に部分領域を設
定し、第４図に示したように、部分゛領域Ｐｎのそれぞ
れにｌＴＶカメラの撮像範囲（視野）に応じた基準点へ
〇およびＢｎを設定する。本実施例の場合、基板１５の
両端部の基準点Ａ１および基準点８ｍには、基板１５上
に予め設けておいた基準マークを対応させている。In the alignment device of the present invention, partial areas are set on the substrate 15, and as shown in FIG. Set Bn. In the case of this embodiment, the reference points A1 and 8m at both ends of the substrate 15 correspond to reference marks provided on the substrate 15 in advance.

ボンディングを行なう時、ＩＴＶカメラ１３は基板１５
上のボンディングが行なわれる部分を撮像しているが、
基板１５がフィードされる毎に演算処理部２９は基準パ
ターン記憶部２３に予め記憶されている基板１，５の基
準パターンをパターン認識部２４に入力し、この基準パ
ターンと部分領域Ｐｎの基準点ＡｎおよびＢｎのパター
ンとを対照させ、その時点において基板１５上のいずれ
の部分領域ｐｎがＸ−Ｙテーブル１１のストローク範囲
、すなわちボンディングヘッド１２のストローク範囲に
あるかを判衛する。When performing bonding, the ITV camera 13 is attached to the substrate 15.
The above image is taken of the part where bonding is performed,
Every time the substrate 15 is fed, the arithmetic processing section 29 inputs the reference pattern of the substrates 1 and 5 stored in advance in the reference pattern storage section 23 to the pattern recognition section 24, and uses this reference pattern and the reference point of the partial area Pn. The An and Bn patterns are compared to determine which partial region pn on the substrate 15 is within the stroke range of the XY table 11, that is, the stroke range of the bonding head 12 at that time.

さらに基準点へ〇およびＢｎを認識することにより、そ
れぞれの部分領域ｐｎとボンディングヘッド１２との相
対的な位置関係を示す位置情報を求め、例えばこの位置
情報からＸ、Ｙ方向のずれ量を演算し、ずれ量を補正し
た制御信号をＸ、Ｙ方向駆動制御部２５に出力しつつボ
ンディングを行なう。Furthermore, by recognizing 〇 and Bn to the reference point, positional information indicating the relative positional relationship between each partial area pn and the bonding head 12 is obtained, and for example, the amount of deviation in the X and Y directions is calculated from this positional information. Then, bonding is performed while outputting a control signal with the amount of deviation corrected to the X and Y direction drive control section 25.

この場合、基板１５が正確な規格の基板であれば基準点
へ〇および３ｎのいずれか一点の認識のみにより位置決
めを行なうことができる。In this case, if the substrate 15 is a substrate of an accurate standard, positioning can be performed by only recognizing one of the points 0 and 3n to the reference point.

以上の一連の動作を第５図に示した流れ図により総括的
に説明する。The above series of operations will be comprehensively explained using the flowchart shown in FIG.

まず、基板１５をワークフィーダ１４にセットする〈ス
テップＡ）。次に領域Ｐ１がボンディングヘッド１２の
ストローク範囲内に位置するように基板１５を位置させ
る（ステップＢ）。基板１５の精度により、基準点を１
つにするか２つにするかを選択する（ステップＣ）。基
準点を２つにする場合には、初めに基準点Ａ１のパター
ンを認識しくステップＤ）、次に基準点Ｂ１のパターン
を認識する（ステップＥ）。基準点を１つにする場合に
はステップＤは省略する。そして認識された基準点から
基板１５の位置情報を求め（ステップＦ）、この位置情
報から基準位置を決定して領域Ｐ１内のボンディングを
行なう。ボンディングの終了後、基板１５を移動させ、
領１１ｉ　Ｐ　２について再び上述した動作を行なう。First, the substrate 15 is set on the work feeder 14 (step A). Next, the substrate 15 is positioned so that the area P1 is within the stroke range of the bonding head 12 (step B). Due to the accuracy of the board 15, the reference point is set to 1.
Select whether to make one or two (step C). If there are two reference points, first the pattern of the reference point A1 is recognized (step D), and then the pattern of the reference point B1 is recognized (step E). If there is only one reference point, step D is omitted. Then, the positional information of the substrate 15 is obtained from the recognized reference point (step F), the reference position is determined from this positional information, and bonding within the region P1 is performed. After the bonding is completed, move the substrate 15,
The above-described operation is performed again for region 11iP2.

