JPS61234094A - Mounting of check terminal - Google Patents

Mounting of check terminal

Info

Publication number
JPS61234094A
JPS61234094A JP60288882A JP28888285A JPS61234094A JP S61234094 A JPS61234094 A JP S61234094A JP 60288882 A JP60288882 A JP 60288882A JP 28888285 A JP28888285 A JP 28888285A JP S61234094 A JPS61234094 A JP S61234094A
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
board
terminal
check terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60288882A
Other languages
Japanese (ja)
Other versions
JPS6210040B2 (en
Inventor
奥村 勝浩
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Home Electronics Ltd
NEC Corp
Original Assignee
NEC Home Electronics Ltd
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Home Electronics Ltd, Nippon Electric Co Ltd filed Critical NEC Home Electronics Ltd
Priority to JP60288882A priority Critical patent/JPS61234094A/en
Publication of JPS61234094A publication Critical patent/JPS61234094A/en
Publication of JPS6210040B2 publication Critical patent/JPS6210040B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Multi-Conductor Connections (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 この発明は、プリント基板に形成される各種回路の点検
、調整等を行う際に用いられるチェック端子を基板上に
設ける場合の取付は方法に関するプリント基板に部品を
実装するにあたり、部品のリード端子が長く、あるいは
リード端子に余長部分が設けられる場合等においては、
部品を基板上に挿入した後半田ディップを行い、次いで
その余長部分を切断除去して所定長さに切揃える作業が
おこなわれる。この作業は、従来手作業によりニッパ−
等を用いて行われていたが、これによると作業に時間と
労力を要し、特に近年の如く部品の高密度実装が行われ
ている現状においては作業性が極めて悪いという欠点が
生ずる。
DETAILED DESCRIPTION OF THE INVENTION This invention relates to a method for mounting components on a printed circuit board when check terminals are provided on the circuit board to be used when inspecting, adjusting, etc. various circuits formed on the printed circuit board. In this case, if the lead terminal of the component is long or the lead terminal has an extra length,
After inserting the component onto the board, solder dipping is performed, and then the remaining length is cut off and trimmed to a predetermined length. This work was traditionally done manually using nippers.
However, this method requires time and effort, and has the drawback of extremely poor workability, especially in the current situation where components are mounted in high density in recent years.

そこで従来は、部品を半田付は固定し、あるいは仮固定
した後、そのリード端子の余長部分を自動切断機等によ
り一度に切断除去してこれを所定長さに切揃えるような
ことが行われていた。しかしながらこれによると、リー
ド端子が半ば強制的に切断除去されるため、加工時に加
わる応力により半田付は箇所にヒビやクラックが生じた
り、あるいは極端な場合には、該加工時に生ずる発熱(
約500〜800度程度)のため半田盛部分が溶けて半
田不足となり、経年変化により半田付は部分が劣化変質
する問題が指摘されていた。
Conventionally, the parts were fixed by soldering or temporarily fixed, and then the excess length of the lead terminals was cut and removed at once using an automatic cutting machine, etc., and the parts were trimmed to a predetermined length. I was worried. However, according to this method, the lead terminals are forcibly cut and removed, so the stress applied during processing may cause cracks in the soldering, or in extreme cases, heat generation (
(approximately 500 to 800 degrees Celsius), the solder portions melt, resulting in insufficient solder, and it has been pointed out that the solder portions deteriorate and deteriorate over time.

そこでこれに対処するために、半田ディップにより部品
を基板上に半田付は固定し、次いでそのリード端子の余
長部分を自動切断機により所定長さに切断し、その後再
度半田ディップする、いわゆる゛二度半田ディップ法′
と称される方法が用いられる。
In order to deal with this problem, the parts are soldered and fixed on the board by solder dipping, the excess length of the lead terminals is then cut to a predetermined length using an automatic cutting machine, and then the parts are soldered and dipped again. Double solder dip method′
A method called is used.

この発明は、このような°二度半田ディップ法′により
基板上に部品を実装する場合の、プリント基板に設けら
れるチェック端子の取付は方法に関するものである。
The present invention relates to a method for attaching check terminals provided on a printed circuit board when components are mounted on the circuit board by the two-dip soldering method.

この種のプリント基板には、回路の点検、調整あるいは
修理などのために、少なくとも1個所にオッシロスコー
プのプローブ等が接続されるチェック用の端子が設けら
れるのが通例である。このチェック端子は、基板の部品
実装面に設けられるのが一般であるが、必要に応じて基
板の裏面側に設けておきたい場合がある。
This type of printed circuit board is usually provided with at least one check terminal to which an oscilloscope probe or the like is connected in order to inspect, adjust, or repair the circuit. This check terminal is generally provided on the component mounting surface of the board, but it may be desired to provide it on the back side of the board as necessary.

