JPS6123310A - Capacitor - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] [Technical field of invention] The present invention relates to a capacitor having a novel configuration.

[Problems such as the technical background of the invention] In general, film conductor 1 is made by laminating and winding a pair of metallized plastic films. Metallicon electrodes are formed on both end faces after flattening the metallized plastic film by pressing. External terminals are led out from the capacitor element, and then an exterior is applied to the capacitor element, or the capacitor element is made by sequentially laminating metal foil and plastic film and being wound. After flattening the capacitor element with a press, external terminals are formed from electrodes formed on both end faces. The terminals were led out and then the exterior was applied. However, since the capacitor element of these capacitors is flattened by pressing, it tends to deform when exposed to high temperatures and cause deterioration of electrical characteristics. [It was not suitable for 4 dip condensations that had to be played.

Therefore, in order to provide heat resistance, it is possible to use a sandwich structure in which, for example, aluminum foil is coated with a film and metal is vapor-deposited on top, but the capacity is small compared to the volume, and there is a strong preference for compactness and high performance. It could not necessarily be said that it could meet recent market demands.

[Object of the Invention] The present invention has been made in view of the above points, and an object of the present invention is to provide a capacitor that is small, has a large capacity, has excellent heat resistance characteristics, and can be easily made into a chip.

Summary of the Invention] The capacitor of the present invention is characterized in that a dielectric layer is formed on the surface of the skeleton of a foamed metal, a conductive layer is formed on the dielectric layer, and the foamed metal conductive layer is used as an electrode. It is something.

[Embodiments of the Invention] Examples of the present invention will be described below with reference to the drawings. That is, continuous ventilation holes (1
) on the skeletal surface (3) of a foam metal (2) made of aluminum, copper, nickel, iron, zinc or an alloy thereof, excluding a part of the skeletal surface (3),
For example, polysulfone.

Polycarbonate-1, polybutadiene, polyimide.

Synthetic resins such as epoxy, or acebruzel resin,
Acedel cell [] - To the subbrae 1, ethylene cellulose, 21 Hero cell 1] - Zubbrae 1 which cell number - consisting of ゛ etc.] - Tengu material] - Temper, and the skeleton surface (3
), a dielectric layer (4) is formed on the dielectric layer (4), a conductive layer (5) is formed by plating a metal such as silver, copper, or nickel, and the foam metal (2) and the conductive layer are plated on the dielectric layer (4). (5) are used as electrodes, and lead terminals (not shown) are led out from each of the electrodes, and an exterior (not shown) is provided.

If the dielectric layer (4) is present in the continuous ventilation hole (1), the surface area will increase compared to the Linderch structure described above. It is possible to manufacture a capacitor of any shape by arbitrarily setting the shape of the foam metal.For example, as shown in Fig. A lead frame (6) is attached to the conductive layer (5) formed on the surface of the dielectric layer (4), and the lead frame (6) is directly attached to the printed circuit board (
(not shown) can be easily made into a chip by simply attaching it (not shown).In the figure (1)
) is the exterior. In the above embodiment, the method for attaching the lead frame is performed after forming the dielectric layer and the IJ conductive layer, but as shown in FIG. (9
), then a dielectric layer (10) is formed on the entire surface, and an S-electric layer (
11), and the other lead frame (12) may be attached to the conductive m (11).

Next, a specific experimental example will be described. In other words, aluminum foam metal with a thickness of 3 mm and a porosity of 70% is 3 mm wide.
Cut it into 6mm long pieces and dip into a solution of 10% polysulfone dissolved in a mixed solvent of methylene chloride and acetone (1 gl 1 tL), leaving only the top 1 mm [2μ thick polysulfone layer]. A silver layer is applied on the polysulfone layer, a lead frame is welded to the exposed portion of the foamed metal and the silver plating layer, and then an epoxy resin exterior is applied using a 1-transfer mold, and the lead frame is The present invention (A), which is a 50 V, DC-0,002-2 μF chip capacitor made by bending the frame along the exterior side and bottom surfaces, and a pair of metalized polysulfone films are laminated, rolled, pressed, and flattened. Same as the present invention (A) using a capacitor element <50V,
The results of comparing the quality characteristics (with the conventional example (B), which was a chip film capacitor of DC-0,0022 μF) and examining the variation in characteristics by heat resistance tests, are shown in FIGS. 5 to 8. The heat resistance condition was to leave it in a constant temperature bath at 250℃, and each test sample (A) and (B) had a temperature of 20℃.
The numerical values in FIGS. 5 to 8 are average values, and tan δ (%)' in FIG. 6 is based on the frequency below 1KH7.

As is clear from FIGS. 5 to 8, the present invention (A>) is superior in all properties compared to the conventional example (1'3), and the heat resistance properties of the present invention are fully exhibited. Indicated.

Also, using an aluminum foam metal of the same size as in the above experimental example, dissolve polycarbonate in methylene chloride to a concentration of 10%! A 1.5 μm polycarbonate layer was formed on the solution by dipping in the same manner as in the above experimental example.
A copper and nickel plating layer is applied on the polycarbonate layer, lead wires are provided on the exposed portion of the foamed metal and the plating layer, respectively, and a T-boxy resin burp exterior is applied.
As a result of conducting the same test as in the above experimental example with a condensation amount of 0V and DC-0,00311F for two months, each characteristic showed the same tendency as the present invention (Δ) in the above experimental example (), and it had excellent heat resistance. The characteristics have been demonstrated.

[Effects of the Invention] According to the present invention, a dielectric layer is formed on the skeletal surface of a foamed metal, a conductive layer is formed on the dielectric layer, and the conductive layer and the foamed metal are used as opposing electrodes. It is small in size, has a large capacity, and has excellent heat resistance characteristics.Furthermore, it is possible to obtain a capacitor of any shape by arbitrarily setting the shape of the foamed metal.

[Brief explanation of drawings]

FIG. 1 and FIG. 2 show one embodiment of the present invention. FIG. 1 is a sectional view showing a condenser element, FIG. 4 is a sectional view showing an example of a capacitor according to another embodiment of the present invention, FIG. 5 is a temperature-capacitance change rate characteristic curve, and FIG. 6 is a temperature-t: a, nδ characteristic curve diagram, 7th
The figure is a time-capacity change rate characteristic curve diagram, and Figure 8 shows time-1:
It is a nδ characteristic curve diagram. (1)...Continuous ventilation hole (2)(8)...
...Metal foam (3) ...Skeletal surface (4) (
10)...Dielectric layer (5) (11)...
・Conductive layer property Permanent application Marcon Electronics Co., Ltd. nu w body νi + (#) (%n evening uτ1 唖 へ + 0 − C'4 η center - body 2 薙(蓼) (%)J)"Lft)' :J

Claims (4)

[Claims] (1) Comprising a foamed metal having an arbitrary shape and continuous ventilation holes, a dielectric layer made of synthetic resin or cellulose formed on the skeletal surface of the foamed metal, and a conductive layer formed on the dielectric layer. A capacitor characterized in that the conductive layer and the foamed metal serve as opposing electrodes. (2) The capacitor according to claim (1), wherein the foamed metal is made of aluminum, copper, nickel, iron, zinc, or an alloy thereof. (3) Claims (1) or (2) characterized in that the synthetic resin is made of polysulfone, polycarbonate, polybutadiene, polyimide, epoxy, etc.
Capacitors listed in section. (4) Claim No. 1, characterized in that the cellulose consists of acetyl cellulose, acetyl cellulose butyrate, ethylene cellulose, nitrocellulose, etc.
The capacitor described in item 1) or item (2).