これを領域ＰＩ１１まで繰り返すと、基板１５上のすべ
てのボンディングが終了する。When this is repeated up to the area PI11, all bonding on the substrate 15 is completed.

このように本実施例の位置合せ装置によれば、ボンディ
ングヘッドの移動ストロークを越える寸法の長尺基板上
のボンディングを自動的に連続して行なうことができる
。As described above, according to the alignment device of this embodiment, it is possible to automatically and continuously perform bonding on a long substrate whose size exceeds the movement stroke of the bonding head.

しかも、各領域の認識はＩＴＶカメラおよびパターン認
識部により自動的に行われ、操作時に細かな位置データ
等をインプットする必要がないので、作業能率が著しく
向上する。Furthermore, recognition of each area is automatically performed by the ITV camera and pattern recognition section, and there is no need to input detailed position data etc. during operation, so work efficiency is significantly improved.

なお、上述した実施例は本発明装置をワイヤボンディン
グ装置に用いた場合の例であるが、本発明装置はかかる
一実施例に限定されるものではない。例えばＩＣチップ
を基板上に固着するダイボンディング装置、あるいは長
尺基板にチップ部品をマウントするマウント装置等にも
適用することができる。Note that, although the above embodiment is an example in which the device of the present invention is used in a wire bonding device, the device of the present invention is not limited to such one embodiment. For example, it can be applied to a die bonding device for fixing an IC chip onto a substrate, a mounting device for mounting chip components on a long substrate, and the like.

し発明の効果」 以上説明したように本発明の位置合せ装置は、ボンディ
ング等を行なう移動ヘッドのストロークを越える寸法の
長尺の基板上に複数の部分領域を設定し、基板を部分領
域毎に移動ヘッドの位置に送り、各部分領域をパターン
認識して基板と移動ヘッドとの位置情報を求め、この位
置情報から基準位置を決定するので、長尺の基板におけ
るボンディング等の作業を自動的に連続して行なうこと
ができる。しかもＸ−Ｙテーブルのストロークを大きく
する必要がないのでコンパクトに構成することができる
。As explained above, the alignment device of the present invention sets a plurality of partial areas on a long substrate with dimensions exceeding the stroke of a moving head that performs bonding, etc., and aligns the substrate in each partial area. The board is sent to the position of the moving head, pattern recognition is performed on each partial area to obtain positional information between the board and the moving head, and the reference position is determined from this positional information, so work such as bonding on long boards can be automatically performed. It can be done continuously. Moreover, since there is no need to increase the stroke of the X-Y table, the structure can be made compact.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本発明の一実施例の外観を斜視図、第２図はそ
の主要部分の構成を示すブロック図、第３図および第４
図はボンディングされる長尺の基板の外観を示す斜視図
、第５図は本発明の一実施例の動作を示す流れ図、第６
図は従来のボンディング装置の外観を示す斜視図である
。 １．１１・・・Ｘ−Ｙテーブル ２．１２・・・ボンディングヘッド ３．１３　・・Ｉ　Ｔ　Ｖ　カメラ ４．１４・・・ワークフィーダ ５．１５・・・基　板 ６．１６・・・Ｘ方向駆動モータ ７．１７・・・Ｙ方向駆動モータ ８．１８・・・Ｚ方向駆動モータ １０．２０・・・ＩＣチップ ２１・・・・・・・・・・・・パレット２２・・・・・
・・・・・・・、送り穴２３・・・・・・・・・・・・
基準パターン記憶部２４・・・・・・・・・・・・パタ
ーン認識部２５・・・・・・・・・・・・ＸＸＹ方向駆
動制御部２６・・・・・・・・・・・・Ｚ方向駆動制御
部２７・・・・・・・・・・・・基板送り制御部２８・
・・・・・・・・・・・ＩＴＶカメラ制御部２９・・・
・・・・・・・・・演算処理部Ｍ・・・・・・・・・・
・・ボンディング装置代理人弁理士　　　須　山　佐　
− 第１図 鳥２区 ト 尾３図 第５図 兜６図FIG. 1 is a perspective view of the appearance of an embodiment of the present invention, FIG. 2 is a block diagram showing the configuration of its main parts, and FIGS.
The figure is a perspective view showing the appearance of a long substrate to be bonded, FIG. 5 is a flowchart showing the operation of an embodiment of the present invention, and FIG.
The figure is a perspective view showing the appearance of a conventional bonding device. 1.11...X-Y table 2.12...Bonding head 3.13...ITV camera 4.14...Work feeder 5.15...Substrate 6.16...X Direction drive motor 7.17...Y direction drive motor 8.18...Z direction drive motor 10.20...IC chip 21...Pallet 22...・
......, Sprocket hole 23...
Reference pattern storage unit 24...Pattern recognition unit 25...XXY direction drive control unit 26...・Z-direction drive control section 27......Substrate feed control section 28.
......ITV camera control section 29...
...... Arithmetic processing section M...
・・Patent attorney representing bonding equipment Sasa Suyama
- Figure 1 Tori 2 Ward Tobi 3 Figure 5 Kabuto 6