ところが、上記のような゛二度半田ディップ法1による
場合には、基板裏面側のリード端子等が全て一様に短く
切揃えられるため、この裏面側に部品実装工程でチェッ
ク端子を取付けることは困難であり、したがって以後の
工程で手作業により基板の取付孔に挿入し半田付は固定
する作業が別途に必要となり、この作業が極めてやっか
いかつ煩雑で効率の悪いものであった。
However, when using the double solder dip method 1 as described above, all the lead terminals on the back side of the board are cut uniformly short, so it is impossible to attach check terminals on this back side during the component mounting process. Therefore, in subsequent steps, it is necessary to manually insert the board into the mounting hole of the board and fix it by soldering, which is extremely troublesome, complicated, and inefficient.

そこでこの発明は、上記のようなチェック端子をプリン
ト基板の裏面側に設けるにあたり、その取付けが容易簡
単に行えるチェック端子の取付は法を提供するもので、
以下この発明の一実施例を図面に基づいて詳細に説明す
る。
Therefore, the present invention provides a method for easily attaching the check terminal when providing the check terminal as described above on the back side of the printed circuit board.
Hereinafter, one embodiment of the present invention will be described in detail based on the drawings.

第1図、第2図はこの発明に係るチェック端子の一例を
示すもので、このチェック端子1は、筒状の部材2と、
この部材2に軸方向にスライド可能に遊嵌装着される軸
状の端子体3とから成り、プリント基板の取付孔に部品
実装面から挿着されるようになっている。
FIGS. 1 and 2 show an example of a check terminal according to the present invention, and this check terminal 1 includes a cylindrical member 2,
It consists of a shaft-shaped terminal body 3 that is loosely fitted into this member 2 so as to be slidable in the axial direction, and is inserted into a mounting hole of a printed circuit board from the component mounting surface.

部材2は、一端(上端)が開口するとともに、他端(底
面)が閉塞しており、この開口を通して端子体3が一体
に挿入装着されている。部材2の上端は内方に折曲され
、この上端部2aに端子体3のツバ3aが当接係止され
その下方への抜は止めがなされるようになっている。こ
の部材2の外周部所定位置には、ツバ状の係止部2bか
外方に突出形成され、これにより基板取付孔に挿入する
際の位置決めがなされるようになっている。
The member 2 is open at one end (upper end) and closed at the other end (bottom surface), and the terminal body 3 is integrally inserted and mounted through this opening. The upper end of the member 2 is bent inward, and the collar 3a of the terminal body 3 is abutted against and latched to the upper end 2a to prevent it from being pulled out downward. At a predetermined position on the outer periphery of this member 2, a collar-shaped locking portion 2b is formed to protrude outward, so that the member 2 can be positioned when inserted into a board mounting hole.

端子体3は、その上部に抜は止め用のツバ3aが設けら
れるとともに、長手方向の所定位置に抜は止め片3bが
突出形成され部材2の上端開口からの脱落が防止されて
いる。
The terminal body 3 is provided with a collar 3a on its upper portion to prevent the member 2 from falling out, and a piece 3b to prevent the member 2 from falling off from the upper end opening is formed to protrude at a predetermined position in the longitudinal direction.

一方、第3図は本発明が適用されるプリント基板を示す
もので、このプリント基板4の部品実装面4aには、各
種電子部品al bl  c・・・が実装されている。
On the other hand, FIG. 3 shows a printed circuit board to which the present invention is applied, and various electronic components al, bl, c, . . . are mounted on the component mounting surface 4a of this printed circuit board 4.

これらの部品a、b、C・・・は、そのリード端子が基
板4の挿入孔に挿入され仮固定された後、半田ディップ
により基板4に半田付は固定され、次いで自動切断機等
を用いて基板裏面4bに突出するリード端子の余長部分
が所定長さに短く切揃えられるものである。しかし、こ
の段階では、該余長部分の切断に伴う応力や発熱に起因
して、リード端子自体あるいは半田盛付は部分に目視で
きない半田付は不良が生じている慣れがある。
These components a, b, C... are inserted into the insertion holes of the board 4 with their lead terminals and temporarily fixed, and then soldered and fixed to the board 4 by soldering dip, and then soldered using an automatic cutting machine or the like. The excess length of the lead terminal protruding from the back surface 4b of the substrate is then trimmed to a predetermined length. However, at this stage, it is common for soldering defects to occur in parts of the lead terminal itself or the solder paste that cannot be visually seen due to stress and heat generated when the extra length is cut.

そこで、この場合は、上記余長部分が切断除去された後
、再度の半田ディップが行われ、これにより部品a、 
bt c・11舎がプリント基板4に完全に半田付は固
定される。
Therefore, in this case, after the above-mentioned extra length is cut and removed, solder dipping is performed again, and as a result, parts a,
btc.11 is completely fixed to the printed circuit board 4 by soldering.

