JPS61242757A - Soldering equipment - Google Patents

Abstract

PURPOSE:To unify a soldering by placing a printed circuit board on the member having elasticity and then by soldering simultaneously plural leads of electronic components. CONSTITUTION:A sheet-like conductive silicone rubber 2 is provided on an XY table 1. A printed circuit board 3 is placed via a positioning pin 4 on the rubber member 2 having an elasticity and located. In this state the flat packaging IC 5 in plural directions is placed on the pattern 6 of the board 3. The first and second heater tips 7, 8 are then descended from the upper part and brought into contact with the lead lines 9, 10 of the IC 5 by giving the prescribed pressure. In this case, the soldering is performed with the heater tips 7, 8 being heated by the current. The pressing force to be applied on all the lead wires 9, 10 becomes uniform due to the rubber 2 of elastic body being arranged under the board 3 and the soldering is unified.

Description

[Detailed description of the invention] [Technical field of invention] This invention relates to a soldering device.

[Technical background of the invention and its problems] Electronic components having multiple lead wires, such as flat package ICs, have several or more thin wire leads on one side, and this mounting is usually formed on a printed circuit board. This is done by soldering to the portion of the wiring pattern that corresponds to the position of the lead wire of the flat package. This soldering was improved and
For the IC leads protruding from the sides, a rectangular cylindrical heater chip is heated under pressure and soldered. As the number of wires increases, there will be a slight variation in the thickness of the electrodes, and due to this variation, when using the straight heater chip mentioned above, relatively thin lead wires will have different thickness depending on the heater chip. There were cases in which reliable contact could not be made due to variations in the applied pressing force.

[Purpose of the invention]

This invention was made in response to the above points.

The present invention provides a soldering device that can effectively solder electronic components having a plurality of lead wires.

[Summary of the invention]

In an apparatus for soldering an electronic component having a plurality of lead wires onto a wiring pattern of a printed circuit board, the plurality of leads of the electronic component are simultaneously soldered while the printed circuit board is placed on an elastic member. The purpose is to obtain a soldering device that can be used.

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[Embodiments of the invention]

Next, an embodiment in which the device of the present invention is applied to a soldering device for a flat package IC having a large number of lead wires in two directions will be described with reference to the drawings. On the XY table (1) there is an elastic member such as a sheet of conductive silicone rubber (
A printed circuit board (3), which is a member to be soldered, is placed on the silicone rubber (2) on which the parts 2) are provided. This printed circuit board (3) is positioned and placed. This positioning means is, for example, a positioning bin (4) provided on the X-Y table (1), so that the printed circuit board (3)
A positioning hole (not shown) is provided in the printed circuit board (3), and the printed circuit board (3) is automatically conveyed into this hole to be positioned. A wiring pattern (not shown) made of a conductor such as copper is formed on the printed circuit board (3), and the wiring pattern includes the two-way flat package IC.
A pattern (6) to which the lead wire (5) is connected is formed. Set the position of this pattern on the X-Y table (1)
is moved to the mounting position and set according to a preset mounting program. In this setting state, a two-way flat package IC (5) is picked up from a tray (not shown) by a collet and placed on the pattern (6). At this time, the mounting accuracy is such that the pattern (6) 1 trap is placed with high precision according to a preset program. In this placed state, the U-shaped first and second heater chips (7) and (8) are lowered from above. This heater chip (7
) The interval (8) is preset so as to be located at the center of the two-way lead wire array (9) α1 of the flat package IC. The upper ends of each of the above heater chips (7) and (8) are attached to the mounting plate αυα3Q3α4 with screws Q! IC at 9
It is screwed on. This deposition plate Ql)Q3Hα◆ is made of a conductor and is electrically connected to a current source so that a current flows when heating the heater chips (7) and (8). Current heating control for such heater chips (7) and (8) is as follows:
It is executed based on a preset program. Also,
During this current heating, the flat package IC (5) is maintained in the collet-mounted state, and a predetermined pressing force is applied to the heater chips (7) (8) to solder the lead rows (9) (II). At this time, since the elastic silicone rubber (2) is provided on the base of the printed circuit board (3), all the lead wires are uniformly coated with the heater chip +7) (8). The pressing force was applied and all the lead wires were successfully soldered.

In the above embodiment, an example was explained in which a conductive silicone rubber sheet was used as the sheet-like member having elasticity, but any material such as resin or paper may be used as long as it has elasticity. However, if at least the surface is conductive, functional elements such as semiconductor elements can be protected from problems such as discharge due to static electricity. Furthermore, although the above embodiment describes the mounting of a two-way flat package, it may also be used for a four-way flat package IC. It can be applied to any of the following.

〔Effect of the invention〕

As explained above, according to the present invention, it is possible to automatically and uniformly solder a plurality of leads to all the leads.

[Brief explanation of the drawing]

FIG. 1 is a front view for explaining an embodiment of the device of the present invention;
FIG. 2 is a side view of FIG. 1. l...XY table, 2... Elastic member. 3...Printed circuit board, 5...Flat package I
C19, lO... Lead wire row, 7.8... Heater chip.

Claims (3)

[Claims] (1) In an apparatus for soldering electronic components having multiple lead wires onto the wiring pattern of a printed circuit board, the multiple leads of the electronic component are simultaneously soldered while the printed circuit board is placed on an elastic member. A soldering device characterized by soldering. (2) The soldering apparatus according to claim 1, wherein the electronic component is a two-way or four-way flat package IC. (3) The soldering device according to claim 1, wherein the elastic member is a sheet-like rubber having conductivity.