Claims (5)

【特許請求の範囲】[Claims] （１）特定の作業を行なう移動ヘッドの移動領域を越え
る寸法をもつ対象上に複数の部分領域を設定し、前記対
象を前記部分領域が１領域毎に前記移動ヘッドの移動領
域内に配置されるよう順次変位せしめ、変位せしめる毎
に前記部分領域内のパターンを認識して、前記部分領域
と前記移動ヘッドの移動領域との相対位置関係を測定し
、その測定結果を前記特定の作業の基準位置決定情報と
するよう構成されていることを特徴とする位置合せ装置
。(1) A plurality of partial areas are set on an object whose dimensions exceed the movement area of a moving head that performs a specific work, and each partial area is placed within the movement area of the moving head. The pattern in the partial area is recognized each time the partial area is displaced, the relative positional relationship between the partial area and the moving area of the moving head is measured, and the measurement result is used as a reference for the specific work. A positioning device characterized in that it is configured to provide positioning information. （２）部分領域内のパターンの認識が、ＩＴＶカメラに
より撮像された部分領域内のパターンと、予め保存され
ている基準パターンとの対照により行なわれるようにさ
れている特許請求の範囲第１項記載の位置合せ装置。(2) Recognition of the pattern within the partial region is performed by comparing the pattern within the partial region imaged by an ITV camera with a reference pattern stored in advance. The alignment device described. （３）特定の作業が、ハイブリッドＩＣの製造における
ＩＣチップのボンディングである特許請求の範囲第１項
または第２項記載の位置合せ装置。(3) The alignment device according to claim 1 or 2, wherein the specific work is bonding of IC chips in the manufacture of hybrid ICs. （４）ボンディングが、ワイヤボンディングである特許
請求の範囲第３項記載の位置合せ装置。(4) The alignment device according to claim 3, wherein the bonding is wire bonding. （５）ボンディングが、ダイボンディングである特許請
求の範囲第３項記載の位置合わせ装置。(5) The alignment device according to claim 3, wherein the bonding is die bonding.
JP14718384A 1984-07-16 1984-07-16 Positioning equipment Pending JPS6126116A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14718384A JPS6126116A (en) 1984-07-16 1984-07-16 Positioning equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14718384A JPS6126116A (en) 1984-07-16 1984-07-16 Positioning equipment

Publications (1)

Publication Number Publication Date
JPS6126116A true JPS6126116A (en) 1986-02-05

Family

ID=15424447

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14718384A Pending JPS6126116A (en) 1984-07-16 1984-07-16 Positioning equipment

Country Status (1)

Country Link
JP (1) JPS6126116A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01166529A (en) * 1987-12-23 1989-06-30 Shinkawa Ltd Bonding method
JPH0462266U (en) * 1990-10-08 1992-05-28

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5330464A (en) * 1976-09-02 1978-03-22 Kubota Ltd Liquid pressure molding process
JPS53105950A (en) * 1977-02-28 1978-09-14 Nec Corp Data process system
JPS551101A (en) * 1977-11-10 1980-01-07 Nec Corp Method and device for detecting position of semiconductor pellet
JPS55122283A (en) * 1979-03-07 1980-09-19 Fujitsu Ltd Buffer memory unit
JPS57183046A (en) * 1981-05-07 1982-11-11 Toshiba Corp Wire bonding device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5330464A (en) * 1976-09-02 1978-03-22 Kubota Ltd Liquid pressure molding process
JPS53105950A (en) * 1977-02-28 1978-09-14 Nec Corp Data process system
JPS551101A (en) * 1977-11-10 1980-01-07 Nec Corp Method and device for detecting position of semiconductor pellet
JPS55122283A (en) * 1979-03-07 1980-09-19 Fujitsu Ltd Buffer memory unit
JPS57183046A (en) * 1981-05-07 1982-11-11 Toshiba Corp Wire bonding device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01166529A (en) * 1987-12-23 1989-06-30 Shinkawa Ltd Bonding method
JPH0462266U (en) * 1990-10-08 1992-05-28

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