プリント基板4の所定位置には、図の二点鎖線で示す如
く、チェック端子1の取付位置5が位置決めされており
、この位置5にチェック端子1が挿着される取付孔6が
上下に貫通形成されている第4図(a)〜(e)は、チ
ェック端子1をプリント基板4に挿着する場合の取付工
程を示すもので、先ず、同図(a)に示すように、チェ
ック端子1がプリント基板4の取付孔6に部品実装面4
aから挿入されると、部材2の係止部2bが部品実装面
4aの取付孔6周縁で係止され、挿入方向の位置決めが
なされるとともに、部材2の先端が基板裏面側4bに所
定高さで突出される。このとき、端子体3は、先端が底
面2eに接した状態で部材2内に保持されている。次い
で、この状態でプリント基板4が第1回目の半田デイツ
プ工程に付され、上記各電子部品a、b+  c・・・
の半田付は固定がなされると同時に、部材2が基板4に
半田付は固定される(同第4図(b))。端子体3は、
このとき部材2内で遊動可能の状態におかれている。そ
の後、上記各部品al bl  c・・・のリード端子
のカッティング工程が行われ、上述の如く基板裏面4b
に突出するリード端子の余長部分が切断除去されて所定
長さに短く切揃えられるとともに、これによって部材2
の先端が端子体3の先端部と共に所定長さ切断されその
底面2eが開口される(第4図(C)参照)。すると、
端子体3が、第4図(d)に示すように、その自重によ
って部材2内を軸方向に下方にスライドし、その先端部
3cが取付孔6から基板裏面4b側に所定高さ2だけ突
出する。この場合、ツバ3aが部材2の上端部2aに当
接係止され、その下方への抜は止めがなされるとともに
、基板裏面4bへの突出高さIの規制が行われる。
A mounting position 5 for the check terminal 1 is positioned at a predetermined position on the printed circuit board 4, as shown by the two-dot chain line in the figure, and a mounting hole 6 into which the check terminal 1 is inserted passes through the position 5 vertically. FIGS. 4(a) to 4(e) show the installation process when inserting the check terminal 1 into the printed circuit board 4. First, as shown in FIG. 1 is the component mounting surface 4 in the mounting hole 6 of the printed circuit board 4.
When inserted from a, the locking portion 2b of the member 2 is locked at the periphery of the mounting hole 6 on the component mounting surface 4a, positioning in the insertion direction is performed, and the tip of the member 2 is placed at a predetermined height on the back side 4b of the board. It stands out. At this time, the terminal body 3 is held within the member 2 with its tip in contact with the bottom surface 2e. Next, in this state, the printed circuit board 4 is subjected to a first solder dip process, and the above-mentioned electronic components a, b+c...
At the same time, the member 2 is soldered and fixed to the board 4 (FIG. 4(b)). The terminal body 3 is
At this time, it is in a freely movable state within the member 2. After that, the cutting process of the lead terminals of each of the parts al bl c... is performed, and as described above, the back side 4b of the board
The excess length of the lead terminal protruding from the side is cut off and removed to shorten it to a predetermined length.
The tip of the terminal body 3 is cut to a predetermined length along with the tip of the terminal body 3, and the bottom surface 2e thereof is opened (see FIG. 4(C)). Then,
As shown in FIG. 4(d), the terminal body 3 slides downward in the axial direction within the member 2 due to its own weight, and its tip end 3c moves a predetermined height 2 from the mounting hole 6 toward the back surface 4b of the board. stand out. In this case, the collar 3a abuts and locks on the upper end 2a of the member 2, preventing its downward removal and regulating the protrusion height I toward the back surface 4b of the board.

その後、更にプリント基板4が再度の半田デイツプ工程
に付され、上記部品at bl  c・・・のリード端
子の半田付は箇所に半田盛付けがなされこれら部品の半
田付は固定が完了する。このとき同時に、第4図(e)
に示す如く、端子体3の基板裏面4bへの突出部基端に
も半田盛付けが行われるとともに、その半田Aが部材2
の先端部内に入り込み部材2と端子体3間の半田付は接
合がなされる。これにより、チェック端子1が基板裏面
4bから所定高さ!だけ突出した状態でプリント基板4
に半田付は固定される。
Thereafter, the printed circuit board 4 is subjected to another soldering dip process, and the lead terminals of the components at bl c . At this time, at the same time, Fig. 4(e)
As shown in the figure, solder is applied to the base end of the protrusion of the terminal body 3 on the back surface 4b of the board, and the solder A is applied to the member 2.
The soldering between the member 2 and the terminal body 3 is performed by entering the tip of the member 2 and the terminal body 3. This allows the check terminal 1 to be at a predetermined height from the back surface 4b of the board! Printed circuit board 4 with only
The soldering is fixed.

したがって、その後、プリント基板4に形成した回路の
点検、調整等にあたり、このチェック端子1にオッシロ
スコープのプローブ、あるいはワニグチグリップなどを
接続すれば、その波形の観測や電圧の測定等がプリント
基板の裏面側から極めて容易に行える。
Therefore, when inspecting or adjusting the circuit formed on the printed circuit board 4, if you connect an oscilloscope probe or alligator grip to the check terminal 1, you can observe the waveform or measure the voltage on the back side of the printed circuit board. It can be done very easily from the side.

以上説明した通り、この発明によれば、該種チェック端
子をプリント基板の裏面側に設ける場合の取付けが、部
品実装と同時に行えるため、従来のような手作業により
後付けするものに比べてその取付が容易簡単であり効率
よく行える。尚、上記実施例においては、プリント基板
の1個所にのみチェック端子が設けられるように説明し
たが、これに限らず、回路の種類等に応じてその数を適
宜増減変更できることは勿論である。
As explained above, according to the present invention, when the type check terminal is provided on the back side of the printed circuit board, it can be installed at the same time as component mounting. It is easy to do and can be done efficiently. In the above embodiment, the check terminal is provided at only one location on the printed circuit board, but the check terminal is not limited to this, and it goes without saying that the number can be increased or decreased as appropriate depending on the type of circuit, etc.

【図面の簡単な説明】[Brief explanation of drawings]

第1図、第2図は本発明に係るチェック端子の一例を示
す斜視図、第3図は本発明が適用されるプリント基板の
斜視図、第4図(a)〜(e)は同プリント基板の裏面
にチェック端子を設ける場合の取付工程を説明する図で
ある。 2舎・・部材、 3・・命端子体、 10O・チェック端子、 4・・・プリント基板、 θ・・・取付孔、 2c・・・底面(他端部)、 3c・・φ先端(部)、 4b・・・基板裏面、 l・・・(端子体の)突出高さ。 特許出願人  日本電気ホームエレクトロニクス第1図 第2図 第3図
1 and 2 are perspective views showing an example of a check terminal according to the present invention, FIG. 3 is a perspective view of a printed circuit board to which the present invention is applied, and FIGS. It is a figure explaining the attachment process when providing a check terminal on the back surface of a board|substrate. 2...Materials, 3...Life terminal body, 10O...Check terminal, 4...Printed circuit board, θ...Mounting hole, 2c...Bottom (other end), 3c...φ tip (part) ), 4b...back side of the board, l...projection height (of the terminal body). Patent applicant: NEC Home Electronics Figure 1 Figure 2 Figure 3

Claims (1)

【特許請求の範囲】[Claims] (1)一端が開口し他端が閉塞する筒状の部材と、この
部材に遊嵌される軸状の端子体とからなるチェック端子
において、前記筒状部材をプリント基板の取付孔に挿入
し半田付け固定した後、前記プリント基板に実装される
他部品のリード端子カッティング時に前記部材の他端部
を切断開口し、前記端子体の先端をこの開口から基板裏
面側に所定高さで突出せしめ、この突出状態で半田ディ
ップすることを特徴とするチェック端子の取付け方法。
(1) In a check terminal consisting of a cylindrical member with one end open and the other end closed, and a shaft-shaped terminal body loosely fitted into this member, the cylindrical member is inserted into a mounting hole of a printed circuit board. After soldering and fixing, when cutting lead terminals of other components to be mounted on the printed circuit board, the other end of the member is cut and opened, and the tip of the terminal body is made to protrude from this opening at a predetermined height to the back side of the board. , a check terminal installation method characterized by solder dipping in this protruding state.
JP60288882A 1985-12-21 1985-12-21 Mounting of check terminal Granted JPS61234094A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60288882A JPS61234094A (en) 1985-12-21 1985-12-21 Mounting of check terminal

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60288882A JPS61234094A (en) 1985-12-21 1985-12-21 Mounting of check terminal

Publications (2)

Publication Number Publication Date
JPS61234094A true JPS61234094A (en) 1986-10-18
JPS6210040B2 JPS6210040B2 (en) 1987-03-04

Family

ID=17735987

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60288882A Granted JPS61234094A (en) 1985-12-21 1985-12-21 Mounting of check terminal

Country Status (1)

Country Link
JP (1) JPS61234094A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6332997A (en) * 1986-07-28 1988-02-12 エスエムケイ株式会社 Method of soldering parts on printed board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6332997A (en) * 1986-07-28 1988-02-12 エスエムケイ株式会社 Method of soldering parts on printed board

Also Published As

Publication number Publication date
JPS6210040B2 (en) 1987-03-04

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